JP2020068256A - 熱処理方法および熱処理装置 - Google Patents
熱処理方法および熱処理装置 Download PDFInfo
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- 238000012545 processing Methods 0.000 claims abstract description 205
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Automation & Control Theory (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Tunnel Furnaces (AREA)
Abstract
Description
4 ハロゲンランプハウス
5 フラッシュランプハウス
6 処理チャンバー
7 保持部
10 移載機構
31 計数部
32 判定部
33 入力部
34 表示部
35 磁気ディスク
65 熱処理空間
74 サセプタ
100 熱処理装置
101 インデクサ部
110 ロードポート
110a 第1ロードポート
110b 第2ロードポート
110c 第3ロードポート
120 受渡ロボット
130,140 冷却部
150 搬送ロボット
151a,151b 搬送ハンド
160 熱処理部
C キャリア
DC ダミーキャリア
DW ダミーウェハー
FL フラッシュランプ
HL ハロゲンランプ
W 半導体ウェハー
Claims (5)
- ダミーウェハーの熱処理を管理する熱処理方法であって、
ダミーウェハーに対する熱処理の回数の閾値である上限値および下限値を設定する設定工程と、
製品ウェハーの処理を行う前にダミーウェハーの熱処理を行うダミー処理工程と、
を備え、
製品ウェハーの処理開始準備が完了した時点でのダミーウェハーの熱処理回数が前記下限値未満であるときには前記熱処理回数が前記下限値に到達するまでダミーウェハーの熱処理を継続し、前記熱処理回数が前記下限値以上かつ前記上限値以下であるときにはダミーウェハーの熱処理を停止して製品ウェハーの処理を開始し、前記熱処理回数が前記上限値を超えているときには製品ウェハーの処理を中止することを特徴とする熱処理方法。 - 請求項1記載の熱処理方法において、
前記ダミー処理工程では、処理対象となる製品ウェハーの処理レシピに関連付けられたダミーレシピに従ってダミーウェハーの熱処理を実行することを特徴とする熱処理方法。 - ダミーウェハーの熱処理を管理する熱処理装置であって、
ダミーウェハーに熱処理を行う熱処理部と、
ダミーウェハーに対する熱処理の回数の閾値である上限値および下限値を設定する設定部と、
製品ウェハーの処理を行う前にダミーウェハーの熱処理を実行するとともに、製品ウェハーの処理開始準備が完了した時点での前記熱処理部におけるダミーウェハーの熱処理回数が前記下限値未満であるときには前記熱処理回数が前記下限値に到達するまでダミーウェハーの熱処理を継続し、前記熱処理回数が前記下限値以上かつ前記上限値以下であるときにはダミーウェハーの熱処理を停止して製品ウェハーの処理を開始し、前記熱処理回数が前記上限値を超えているときには製品ウェハーの処理を中止する制御部と、
を備えることを特徴とする熱処理装置。 - 請求項3記載の熱処理装置において、
処理対象となる製品ウェハーの処理レシピと、当該製品ウェハーの処理を行う前に熱処理を実行するダミーウェハーのダミーレシピとを関連付けて記憶する記憶部をさらに備えることを特徴とする熱処理装置。 - 請求項3または請求項4記載の熱処理装置において、
ダミーウェハーを収容したダミーキャリア専用のロードポートをさらに備えることを特徴とする熱処理装置。
Priority Applications (5)
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JP2018199050A JP7091222B2 (ja) | 2018-10-23 | 2018-10-23 | 熱処理方法および熱処理装置 |
TW108136816A TWI781350B (zh) | 2018-10-23 | 2019-10-14 | 熱處理方法及熱處理裝置 |
KR1020190128474A KR102225757B1 (ko) | 2018-10-23 | 2019-10-16 | 열처리 방법 및 열처리 장치 |
US16/655,665 US11049732B2 (en) | 2018-10-23 | 2019-10-17 | Heat treatment method and heat treatment apparatus that manage heat treatment of dummy wafer |
CN201910994487.2A CN111092016A (zh) | 2018-10-23 | 2019-10-18 | 热处理方法及热处理装置 |
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JP2018199050A JP7091222B2 (ja) | 2018-10-23 | 2018-10-23 | 熱処理方法および熱処理装置 |
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US (1) | US11049732B2 (ja) |
JP (1) | JP7091222B2 (ja) |
KR (1) | KR102225757B1 (ja) |
CN (1) | CN111092016A (ja) |
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JP7336369B2 (ja) * | 2019-11-25 | 2023-08-31 | 株式会社Screenホールディングス | 基板支持装置、熱処理装置、基板支持方法、熱処理方法 |
JP2022026758A (ja) | 2020-07-31 | 2022-02-10 | 株式会社Screenホールディングス | 熱処理方法 |
CN113097129B (zh) * | 2021-03-02 | 2022-05-06 | 长江存储科技有限责任公司 | 导电结构的制作方法、导电结构及机台设备 |
JP2022147779A (ja) * | 2021-03-23 | 2022-10-06 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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JP5463066B2 (ja) | 2009-04-30 | 2014-04-09 | 東京エレクトロン株式会社 | ロット処理開始判定方法及び制御装置 |
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JPS60247936A (ja) * | 1984-05-23 | 1985-12-07 | Dainippon Screen Mfg Co Ltd | 熱処理方法 |
JPH0837158A (ja) * | 1994-07-21 | 1996-02-06 | Dainippon Screen Mfg Co Ltd | 基板の熱処理方法及び熱処理装置 |
JPH1041239A (ja) * | 1996-07-22 | 1998-02-13 | Dainippon Screen Mfg Co Ltd | 基板処理方法 |
JP2000232108A (ja) * | 1999-02-12 | 2000-08-22 | Dainippon Screen Mfg Co Ltd | 基板加熱方法および基板加熱装置 |
JP2018148178A (ja) * | 2017-03-09 | 2018-09-20 | 株式会社Screenホールディングス | 熱処理方法 |
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JP7091222B2 (ja) | 2022-06-27 |
KR102225757B1 (ko) | 2021-03-09 |
TW202022948A (zh) | 2020-06-16 |
US20200126808A1 (en) | 2020-04-23 |
TWI781350B (zh) | 2022-10-21 |
KR20200045963A (ko) | 2020-05-06 |
CN111092016A (zh) | 2020-05-01 |
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