JPS60252308A - 電気及び光学回路素子基板 - Google Patents

電気及び光学回路素子基板

Info

Publication number
JPS60252308A
JPS60252308A JP59108379A JP10837984A JPS60252308A JP S60252308 A JPS60252308 A JP S60252308A JP 59108379 A JP59108379 A JP 59108379A JP 10837984 A JP10837984 A JP 10837984A JP S60252308 A JPS60252308 A JP S60252308A
Authority
JP
Japan
Prior art keywords
substrate
optical
waveguide
electrical
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59108379A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0336405B2 (cg-RX-API-DMAC7.html
Inventor
Takanobu Noro
野呂 孝信
Seiichi Onoda
誠一 斧田
Yasumasa Koakutsu
小圷 泰正
Hideo Arima
有馬 英夫
Ataru Yokono
中 横野
Minoru Tanaka
稔 田中
Akizo Toda
尭三 戸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59108379A priority Critical patent/JPS60252308A/ja
Priority to EP19850902653 priority patent/EP0182920A4/en
Priority to PCT/JP1985/000296 priority patent/WO1985005698A1/ja
Publication of JPS60252308A publication Critical patent/JPS60252308A/ja
Publication of JPH0336405B2 publication Critical patent/JPH0336405B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4202Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Optical Integrated Circuits (AREA)
JP59108379A 1984-05-30 1984-05-30 電気及び光学回路素子基板 Granted JPS60252308A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59108379A JPS60252308A (ja) 1984-05-30 1984-05-30 電気及び光学回路素子基板
EP19850902653 EP0182920A4 (en) 1984-05-30 1985-05-29 Substrate mounting optical transmission module.
PCT/JP1985/000296 WO1985005698A1 (fr) 1984-05-30 1985-05-29 Substrat de montage de module de transmission optique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59108379A JPS60252308A (ja) 1984-05-30 1984-05-30 電気及び光学回路素子基板

Publications (2)

Publication Number Publication Date
JPS60252308A true JPS60252308A (ja) 1985-12-13
JPH0336405B2 JPH0336405B2 (cg-RX-API-DMAC7.html) 1991-05-31

Family

ID=14483275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59108379A Granted JPS60252308A (ja) 1984-05-30 1984-05-30 電気及び光学回路素子基板

Country Status (3)

Country Link
EP (1) EP0182920A4 (cg-RX-API-DMAC7.html)
JP (1) JPS60252308A (cg-RX-API-DMAC7.html)
WO (1) WO1985005698A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105428504A (zh) * 2015-12-23 2016-03-23 陕西华经微电子股份有限公司 一种led光源封装用厚膜陶瓷支架的制备方法
CN107422429A (zh) * 2017-06-27 2017-12-01 江苏长电科技股份有限公司 光电收发功能一体的SiP封装结构及其工艺方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006061722B4 (de) 2006-12-28 2010-04-01 Infineon Technologies Ag Anschlussmodul und Verfahren zum Herstellen desselben
CN117310896A (zh) * 2022-06-22 2023-12-29 华为技术有限公司 一种光器件、光通信设备及光交换系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126873U (cg-RX-API-DMAC7.html) * 1980-02-27 1981-09-26
JPS60182780A (ja) * 1984-02-29 1985-09-18 Fujitsu Ltd 光部品の構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3624462A (en) * 1969-07-03 1971-11-30 Fairchild Camera Instr Co Face-bonded photoarray package
FR2322382A1 (fr) * 1975-08-29 1977-03-25 Radiotechnique Compelec Conduit optique
US4070516A (en) * 1976-10-18 1978-01-24 International Business Machines Corporation Multilayer module having optical channels therein
JPS54100745A (en) * 1978-01-25 1979-08-08 Oki Electric Ind Co Ltd Optical fiber connector
JPS58206177A (ja) * 1982-05-26 1983-12-01 Sumitomo Electric Ind Ltd 光リンク受信回路
JPS5922407U (ja) * 1982-08-02 1984-02-10 オムロン株式会社 光伝送装置
JPS5977402A (ja) * 1982-10-26 1984-05-02 Toshiba Corp 光リンク

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126873U (cg-RX-API-DMAC7.html) * 1980-02-27 1981-09-26
JPS60182780A (ja) * 1984-02-29 1985-09-18 Fujitsu Ltd 光部品の構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105428504A (zh) * 2015-12-23 2016-03-23 陕西华经微电子股份有限公司 一种led光源封装用厚膜陶瓷支架的制备方法
CN105428504B (zh) * 2015-12-23 2017-12-29 陕西华经微电子股份有限公司 一种led光源封装用厚膜陶瓷支架的制备方法
CN107422429A (zh) * 2017-06-27 2017-12-01 江苏长电科技股份有限公司 光电收发功能一体的SiP封装结构及其工艺方法

Also Published As

Publication number Publication date
JPH0336405B2 (cg-RX-API-DMAC7.html) 1991-05-31
WO1985005698A1 (fr) 1985-12-19
EP0182920A4 (en) 1987-06-16
EP0182920A1 (en) 1986-06-04

Similar Documents

Publication Publication Date Title
US5432878A (en) Silicon carrier for testing and alignment of optoelectronic devices and method of assembling same
US5448826A (en) Method of making ceramic microwave electronic package
EP0608566B1 (en) Opitcal component mounting substrate with ridge waveguide and grooves and method of producing the same
US3597658A (en) High current semiconductor device employing a zinc-coated aluminum substrate
JPH06324227A (ja) 光電結合装置およびその製造方法
CN1318867C (zh) 玻璃粘接纤维束及其制造方法
EP0331436B1 (en) Optical communication apparatus
WO1989008374A1 (fr) Support de montage de composants optiques et de composants de circuits electriques et procede de production
US5161049A (en) Optical isolator and method for preparing same
WO2018139218A1 (ja) 光結合装置
JPS60252308A (ja) 電気及び光学回路素子基板
JP2001007463A (ja) 光電気混載基板およびその製造方法
WO1985001724A1 (en) Aluminium oxide glass composition and magnetic head incorporating same
TW201944668A (zh) 用於連接波導件和板件的連接器
JPS6180207A (ja) 電気及び光学回路素子基板
JP2922375B2 (ja) セラミック・オン金属回路基板およびその製造方法
JP2002232054A (ja) 光モジュールの実装構造
US20020114580A1 (en) Optical device
JP3447364B2 (ja) 光回路部品およびその製造方法
JPS61245594A (ja) 光−電気混成集積回路基板
JP2001083346A (ja) 電気光混載配線板及び電気光混載モジュール並びにその製造方法
JPS63167308A (ja) 光分岐結合器の作製方法
JPH0427904A (ja) 光表面実装回路用基板の製造方法
CN222299834U (zh) 一种mt插芯及接头
JP2007271674A (ja) 光デバイス