JPS60245783A - 無電解銅めつき浴 - Google Patents

無電解銅めつき浴

Info

Publication number
JPS60245783A
JPS60245783A JP340985A JP340985A JPS60245783A JP S60245783 A JPS60245783 A JP S60245783A JP 340985 A JP340985 A JP 340985A JP 340985 A JP340985 A JP 340985A JP S60245783 A JPS60245783 A JP S60245783A
Authority
JP
Japan
Prior art keywords
copper
plating bath
bath
plating
grams
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP340985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214430B2 (fr
Inventor
ウイリアム・ジヨセフ・アメリオ
ピーター・ジエラード・バートロツタ
ヴオヤ・マルコヴイツチ
ラルフ・エリオツト・パーソンズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS60245783A publication Critical patent/JPS60245783A/ja
Publication of JPH0214430B2 publication Critical patent/JPH0214430B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP340985A 1984-05-17 1985-01-14 無電解銅めつき浴 Granted JPS60245783A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61127884A 1984-05-17 1984-05-17
US611278 1984-05-17

Publications (2)

Publication Number Publication Date
JPS60245783A true JPS60245783A (ja) 1985-12-05
JPH0214430B2 JPH0214430B2 (fr) 1990-04-09

Family

ID=24448389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP340985A Granted JPS60245783A (ja) 1984-05-17 1985-01-14 無電解銅めつき浴

Country Status (3)

Country Link
EP (1) EP0164580B1 (fr)
JP (1) JPS60245783A (fr)
DE (1) DE3573139D1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
US4834796A (en) * 1986-11-06 1989-05-30 Nippondenso Co., Ltd. Electroless copper plating solution and process for electrolessly plating copper
WO2005038086A1 (fr) * 2003-10-17 2005-04-28 Nikko Materials Co., Ltd. Solution de placage pour cuivrage autocatalytique

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654126A (en) * 1985-10-07 1987-03-31 International Business Machines Corporation Process for determining the plating activity of an electroless plating bath
AU579776B2 (en) * 1986-11-06 1988-12-08 Nippondenso Co. Ltd. Electroless copper plating solution and process for electrolessly plating copper
JP2595319B2 (ja) * 1988-07-20 1997-04-02 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JPH02161130A (ja) * 1988-12-15 1990-06-21 Hino Motors Ltd ターボチャージャーの制御装置
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1530167A (fr) * 1967-07-03 1968-06-21 Shipley Co Composition et procédé pour le dépôt chimique non électrolytique de cuivre sur des objets à surface catalytique
JPS5230131B2 (fr) * 1973-07-11 1977-08-05
JPS5220339A (en) * 1975-08-08 1977-02-16 Hitachi Ltd Chemical copper plating solution

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4834796A (en) * 1986-11-06 1989-05-30 Nippondenso Co., Ltd. Electroless copper plating solution and process for electrolessly plating copper
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
WO2005038086A1 (fr) * 2003-10-17 2005-04-28 Nikko Materials Co., Ltd. Solution de placage pour cuivrage autocatalytique
KR100767942B1 (ko) * 2003-10-17 2007-10-17 닛코킨조쿠 가부시키가이샤 무전해 구리도금액
CN100462480C (zh) * 2003-10-17 2009-02-18 日矿金属株式会社 无电镀铜溶液
US8404035B2 (en) 2003-10-17 2013-03-26 Nippon Mining & Metals Co., Ltd. Electroless copper plating solution

Also Published As

Publication number Publication date
EP0164580A3 (en) 1986-12-30
EP0164580B1 (fr) 1989-09-20
EP0164580A2 (fr) 1985-12-18
DE3573139D1 (en) 1989-10-26
JPH0214430B2 (fr) 1990-04-09

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