JPS5925243A - Dicing method - Google Patents

Abstract

PURPOSE:To make static electricity generated during dicing release to the outside, and to dice a wafer so as not to generate the electrostatic breakdown of the circuit element of the wafer by fixing the wafer onto a conductive fixing means grounded and dicing the wafer. CONSTITUTION:The wafer to be diced 1 is fixed onto a conductive substrate 3 by conductive adhesives 2 under the state in which a circuit pattern is formed. The base material 3 is connected onto a conductive dicing table 4 in a conductible shape, and the table 4 is grounded by a ground wire 5. Consequently, even when static electricity is generated during the dicing of the wafer 1, static electricity is not stored in the wafer 1 because it is guided to the outside through the conductive adhesive 2, the conductive base material 3, the dicing table 4 and the ground wire 5 from the wafer 1 and escapes. Accordingly, the generation of the electrostatic breakdown of the circuit element of a pellet due to static electricity generated in the wafer 1 can be prevented.

Description

[Detailed Description of the Invention] The present invention provides 7 ways to dice wafers! This paper relates to a dicing method that allows wafers to be diced without destroying circuits.

Generally, when dicing wafers in the manufacturing process of semiconductor products, electrostatic damage to circuit elements may occur due to the cracking generated during dicing. The danger is great.

Therefore, (IY-U.S.) 6.
7,' = Me, r) Ehawokin, 9. After performing a half-cuff quisong with the dicing table in contact with the dicing dimple of i3%9, the wafer is divided into pellets by crassoging. However, since this method uses half-cut dicing, subsequent cracking is required, and there is a risk of defects such as chipping during cracking or surface scratches on the pellet due to wafer debris adhering. There is.

On the other hand, due to the necessity of reducing the pellet size and maintaining the pellet address, full-cut dicing of the rag is being considered. However, in full-cut dicing, it is necessary to fix the rag in advance with a fixed ion material such as adhesive tape to prevent the pellet from falling apart after dicing.

Therefore, it is difficult to ground the rag during dicing, and there is a problem in that the static electricity generated during dicing tends to cause static electricity and damage to the circuit elements.

Therefore, an object of the present invention is to release the static electricity generated during dicing to the waste cloth (or pellet).
An object of the present invention is to provide a dicing method that can perform dicing without causing electrostatic damage to circuit elements.

Hereinafter, the present invention will be illustrated in the drawings. , will be explained in detail according to examples.

FIG. 1 is a schematic cross-sectional view of a dicing mechanism showing an embodiment of the dicing method according to the present invention.

In this embodiment, a wafer 1 to be diced is fixed on a conductive substrate 3 with a conductive adhesive 2 with a circuit board formed thereon.

7. Adhesive adhesive 2 and conductive base 3. Adhere the conductive adhesive 2 to the adhesive tape 3 in advance like a normal adhesive tape, and then apply the conductive adhesive 2 to the The wafer J may also be glued to the surface.

The conductive base 3 is conductive 115. The dicing table 4 is electrically conductively connected to the top of the dicing table 4, which has a
Ru.

Therefore, in this embodiment, the wafer 1 is coated with the conductive adhesive 2. It is grounded via the conductive wire 1 (moon 3, dicing dimple 4, and ground wire 5).

In this embodiment, when the wafer j is diced with a dizer (not shown), even if static electricity is generated on the wafer 1 during dicing, the static to, p(c*: from the rag 1 to the conductive adhesive 2 Since it is led to the outside through the conductive substrate 3. the die/dying table 4. the ground I%!5 and escapes, it does not accumulate on the wafer 1.

As a result, according to this embodiment, the wafer 1 during dicing
It is possible to prevent electrostatic damage to the circuit elements of the pellet due to the static electricity generated.

This embodiment is effective in dicing the wafer 1, especially in preventing electrostatic damage to circuit elements during full-cut dicing.

? FIG. 2 is a schematic explanatory diagram of a dicing mechanism showing a second embodiment of the die/dicing method according to the present invention.

In this embodiment, the ground wire 5 is not connected to the dicing table 4, but is connected to the conductive thread 3 so as to provide an i-plane ground from the conductive thread 3.

Therefore, in this embodiment, the static electricity generated on the wafer 1 is removed by the conductive adhesive 2. Conduit, base A: Immediately escape from 13 to ground via ground wire 5.

In addition, the ground wire 5 is directly connected to the conductive adhesive 2 in the case, and the electrical current generated on the wafer 1 is transferred from the wafer 1 to the conductive adhesive 2. It may be led to the ground via the ground wire 5.

Furthermore, as shown in FIG. The wafer 1 may be fixed at a power of 8 J, and the static electricity of the wafer 1 may be quickly discharged to the outside through the ground wire 5 connected to the dicing table 4.

Although the present invention is particularly advantageous for full-cut dicing, it can also be applied to half-cut dicing.

As explained above, according to the present invention, the static electricity generated during dicing is not accumulated on the wafer and is discharged to the outside, so that the wafer (bullet) is not damaged by static electricity or air.
This can prevent damage to the circuit elements.

If the present invention is applied to full cut dicing for QW,
Cracking is not necessary.''Secondly, cracking causes defects and wafer debris to cause surface scratches on the berenoto.
′-, the cap can be eliminated, and it is also possible to reduce the pellet size and maintain the pellet address.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view of a dicing mechanism showing one embodiment of the dicing method according to the present invention, and FIG. 2 is a schematic cross-sectional view of a dicing mechanism showing another embodiment of the dicing method according to the present invention. FIG. 3 is a schematic cross-sectional view of a dicing mechanism showing still another embodiment of the dicing method of the present invention. DESCRIPTION OF SYMBOLS 1...Wafer, 2...Conductor, adhesive, 3...Conductor material, 4...Dicing table, 5...Ground wire. Agent Patent Attorney Susuki 1) Li Graduation - ', Figure 1 Figure 2 / Figure 3 Meg 1

Claims (1)

[Scope of Claims] 1. A dicing method for wafers, characterized in that dicing is carried out by fixing the wafer on a grounded conductive fixing means. 2. The fixing means fixes the conductive base using a conductive adhesive such as a wafer, and fixes the conductive base at a temperature of 1°C. A special rγI consisting of an electrolytic dicing table, characterized in that the nuclear dicing table is grounded.
: The dicing method described in item 1 of the scope of the box test. 3 The fixing means is a sea urchin...
and a dicing table that fixes the conductive base to a conductive base;
1. The dicing method according to claim 1, characterized in that (i) and (b) are grounded. 4. The dicing method according to claim 1, item 111y, patented in that the fixing means consists of a conduit and a sacrificial dicing table, and the dicing table is grounded. 5. The dicing method according to claim 1. Cut dicing - "The dicing method according to any one of claims 1, 2, 4, etc."