JPS6242540Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to an electronic circuit device,
Particularly, when transporting or adjusting electronic circuit devices such as semiconductor devices, it is intended to prevent the electronic circuit devices from being destroyed or damaged by high voltage caused by static electricity or the like.

It has long been known that electronic circuit devices, especially semiconductor devices, can be damaged by static electricity, etc. In order to prevent this damage, extra circuits are built in to release high voltage between terminals. ,
In addition, efforts have been made to handle the semiconductor device by inserting it into a conductive sponge or the like. However, in the former case, extra circuits are added, which tends to cause characteristic deterioration and defects, which increases costs, and in the latter case, there is a problem that damage cannot be prevented once removed from the conductive sponge.

The present invention provides an electronic circuit device that eliminates the above-mentioned conventional drawbacks.

This invention basically connects the terminals of electronic circuit devices that should be electrically protected and collects them at one point, so that high voltage caused by static electricity or accidents passes through this point. This is to prevent damage.

Further, when using the electronic circuit device, the electrically connected portions are removed so that the electronic circuit device can be used normally.

FIGS. 1a and 1b show an electronic circuit device according to a first embodiment of the present invention. In the same figure, the first
Figure a shows a side sectional view, and Figure 1 b shows a bottom view, where 1 is an insulating substrate holding an IC chip, 2 is a lead pin, 3 is an IC chip, and 4 is a lead pin 2.
A wire lead connects to the pad of IC chip 3, 5 is a protective cover that protects IC chip 3, 6
is a connection according to the present invention, and is electrically connected to the lead pin 2. Reference numeral 7 indicates a connecting portion of the wire connection 6, and reference numeral 8 indicates a cutting portion of the substrate 1. As shown in this embodiment, when using the present electronic circuit device, for example, after inserting the present electronic circuit device into an IC socket or the like, the connecting portion 7 is removed by cutting off the cutting portion 8. In this way, each lead pin 2 is electrically isolated from each other and becomes ready for use. When the insulating substrate 1 is a printed circuit board or an alumina substrate, a shallow cut is made to cut the insulating substrate 1 into the cut portion 8.
It can be easily cut off.

The wire connection 6 can be easily formed by a common method such as vapor deposition or printing. Further, in this embodiment, the connection wire 6 is exposed, but it is of course possible to embed it inside the insulating substrate 1. Furthermore, it can also be achieved by peeling off or rubbing off the deposited or printed material.

FIG. 2 shows a bottom view of an electronic circuit device according to a second embodiment of the present invention, which is characterized in that only the connection portions of the wires are exposed to the outside.
That is, in the figure, 11 is an insulating substrate, 12 is a lead pin, and 13 is a connection for connecting each lead pin, which is embedded in the insulating substrate 11. Reference numeral 14 denotes a connecting portion of the wire 13 provided in the opening 15 of the insulating substrate 11.

As shown in FIG. 2, in this embodiment, the opening 15 exposed to the outside is irradiated with a laser or the like to burn out the connection portion of the wire.

When a laser is used, the aperture 15 may be provided with a transparent film, or may be located deep inside the substrate 11 of the electronic circuit device.

In addition, in this embodiment, the connections 13 are gathered in one place to provide the connection part 14, but a conductive seal or the like is adhered to the opening part 15, and the conductive seal is peeled off as necessary to use the electronic circuit device. You can do it as you like. In this case, a simple operation such as peeling off the conductive seal during the test immediately before mounting the electronic circuit device, and reattaching the seal only to the defective product after the test is performed. It also has the advantage of making it possible to conduct circuit tests and distinguish between good and defective products in a reasonable manner.

As described above, the present invention has high utility value because it can provide a simple function that allows the protection function to be removed immediately after the electronic circuit device is installed in the device and immediately before the device is used.

[Brief explanation of the drawing]

1A and 1B are a side sectional view and a bottom view of an electronic circuit device according to a first embodiment of the present invention, respectively, and FIG. 2 is a bottom view of an electronic circuit device according to a second embodiment of the present invention. 1, 11...Substrate (insulating substrate), 2, 12...
External lead terminal (lead pin), 3...Circuit element (IC chip), 6, 13...Wire connection.

Claims (1)

[Claims for Utility Model Registration] (1) A substrate holding a circuit element, an external lead terminal electrically connected to the circuit element, and the above-mentioned substrate electrically connecting at least two of the external lead terminals. An electronic device characterized by having a connection formed directly on the substrate by printing, vapor deposition, etc., and a cutting portion provided in a concentrated manner on the substrate and directly bonded to the substrate in order to selectively cut the connection. circuit device. (2) The electronic circuit device according to claim 1, wherein the cutting portion is formed of a conductive seal.