JPS60233886A - 印刷配線板の製造方法 - Google Patents
印刷配線板の製造方法Info
- Publication number
- JPS60233886A JPS60233886A JP8895684A JP8895684A JPS60233886A JP S60233886 A JPS60233886 A JP S60233886A JP 8895684 A JP8895684 A JP 8895684A JP 8895684 A JP8895684 A JP 8895684A JP S60233886 A JPS60233886 A JP S60233886A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- insulating substrate
- hole
- layer
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 34
- 238000007747 plating Methods 0.000 claims description 126
- 239000003054 catalyst Substances 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 229920001187 thermosetting polymer Polymers 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 238000007788 roughening Methods 0.000 claims description 25
- 238000007772 electroless plating Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 54
- 239000000758 substrate Substances 0.000 description 46
- 239000012790 adhesive layer Substances 0.000 description 31
- 238000009413 insulation Methods 0.000 description 16
- 239000000839 emulsion Substances 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 240000001949 Taraxacum officinale Species 0.000 description 1
- 235000006754 Taraxacum officinale Nutrition 0.000 description 1
- 235000005187 Taraxacum officinale ssp. officinale Nutrition 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8895684A JPS60233886A (ja) | 1984-05-02 | 1984-05-02 | 印刷配線板の製造方法 |
| US06/701,533 US4585502A (en) | 1984-04-27 | 1985-02-14 | Process for producing printed circuit board |
| DE19853505579 DE3505579A1 (de) | 1984-04-27 | 1985-02-18 | Verfahren zur herstellung einer gedruckten schaltungsplatte |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8895684A JPS60233886A (ja) | 1984-05-02 | 1984-05-02 | 印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60233886A true JPS60233886A (ja) | 1985-11-20 |
| JPH0317239B2 JPH0317239B2 (enrdf_load_stackoverflow) | 1991-03-07 |
Family
ID=13957299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8895684A Granted JPS60233886A (ja) | 1984-04-27 | 1984-05-02 | 印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60233886A (enrdf_load_stackoverflow) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4914977A (enrdf_load_stackoverflow) * | 1972-05-22 | 1974-02-08 | ||
| JPS509071A (enrdf_load_stackoverflow) * | 1973-05-30 | 1975-01-30 | ||
| JPS50153272A (enrdf_load_stackoverflow) * | 1974-05-31 | 1975-12-10 | ||
| JPS5725998A (en) * | 1980-07-23 | 1982-02-10 | Sadao Ikeda | Form supporting paper for printer of computer |
| JPS5839098A (ja) * | 1981-09-02 | 1983-03-07 | 松下電工株式会社 | 金属基板配線材料の製造方法 |
| JPS5931094A (ja) * | 1982-08-14 | 1984-02-18 | 松下電工株式会社 | フルアデイテイブ配線基板の製造法 |
-
1984
- 1984-05-02 JP JP8895684A patent/JPS60233886A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4914977A (enrdf_load_stackoverflow) * | 1972-05-22 | 1974-02-08 | ||
| JPS509071A (enrdf_load_stackoverflow) * | 1973-05-30 | 1975-01-30 | ||
| JPS50153272A (enrdf_load_stackoverflow) * | 1974-05-31 | 1975-12-10 | ||
| JPS5725998A (en) * | 1980-07-23 | 1982-02-10 | Sadao Ikeda | Form supporting paper for printer of computer |
| JPS5839098A (ja) * | 1981-09-02 | 1983-03-07 | 松下電工株式会社 | 金属基板配線材料の製造方法 |
| JPS5931094A (ja) * | 1982-08-14 | 1984-02-18 | 松下電工株式会社 | フルアデイテイブ配線基板の製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0317239B2 (enrdf_load_stackoverflow) | 1991-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3698940A (en) | Method of making additive printed circuit boards and product thereof | |
| JPH06260756A (ja) | プリント配線板の製造方法 | |
| JPS60233886A (ja) | 印刷配線板の製造方法 | |
| JP2915644B2 (ja) | プリント配線板の製造方法 | |
| JPH0964538A (ja) | プリント配線板の製造方法 | |
| JPH0370396B2 (enrdf_load_stackoverflow) | ||
| JPH0248155B2 (ja) | Insatsuhaisenbannoseizohoho | |
| JPS6114796A (ja) | 印刷配線板の製造方法 | |
| JPS61102093A (ja) | プリント基板の製造方法 | |
| JPS6110296A (ja) | 印刷配線板の製造方法 | |
| JPS60171789A (ja) | 印刷配線板の製造方法 | |
| JPS60235495A (ja) | 印刷配線板の製造方法 | |
| JPS61102092A (ja) | 印刷配線板の製造方法 | |
| JPS60229395A (ja) | 印刷配線板の製造方法 | |
| JPH0248152B2 (ja) | Insatsuhaisenbannoseizohoho | |
| JPH0248153B2 (ja) | Insatsuhaisenbannoseizohoho | |
| JPS6140089A (ja) | 印刷配線板の製造方法 | |
| JP3469146B2 (ja) | ビルドアップ多層プリント配線板 | |
| JPS60171788A (ja) | 印刷配線板の製造方法 | |
| JP3469214B2 (ja) | ビルドアップ多層プリント配線板 | |
| JPS6140088A (ja) | 印刷配線板の製造方法 | |
| JP3100689B2 (ja) | プリント配線板の電子部品搭載用凹部の形成方法 | |
| JPS5924560B2 (ja) | 印刷配線板の製造方法 | |
| JP3396519B2 (ja) | プリント配線板及びその導体パターン形成方法、並びに接着剤シート | |
| JPS61121391A (ja) | 印刷配線板 |