JPS6025158U - 合成樹脂モ−ルド成型用模擬フレ−ム - Google Patents

合成樹脂モ−ルド成型用模擬フレ−ム

Info

Publication number
JPS6025158U
JPS6025158U JP1983115991U JP11599183U JPS6025158U JP S6025158 U JPS6025158 U JP S6025158U JP 1983115991 U JP1983115991 U JP 1983115991U JP 11599183 U JP11599183 U JP 11599183U JP S6025158 U JPS6025158 U JP S6025158U
Authority
JP
Japan
Prior art keywords
synthetic resin
resin molding
frame
simulation frame
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983115991U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0126110Y2 (enExample
Inventor
湯浅 敬昭
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP1983115991U priority Critical patent/JPS6025158U/ja
Publication of JPS6025158U publication Critical patent/JPS6025158U/ja
Application granted granted Critical
Publication of JPH0126110Y2 publication Critical patent/JPH0126110Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1983115991U 1983-07-25 1983-07-25 合成樹脂モ−ルド成型用模擬フレ−ム Granted JPS6025158U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983115991U JPS6025158U (ja) 1983-07-25 1983-07-25 合成樹脂モ−ルド成型用模擬フレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983115991U JPS6025158U (ja) 1983-07-25 1983-07-25 合成樹脂モ−ルド成型用模擬フレ−ム

Publications (2)

Publication Number Publication Date
JPS6025158U true JPS6025158U (ja) 1985-02-20
JPH0126110Y2 JPH0126110Y2 (enExample) 1989-08-04

Family

ID=30267563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983115991U Granted JPS6025158U (ja) 1983-07-25 1983-07-25 合成樹脂モ−ルド成型用模擬フレ−ム

Country Status (1)

Country Link
JP (1) JPS6025158U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117222A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd ダミ−リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117222A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd ダミ−リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH0126110Y2 (enExample) 1989-08-04

Similar Documents

Publication Publication Date Title
JPS5860421U (ja) 射出成形用金型
JPS6025158U (ja) 合成樹脂モ−ルド成型用模擬フレ−ム
JPS58440U (ja) プラスチツクパツケ−ジ
JPS5839812U (ja) 樹脂封入成形用金型装置
JPS6062927U (ja) 樹脂成形金型
JPS59194914U (ja) 樹脂成形用割金型
JPS60187020U (ja) 射出成形金型用スプル−
JPS583035U (ja) 樹脂モ−ルド用の型
JPS5815029U (ja) 多色成形品
JPS6052055U (ja) 成形金型用ノックアウトピン
JPS6113952U (ja) 半導体装置用リ−ドフレ−ム
JPS6098621U (ja) 射出成形における真空金型装置
JPS58441U (ja) プラスチツクパツケ−ジ
JPS5961922U (ja) 射出成形用金型
JPS5886325U (ja) 成形金型構造
JPS6130255U (ja) リ−ドフレ−ム
JPS599537U (ja) 半導体装置の樹脂モ−ルド装置
JPS589269U (ja) 成形用金型
JPS58122444U (ja) 半導体樹脂封止装置の金型
JPS592528U (ja) 樹脂押出成形用ダイ
JPS6069610U (ja) モ−ルド金型
JPS5844841U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPS59120122U (ja) 成形金型
JPS60175612U (ja) 樹脂モ−ルド装置
JPS58106941U (ja) トランスフア−成形装置