JPS60244051A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS60244051A JPS60244051A JP59101208A JP10120884A JPS60244051A JP S60244051 A JPS60244051 A JP S60244051A JP 59101208 A JP59101208 A JP 59101208A JP 10120884 A JP10120884 A JP 10120884A JP S60244051 A JPS60244051 A JP S60244051A
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- case
- reinforced material
- aperture
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 239000012779 reinforcing material Substances 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 229910052742 iron Inorganic materials 0.000 abstract description 4
- 229910001369 Brass Inorganic materials 0.000 abstract description 3
- 239000010951 brass Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59101208A JPS60244051A (ja) | 1984-05-17 | 1984-05-17 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59101208A JPS60244051A (ja) | 1984-05-17 | 1984-05-17 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60244051A true JPS60244051A (ja) | 1985-12-03 |
JPH0546702B2 JPH0546702B2 (enrdf_load_stackoverflow) | 1993-07-14 |
Family
ID=14294501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59101208A Granted JPS60244051A (ja) | 1984-05-17 | 1984-05-17 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60244051A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63208253A (ja) * | 1987-02-25 | 1988-08-29 | Toshiba Corp | 半導体回路装置 |
-
1984
- 1984-05-17 JP JP59101208A patent/JPS60244051A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63208253A (ja) * | 1987-02-25 | 1988-08-29 | Toshiba Corp | 半導体回路装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0546702B2 (enrdf_load_stackoverflow) | 1993-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |