DE3573139D1 - Electroless copper plating bath and plating method using such bath - Google Patents
Electroless copper plating bath and plating method using such bathInfo
- Publication number
- DE3573139D1 DE3573139D1 DE8585105723T DE3573139T DE3573139D1 DE 3573139 D1 DE3573139 D1 DE 3573139D1 DE 8585105723 T DE8585105723 T DE 8585105723T DE 3573139 T DE3573139 T DE 3573139T DE 3573139 D1 DE3573139 D1 DE 3573139D1
- Authority
- DE
- Germany
- Prior art keywords
- bath
- plating
- electroless copper
- copper plating
- plating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61127884A | 1984-05-17 | 1984-05-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3573139D1 true DE3573139D1 (en) | 1989-10-26 |
Family
ID=24448389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585105723T Expired DE3573139D1 (en) | 1984-05-17 | 1985-05-10 | Electroless copper plating bath and plating method using such bath |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0164580B1 (fr) |
JP (1) | JPS60245783A (fr) |
DE (1) | DE3573139D1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4654126A (en) * | 1985-10-07 | 1987-03-31 | International Business Machines Corporation | Process for determining the plating activity of an electroless plating bath |
AU579776B2 (en) * | 1986-11-06 | 1988-12-08 | Nippondenso Co. Ltd. | Electroless copper plating solution and process for electrolessly plating copper |
JPH0723539B2 (ja) * | 1986-11-06 | 1995-03-15 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
JP2595319B2 (ja) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
JPH02161130A (ja) * | 1988-12-15 | 1990-06-21 | Hino Motors Ltd | ターボチャージャーの制御装置 |
US5965211A (en) * | 1989-12-29 | 1999-10-12 | Nippondenso Co., Ltd. | Electroless copper plating solution and process for formation of copper film |
KR100767942B1 (ko) * | 2003-10-17 | 2007-10-17 | 닛코킨조쿠 가부시키가이샤 | 무전해 구리도금액 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1530167A (fr) * | 1967-07-03 | 1968-06-21 | Shipley Co | Composition et procédé pour le dépôt chimique non électrolytique de cuivre sur des objets à surface catalytique |
JPS5230131B2 (fr) * | 1973-07-11 | 1977-08-05 | ||
JPS5220339A (en) * | 1975-08-08 | 1977-02-16 | Hitachi Ltd | Chemical copper plating solution |
-
1985
- 1985-01-14 JP JP340985A patent/JPS60245783A/ja active Granted
- 1985-05-10 DE DE8585105723T patent/DE3573139D1/de not_active Expired
- 1985-05-10 EP EP19850105723 patent/EP0164580B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0164580A3 (en) | 1986-12-30 |
EP0164580B1 (fr) | 1989-09-20 |
EP0164580A2 (fr) | 1985-12-18 |
JPS60245783A (ja) | 1985-12-05 |
JPH0214430B2 (fr) | 1990-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |