JPS6023168Y2 - thermal head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head used in a thermal recording device, and in particular to an improvement of its tape carrier.

Drive signals are supplied to each electrode of the thermal head from electronic components such as IC chips mounted on the tape carrier, and normally one thermal head is equipped with several dozen IC chips. There is.

By the way, when one of these IC chips breaks down, conventionally it has not been possible to replace only the faulty IC chip or replace only the tape carrier on which the faulty IC chip is mounted.

This is because even if a failed IC chip is replaced with a new one, the conductor path to the tape carrier cannot be connected to the tape carrier, and when the tape carrier is replaced, even the electrodes of the thermal head are peeled off, and a new tape carrier is glued. Because you can't.

The present invention eliminates the drawbacks of the conventional ones mentioned above,
It was created with the aim of providing a thermal head that allows only the failed IC chip to be replaced.
A first tape carrier having a terminal portion formed at an intermediate position of each of the plurality of conductive paths and capable of being cut on the electronic component side from each terminal portion; and a plurality of conductive paths connected to each of the terminal portions. and a second tape carrier on which electronic components are mounted, and the second tape carrier can be bonded to the remaining part of the first tape carrier after cutting the first tape carrier to remove the failed electronic component. It is.

The present invention will be explained below with reference to embodiments shown in the drawings.

FIG. 1 shows a first tape carrier 1.
The tape carrier 1 has a rectangular shape and has a rectangular opening 3 in the center in which an IC chip 2 is placed.

Further, on the upper surface 4 on one side of the opening 3 of the first tape carrier 1, an outer lead 6 is provided with one end facing the outer edge 5 of the first tape carrier 1, and an IC chip is provided with the other end facing the inner edge 7 of the opening 3. A plurality of conductive lines 9, 9, .

Although only three conductive paths 9 are shown in the figure for convenience, more conductive paths 9 are actually arranged.

A terminal portion 10 is formed at an intermediate position of each conducting path 9.

Similarly, one end of the upper surface 4 on the other side of the opening 3 of the first tape carrier 1 is connected to the outer edge 11 of the first tape carrier 1.
The outer lead 6 faces the opening 3, and the other end is the inner edge 1 of the opening 3.
Inner lead 8 facing IC chip 2 and connected to IC chip 2
A plurality of conducting lines 13, 13, . . . are arranged parallel to the longitudinal direction of the first tape carrier 1.

A terminal portion 1 is also provided at an intermediate position between these conductor paths 13.
0 is formed.

The reason why the conductive lines 9 and 13 are formed on both sides of the opening 3 is that one side serves as an input side and the other side serves as an output side.

Incidentally, cutting lines 14.14 are written on the opening 3 side of the terminal portions 10 of each of the conductive lines 9, 13, indicating the cutting positions when replacing the failed IC chip 2, and these cutting lines 14.14 FIG. 2 shows the state in which the defective IC chip 2 has been removed by cutting it.

FIG. 3 shows the second tape carrier 15, in which a new IC chip 2A is installed in the central opening 16.

This IC chip 2A includes the same number of conducting lines 17, 17, 18 as the number of conducting lines 9, 13 of the first tape carrier 1,
18... inner lead 19, 19...
... are connected, and the length of these conductor lines 17, 18 is such that the second tape carrier 15
When inserted, each outer lead is 20.20.
. . . are conductive lines 9, 1 of the first tape carrier 1.
3 is selected to be located on the terminal portion 10 of No. 3.

According to the configuration described above, along the cutting line 14.14 the first
The tape carrier 1 is cut to remove the defective IC chip 2 at the center of the waist as shown in FIG. 2, and then the second tape carrier 15 shown in FIG. If it is glued onto the first tape carrier 1 in such a way that the
The outer lead 20 of each conductor line 17.18 of the second tape carrier 15 is connected to each conductor line 9.13 of the first tape carrier.
The IC chip 2A and the outer leads 20 of the conductive lines 9 and 13 of the first tape carrier 1 are electrically connected to each other.

As explained above, the thermal head according to the present invention is
A first tape carrier having a terminal portion formed at an intermediate position of each of the plurality of conductive paths and capable of being cut on the side closer to the electrical component than each terminal portion, and a plurality of conductive paths connected to each of the terminal portions. a second tape carrier on which electronic components are mounted, the first tape carrier being cut to remove the failed electronic component, and the second tape carrier being able to be bonded to the remainder of the first tape carrier. Therefore, an excellent effect can be achieved in that the thermal head can be regenerated by simply replacing the defective IC chip.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the first tape carrier used in the thermal head of the present invention, FIG. 2 is a plan view showing the first tape carrier shown in FIG. FIG. 4 is a plan view showing an embodiment of the second tape carrier used in the thermal head of the present invention, and FIG. 4 is a plan view showing the state in which the second tape carrier is adhered onto the first tape carrier. 1...First tape carrier, 2,2A...
...IC chip, 3,16...opening, 9. 1
3. 17. 18...conductor line, 14...
... Cutting line, 15 ... Second tape carrier.

Claims (1)

[Scope of utility model registration request] A first tape carrier having a terminal portion formed at an intermediate position of each of the plurality of conductive paths and capable of being cut on the electronic component side from each terminal portion; and a plurality of conductive paths connected to each of the terminal portions. and a second tape carrier on which electronic components are mounted, the first tape carrier being cut to remove the failed electronic component, and the second tape carrier being able to be adhered to the remainder of the first tape carrier. A thermal head characterized by: