JPS6027115A - 光照射炉による半導体ウエハ−の熱処理法 - Google Patents
光照射炉による半導体ウエハ−の熱処理法Info
- Publication number
- JPS6027115A JPS6027115A JP13436983A JP13436983A JPS6027115A JP S6027115 A JPS6027115 A JP S6027115A JP 13436983 A JP13436983 A JP 13436983A JP 13436983 A JP13436983 A JP 13436983A JP S6027115 A JPS6027115 A JP S6027115A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- circumference
- heat treatment
- light irradiation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13436983A JPS6027115A (ja) | 1983-07-25 | 1983-07-25 | 光照射炉による半導体ウエハ−の熱処理法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13436983A JPS6027115A (ja) | 1983-07-25 | 1983-07-25 | 光照射炉による半導体ウエハ−の熱処理法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6027115A true JPS6027115A (ja) | 1985-02-12 |
| JPH025295B2 JPH025295B2 (enrdf_load_stackoverflow) | 1990-02-01 |
Family
ID=15126764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13436983A Granted JPS6027115A (ja) | 1983-07-25 | 1983-07-25 | 光照射炉による半導体ウエハ−の熱処理法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027115A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02159720A (ja) * | 1988-12-14 | 1990-06-19 | Nec Corp | 半導体装置の熱処理方法 |
| WO1997033306A1 (fr) * | 1996-03-07 | 1997-09-12 | Shin-Etsu Handotai Co., Ltd. | Procede de traitement thermique et substrat a semi-conducteur monocristal |
| JP2006179837A (ja) * | 2004-12-24 | 2006-07-06 | Fujitsu Ltd | 半導体装置の製造方法、ウェハおよびウェハの製造方法 |
| JP2014120664A (ja) * | 2012-12-18 | 2014-06-30 | Dainippon Screen Mfg Co Ltd | 剥離補助方法および剥離補助装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169125A (ja) * | 1983-03-16 | 1984-09-25 | Ushio Inc | 半導体ウエハ−の加熱方法 |
-
1983
- 1983-07-25 JP JP13436983A patent/JPS6027115A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169125A (ja) * | 1983-03-16 | 1984-09-25 | Ushio Inc | 半導体ウエハ−の加熱方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02159720A (ja) * | 1988-12-14 | 1990-06-19 | Nec Corp | 半導体装置の熱処理方法 |
| WO1997033306A1 (fr) * | 1996-03-07 | 1997-09-12 | Shin-Etsu Handotai Co., Ltd. | Procede de traitement thermique et substrat a semi-conducteur monocristal |
| US5913974A (en) * | 1996-03-07 | 1999-06-22 | Shin-Etsu Handotai Co., Ltd. | Heat treating method of a semiconductor single crystal substrate |
| JP2006179837A (ja) * | 2004-12-24 | 2006-07-06 | Fujitsu Ltd | 半導体装置の製造方法、ウェハおよびウェハの製造方法 |
| JP2014120664A (ja) * | 2012-12-18 | 2014-06-30 | Dainippon Screen Mfg Co Ltd | 剥離補助方法および剥離補助装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025295B2 (enrdf_load_stackoverflow) | 1990-02-01 |
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