JPS60247936A - 熱処理方法 - Google Patents
熱処理方法Info
- Publication number
- JPS60247936A JPS60247936A JP10557184A JP10557184A JPS60247936A JP S60247936 A JPS60247936 A JP S60247936A JP 10557184 A JP10557184 A JP 10557184A JP 10557184 A JP10557184 A JP 10557184A JP S60247936 A JPS60247936 A JP S60247936A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- treated
- heat treatment
- heating furnace
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000003860 storage Methods 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000000137 annealing Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 105
- 230000000694 effects Effects 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- PXUQTDZNOHRWLI-OXUVVOBNSA-O malvidin 3-O-beta-D-glucoside Chemical compound COC1=C(O)C(OC)=CC(C=2C(=CC=3C(O)=CC(O)=CC=3[O+]=2)O[C@H]2[C@@H]([C@@H](O)[C@H](O)[C@@H](CO)O2)O)=C1 PXUQTDZNOHRWLI-OXUVVOBNSA-O 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Landscapes
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557184A JPS60247936A (ja) | 1984-05-23 | 1984-05-23 | 熱処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557184A JPS60247936A (ja) | 1984-05-23 | 1984-05-23 | 熱処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60247936A true JPS60247936A (ja) | 1985-12-07 |
| JPH0543174B2 JPH0543174B2 (enrdf_load_stackoverflow) | 1993-06-30 |
Family
ID=14411206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10557184A Granted JPS60247936A (ja) | 1984-05-23 | 1984-05-23 | 熱処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60247936A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112011102676T5 (de) | 2010-08-09 | 2013-06-27 | Canon Anelva Corporation | Substratwärmebehandlungsgerät, Temperatursteuerungsverfahren für Substratwärmebehandlungsgerät, Herstellungsverfahren für Halbleitervorrichtung, Temperatursteuerprogramm für Substratwärmebehandlungsgerät und Aufzeichnungsträger |
| CN106340451A (zh) * | 2015-07-06 | 2017-01-18 | 株式会社思可林集团 | 热处理方法以及热处理装置 |
| JP2020068256A (ja) * | 2018-10-23 | 2020-04-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 熱処理方法および熱処理装置 |
-
1984
- 1984-05-23 JP JP10557184A patent/JPS60247936A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112011102676T5 (de) | 2010-08-09 | 2013-06-27 | Canon Anelva Corporation | Substratwärmebehandlungsgerät, Temperatursteuerungsverfahren für Substratwärmebehandlungsgerät, Herstellungsverfahren für Halbleitervorrichtung, Temperatursteuerprogramm für Substratwärmebehandlungsgerät und Aufzeichnungsträger |
| US8691676B2 (en) | 2010-08-09 | 2014-04-08 | Canon Anelva Corporation | Substrate heat treating apparatus, temperature control method of substrate heat treating apparatus, manufacturing method of semiconductor device, temperature control program of substrate heat treating apparatus, and recording medium |
| DE112011102676B4 (de) | 2010-08-09 | 2019-01-03 | Canon Anelva Corporation | Substratwärmebehandlungsgerät, Temperatursteuerungsverfahren für Substratwärmebehandlungsgerät, Herstellungsverfahren für Halbleitervorrichtung, Temperatursteuerprogramm für Substratwärmebehandlungsgerät und Aufzeichnungsträger |
| CN106340451A (zh) * | 2015-07-06 | 2017-01-18 | 株式会社思可林集团 | 热处理方法以及热处理装置 |
| JP2017017275A (ja) * | 2015-07-06 | 2017-01-19 | 株式会社Ｓｃｒｅｅｎホールディングス | 熱処理方法および熱処理装置 |
| US10347512B2 (en) | 2015-07-06 | 2019-07-09 | SCREEN Holdings Co., Ltd. | Method and apparatus for light-irradiation heat treatment |
| JP2020068256A (ja) * | 2018-10-23 | 2020-04-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 熱処理方法および熱処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543174B2 (enrdf_load_stackoverflow) | 1993-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7049553B2 (en) | Substrate processing apparatus and substrate processing method | |
| US7241633B2 (en) | Heat treatment apparatus and heat treatment method | |
| KR900000560B1 (ko) | 열처리 방법 | |
| JPS60247936A (ja) | 熱処理方法 | |
| US6780795B2 (en) | Heat treatment apparatus for preventing an initial temperature drop when consecutively processing a plurality of objects | |
| JPH0369111A (ja) | 熱処理方法及び熱処理装置 | |
| JP3795788B2 (ja) | 基板の熱処理方法 | |
| JPS5917253A (ja) | 半導体ウエハの熱処理方法 | |
| JP4146558B2 (ja) | 基板熱処理方法および基板熱処理装置 | |
| JP3628905B2 (ja) | 熱処理装置 | |
| JPS6252926A (ja) | 熱処理装置 | |
| JPS60137027A (ja) | 光照射加熱方法 | |
| JP4474918B2 (ja) | 制御装置 | |
| JPH0193121A (ja) | 半導体ウェハベーキング装置 | |
| JPH07201765A (ja) | 熱処理装置および熱処理方法 | |
| JP2729283B2 (ja) | ランプアニール炉の温度制御装置 | |
| JPH06260426A (ja) | ウエハの加熱方法及び装置 | |
| US20190001425A1 (en) | Heating apparatus and method for producing plate-like object | |
| JPH04250484A (ja) | 定着器の温度制御装置 | |
| JPS6392980A (ja) | 加熱定着装置の温度制御方法 | |
| JP2534385Y2 (ja) | 基板表面処理装置の温純水供給装置 | |
| JPH09260335A (ja) | 半導体製造用の高温薬液槽の加熱装置及びその方法 | |
| JPH0239525A (ja) | 半導体熱処理装置 | |
| Zöllner et al. | RTP—Temperature monitoring by means of oxidation | |
| JPH05160056A (ja) | 熱処理炉 |