JPS58197757A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS58197757A JPS58197757A JP8038482A JP8038482A JPS58197757A JP S58197757 A JPS58197757 A JP S58197757A JP 8038482 A JP8038482 A JP 8038482A JP 8038482 A JP8038482 A JP 8038482A JP S58197757 A JPS58197757 A JP S58197757A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- yield
- tape
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、テープ・キャリア方式によって製造される半
導体集積回路に用いるリード・フレームに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame used in a semiconductor integrated circuit manufactured by a tape carrier method.
テープ・キャリア方式はポリイミド樹脂等でできた絶縁
性のフレキシブルなフィルム上に密着シて設けられた導
電性のリードを有するリード・フレームと半導体装置に
設けられた実記電極と金属液に熱圧着する組み立て方式
である。このテープ・キャリア方式では長尺状のフィル
ムに同一のリード・パターンを連続して形成できるので
半導体装置ｔ−リード・フレームに熱圧着した後は半導
体装置（Ｄ％気的試験會自動的におこなえるという長所
がある。In the tape carrier method, a lead frame with conductive leads is tightly attached to an insulating flexible film made of polyimide resin, etc., and the actual electrodes provided on the semiconductor device are bonded by thermocompression to a metal liquid. It is an assembly method. With this tape carrier method, the same lead pattern can be continuously formed on a long film, so after thermocompression bonding to the semiconductor device T-lead frame, the semiconductor device (D% chemical test) can be automatically performed. There is an advantage.
従来のテープ・＋、リア方式用のリード・フレームは菖
１図のように均質のテープ状のポリインド等の絶破性フ
ィルム１の両側に等間隔のスプロケット・ホール２ｔＭ
け中央部にデバイス・ホールを開けてリード・フレーム
３を金属屑触法および電気鍍金法等よって連続的に形成
する。The conventional tape +, lead frame for the rear system has sprocket holes 2tM equally spaced on both sides of a homogeneous tape-like bursting film 1 made of polyind, etc., as shown in Figure 1.
A device hole is opened in the center of the lead frame 3, and a lead frame 3 is continuously formed by a metal scrap method, an electroplating method, or the like.
リード・フレームの半導体装置搭載側はデバイス・ホー
ル４に突き出したものとなってお夛リード・フレームの
先端部３ａにおいて半導体装置５の電極に熱圧着されリ
ード・フレームの他端３Ｃに探針を接触させて半導体装
置の電気的な特性を測定することができる。The semiconductor device mounting side of the lead frame protrudes into the device hole 4, and is thermocompressed to the electrode of the semiconductor device 5 at the tip 3a of the lead frame, and a probe is attached to the other end 3C of the lead frame. The electrical characteristics of the semiconductor device can be measured by making contact with the semiconductor device.
リードフレームは絶縁性フィルム上に等間隔に形成され
ているのでフィル本両側に等間隔に打ち抜力れたスプロ
ケット・ホールのビ、チに等しい間隔の突起をもった歯
車等によりスプロケット・ホールを使ってテープを次々
に送ることにより連続して自動的に作業をおこなえた。Since the lead frame is formed on an insulating film at equal intervals, the sprocket holes are punched out at equal intervals on both sides of the film using gears with protrusions equally spaced on the holes. By using this to send tapes one after another, it was possible to perform continuous and automatic work.
しかしこの形状のテープではリードフレームが露出して
いるためテープ押さえ治具等ないしは作業上の不注意等
により容易にリード・７レームに傷がつき、切断ないし
はパターンの変形によフパターン間の短絡を引きおこし
、歩留を大きく低下させていた。However, with this type of tape, the lead frame is exposed, so the lead/7 frame is easily damaged by a tape holding jig or careless work, and short circuits between the f-patterns can occur due to cutting or deformation of the pattern. This caused a significant drop in yield.
本発明は、従来のテープ・キャリア方式のリード・フレ
ームの上記の欠点を解消することを目的とし、その特徴
は絶縁性のフィルムが電ね合わされ導電性のリードを有
するリード・フレームが挟まれた構造をしていることで
ある。The present invention aims to eliminate the above-mentioned drawbacks of the conventional tape carrier type lead frame, and its characteristics are that an insulating film is electrically connected and a lead frame having conductive leads is sandwiched. It has a structure.
この方式のリード・フレームを用いることによってリー
ドパターンが露出していないため機械的ストレスによる
切断ないしは変形等による不良を皆無とすることができ
作業性および歩留を一段と向上することができる。By using this type of lead frame, the lead pattern is not exposed, so there are no defects due to cutting or deformation due to mechanical stress, and workability and yield can be further improved.
以下に一実施例ｔ−説明する。One embodiment is described below.
本発明によるテープ・キャリア方式のリードフレームは
第２図のようにテープ状のポリイミド等の絶縁性フィル
ム１および６の間に導電性のリード３が狭まれ良もので
ある。The tape carrier type lead frame according to the present invention is a good one in which conductive leads 3 are sandwiched between tape-shaped insulating films 1 and 6 made of polyimide or the like as shown in FIG.
このような本発明によりリードフレームの切断・変形全
完全に無くすことができ作業の容易性および歩留の向上
ｔはかることができる。According to the present invention, cutting and deformation of the lead frame can be completely eliminated, making it easier to work and improving yield.
第１図は従来のテープ・キャリア方式のリードフレーム
の平面図であ〕、第２図は本発明の実施例によるテープ
・キャリア方式のリードフレームの断面因である。
同図において、ｌおよび６はテープ、２はスプロケット
・ホール、３はリード、４はデバイス・ホール、５は牛
導体装置である。
第 ′１ 図
３こ 、ｇ ６；
３（し
）１
；寿 ２ 図FIG. 1 is a plan view of a conventional tape carrier type lead frame, and FIG. 2 is a sectional view of a tape carrier type lead frame according to an embodiment of the present invention. In the figure, 1 and 6 are tapes, 2 is a sprocket hole, 3 is a lead, 4 is a device hole, and 5 is a conductor device. '1 Figure 3, g 6;
3(shi)
)1
; Kotobuki 2 Figure
Claims (1)
り狭まれた構造をもつことｔ−特徴とするリード・フレ
ーム。A lead frame characterized in that an electrode lead pattern has a structure narrowed by a long insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8038482A JPS58197757A (en) | 1982-05-13 | 1982-05-13 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8038482A JPS58197757A (en) | 1982-05-13 | 1982-05-13 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58197757A true JPS58197757A (en) | 1983-11-17 |
Family
ID=13716788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8038482A Pending JPS58197757A (en) | 1982-05-13 | 1982-05-13 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58197757A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03191541A (en) * | 1989-12-20 | 1991-08-21 | Nec Corp | Lead frame |
-
1982
- 1982-05-13 JP JP8038482A patent/JPS58197757A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03191541A (en) * | 1989-12-20 | 1991-08-21 | Nec Corp | Lead frame |
| JP2782870B2 (en) * | 1989-12-20 | 1998-08-06 | 日本電気株式会社 | Lead frame |
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