JPS60247992A - 集積回路チツプ実装基板 - Google Patents

集積回路チツプ実装基板

Info

Publication number
JPS60247992A
JPS60247992A JP10253984A JP10253984A JPS60247992A JP S60247992 A JPS60247992 A JP S60247992A JP 10253984 A JP10253984 A JP 10253984A JP 10253984 A JP10253984 A JP 10253984A JP S60247992 A JPS60247992 A JP S60247992A
Authority
JP
Japan
Prior art keywords
integrated circuit
power supply
circuit chip
board
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10253984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0578956B2 (enExample
Inventor
中西　敬一郎
雅一 山本
広田　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10253984A priority Critical patent/JPS60247992A/ja
Publication of JPS60247992A publication Critical patent/JPS60247992A/ja
Publication of JPH0578956B2 publication Critical patent/JPH0578956B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP10253984A 1984-05-23 1984-05-23 集積回路チツプ実装基板 Granted JPS60247992A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10253984A JPS60247992A (ja) 1984-05-23 1984-05-23 集積回路チツプ実装基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10253984A JPS60247992A (ja) 1984-05-23 1984-05-23 集積回路チツプ実装基板

Publications (2)

Publication Number Publication Date
JPS60247992A true JPS60247992A (ja) 1985-12-07
JPH0578956B2 JPH0578956B2 (enExample) 1993-10-29

Family

ID=14330067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10253984A Granted JPS60247992A (ja) 1984-05-23 1984-05-23 集積回路チツプ実装基板

Country Status (1)

Country Link
JP (1) JPS60247992A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214696A (ja) * 1986-03-15 1987-09-21 松下電工株式会社 プリント配線板およびその製造方法
JPS6395278U (enExample) * 1986-12-11 1988-06-20
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
JPH02232992A (ja) * 1989-03-06 1990-09-14 Nippon Telegr & Teleph Corp <Ntt> 電子回路モジュール
JPH05175659A (ja) * 1991-12-24 1993-07-13 Hitachi Ltd 多層薄膜配線基板、該基板を用いたモジュール
JPH0982857A (ja) * 1995-09-18 1997-03-28 Nec Corp マルチチップパッケージ構造

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214696A (ja) * 1986-03-15 1987-09-21 松下電工株式会社 プリント配線板およびその製造方法
JPS6395278U (enExample) * 1986-12-11 1988-06-20
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
JPH02232992A (ja) * 1989-03-06 1990-09-14 Nippon Telegr & Teleph Corp <Ntt> 電子回路モジュール
JPH05175659A (ja) * 1991-12-24 1993-07-13 Hitachi Ltd 多層薄膜配線基板、該基板を用いたモジュール
JPH0982857A (ja) * 1995-09-18 1997-03-28 Nec Corp マルチチップパッケージ構造

Also Published As

Publication number Publication date
JPH0578956B2 (enExample) 1993-10-29

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