JPS60257532A - Heater-block for semiconductor die-bonder - Google Patents

Abstract

PURPOSE:To improve adhesion between a heater-block and an island of a lead frame by installing a vacuum attracting aperture on the surface of the heat- block which makes a lead frame and island to adhere with each other. CONSTITUTION:In order to make an island 4a of a lead frame 4 to adhere with a heater-block 5, the island 4a of the lead frame 4 is placed on an adhered surface 5a of the heater-block 5, and a vacuum attracting aperture 6 is evacuated by vacuum source, then the vacuum pressure thereof is acted to the island 4a and is adhered to the adhered surface 5a. Thereafter, a semiconductor element 3 is die-bonded on the island 4a of the lead frame 4. Accordingly, it is possible that the island 4a is adhered surely to the heater-block 5, even through the lead frame 4 is a packaged small item.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heater block used in a semiconductor die bonder.

[Prior art and its problems]

When the semiconductor element 3 is mounted on the island (element fixing part) 4a of the lead frame 4, it is necessary to bring the island of the lead frame into close contact with the heater block.

An example of the conventional adhesion method is shown in FIGS. 2(a) and 2(b).

As shown in FIGS. 2(a) and 2(b), conventionally, two ends of the island 4a of the lead frame 4 are held down by pressers 1 and 1.
Generally, the island 4a was brought into close contact with the upper surface of the heater block 5 using a heater block. At this time, presser foot 1.
1 is wider than the sum of the width dimension A of the semiconductor adsorption collet 2 and the scrub dimension by the collet 2 (amplitude dimension when rubbing the element 3 against the island 4a), and is wider than the island stepped portion 4b of the lead frame 4. , 4b must be narrower than the length C between them.

However, as packages have recently become smaller, the DP of the lead frame 4 has come closer to the position of the island 4a, making it impossible to hold it under the above conditions. B is the width dimension of the semiconductor element 3.

When the lead frame 4 is pressed at a wider outer position in terms of DP dimension using the pressers 1, 1, the step portions 4b, 4b of the island 4a are pressed as shown in FIG.
The island 4a bends upward using the lead frame 4 as a fulcrum, and the island 4a of the lead frame 4 separates from the contact surface 5a of the heater block 5, resulting in extremely poor marant properties.

[Purpose of the invention]

The present invention solves the above-mentioned problems, and provides an apparatus that can cope with die bonding that accompanies miniaturization of packages by increasing the adhesion between the heater block and the island of the lead frame.

[Structure of the invention]

That is, the present invention provides a semiconductor bonder for die-bonding a semiconductor element to an island of a lead frame that is brought into close contact with a heater block, in which a vacuum suction opening is provided on the surface of the heater block that brings the lead frame island into close contact with the island. This is a heater block for semiconductor die bonders featuring the following.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1(a), in the present invention, an opening 6 is formed in the adhesion surface 5a of a heater block 5 to which the island 4a of the lead frame 4 is brought into close contact with the island 4a of the lead frame 4 by vacuum suction.

In the present invention, in order to bring the island 4a of the lead frame 4 into close contact with the heater block 5, the island 4a of the lead frame 4 must be brought into close contact with the contact surface 5a of the heater block 5.
Next, the vacuum suction opening 6 is evacuated by a vacuum source (not shown), and the vacuum pressure is applied to the island 4a to bring it into close contact with the contact surface 5a. Thereafter, the semiconductor element 3 is die-bonded onto the island 4a of the lead frame 4 by a method similar to the conventional method.
Even with the lead frame 4 of the small package shown in b), it is possible to reliably bring the island 4a into close contact with the heater block 5. Since the island is fixed to the heater block using vacuum suction, there is no need to press the lead frame with a presser mechanism like in the past, and the lead frame can be deformed even in the case of small packages. This has the effect that the island can be brought into close contact with the heater block without any damage, and that a small piece of the socket cage can be die-bonded to the island of the lead frame without degrading quality.

[Brief explanation of drawings]

FIG. 1(a) is a sectional view showing an embodiment of the present invention, FIG. 1(b) is a plan view of a lead frame of a small package product,
Figure 2(a) is a sectional view showing an example of a conventional device;
b) is a plan view of the lead frame, and FIG. 3 is a sectional view showing die bonding of a small package product using a conventional device. 5... Heater block, 5a... Close contact surface, 6...
・Vacuum suction opening patent applicant Kyushu NEC Co., Ltd. Figure 1 (Q) (b) Figure 2 (Q)

Claims (1)

[Claims] (1) A semiconductor die bonder for die-bonding a semiconductor element to an island of a lead frame brought into close contact with a heater block, characterized in that a vacuum suction opening is provided on the surface of the heater block to which the lead frame island is brought into close contact. Heater block for semiconductor die bonder.