JPS60239032A - 銅・モリブデン複合電極材料の製造方法 - Google Patents
銅・モリブデン複合電極材料の製造方法Info
- Publication number
- JPS60239032A JPS60239032A JP9295484A JP9295484A JPS60239032A JP S60239032 A JPS60239032 A JP S60239032A JP 9295484 A JP9295484 A JP 9295484A JP 9295484 A JP9295484 A JP 9295484A JP S60239032 A JPS60239032 A JP S60239032A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- copper
- molybdenum
- electrode material
- composite electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 239000007772 electrode material Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 title claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 50
- 239000010949 copper Substances 0.000 claims abstract description 50
- 238000005096 rolling process Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001301 oxygen Substances 0.000 claims abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 47
- 239000011733 molybdenum Substances 0.000 claims description 47
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 46
- 230000003746 surface roughness Effects 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 21
- 238000005098 hot rolling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9295484A JPS60239032A (ja) | 1984-05-11 | 1984-05-11 | 銅・モリブデン複合電極材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9295484A JPS60239032A (ja) | 1984-05-11 | 1984-05-11 | 銅・モリブデン複合電極材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60239032A true JPS60239032A (ja) | 1985-11-27 |
| JPH02852B2 JPH02852B2 (enrdf_load_stackoverflow) | 1990-01-09 |
Family
ID=14068848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9295484A Granted JPS60239032A (ja) | 1984-05-11 | 1984-05-11 | 銅・モリブデン複合電極材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60239032A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| CN100404197C (zh) * | 2006-04-10 | 2008-07-23 | 安泰科技股份有限公司 | 铜/钼/铜电子封装复合材料的制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436349U (enrdf_load_stackoverflow) * | 1990-07-23 | 1992-03-26 |
-
1984
- 1984-05-11 JP JP9295484A patent/JPS60239032A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| CN100404197C (zh) * | 2006-04-10 | 2008-07-23 | 安泰科技股份有限公司 | 铜/钼/铜电子封装复合材料的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02852B2 (enrdf_load_stackoverflow) | 1990-01-09 |
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