JPS6025909Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6025909Y2
JPS6025909Y2 JP1976021464U JP2146476U JPS6025909Y2 JP S6025909 Y2 JPS6025909 Y2 JP S6025909Y2 JP 1976021464 U JP1976021464 U JP 1976021464U JP 2146476 U JP2146476 U JP 2146476U JP S6025909 Y2 JPS6025909 Y2 JP S6025909Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
hole
film
polyimide film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976021464U
Other languages
English (en)
Japanese (ja)
Other versions
JPS52113768U (https=
Inventor
光雄 松浪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1976021464U priority Critical patent/JPS6025909Y2/ja
Publication of JPS52113768U publication Critical patent/JPS52113768U/ja
Application granted granted Critical
Publication of JPS6025909Y2 publication Critical patent/JPS6025909Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1976021464U 1976-02-24 1976-02-24 半導体装置 Expired JPS6025909Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976021464U JPS6025909Y2 (ja) 1976-02-24 1976-02-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976021464U JPS6025909Y2 (ja) 1976-02-24 1976-02-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS52113768U JPS52113768U (https=) 1977-08-29
JPS6025909Y2 true JPS6025909Y2 (ja) 1985-08-03

Family

ID=28481440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976021464U Expired JPS6025909Y2 (ja) 1976-02-24 1976-02-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS6025909Y2 (https=)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Also Published As

Publication number Publication date
JPS52113768U (https=) 1977-08-29

Similar Documents

Publication Publication Date Title
JP5882390B2 (ja) チップ／基板アセンブリを形成する方法
US6483187B1 (en) Heat-spread substrate
JPS6025909Y2 (ja) 半導体装置
JP3093800U (ja) 電子ユニット
JPS614456U (ja) プラグインパツケ−ジ基板
JP3207266B2 (ja) 回路部品搭載用端子を備えた回路配線基板の製造法
JP5069387B2 (ja) 集積回路パッケージ
JPH10154766A (ja) 半導体パッケージの製造方法及び半導体パッケージ
JPH1079402A (ja) 半導体パッケージ
JPS6232550U (https=)
JPS63167733U (https=)
JPS5831420Y2 (ja) 半導体装置
JPH0448661U (https=)
JPS63182570U (https=)
JPH0313773U (https=)
JPS63182571U (https=)
JPS62140771U (https=)
JPS6079771U (ja) 多層配線基板
JPH08186194A (ja) チップキャリア
JPH0379469U (https=)
JPH024275U (https=)
JPH0992678A (ja) Ｉｃパッケージとその製造方法
JPS587337U (ja) 混成集積回路装置
JP2003309353A (ja) 電子回路ユニット
JPS61173157U (https=)