JPS60225491A - Method of producing printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to the method of manufacturing printed circuit boards (c/) for forming Vm body circuits by chemical plating, and includes the removal of chemical plating on loads and the plating on resists. Regarding the manufacturing method of printed circuit boards that can suppress the precipitation of

(Prior art) Conventionally, as one of the methods of back-cutting printed circuit boards by chemical plating, a layer of agent τ of a plating catalyst τ containing a plating catalyst τ containing a hard acid rubber τ as a main component and a T/8 contact 7# is provided. , There is a method of performing chemical plating τ while other than the tgI silk forming area [masked with plating resist, chemically roughened, yt water washing process τ, -tc/)] There are 0 methods. Catalyst as chemical plating method The applied force Vc71rrI11 can be easily applied to the roughened surface of the surface using other methods! 7 Compared to the method of forming a catalyst, the catalyst is simply connected! However, compared to other methods, this method has a significant effect on plating because it only needs to be mixed into the I+ agent, and the catalyst is stably dispersed in the skin wound layer. 1 or less defects g: M
◎ However, another method uses a catalyst layer to form a shielding agent [II
The coating agent transfers onto the reinforced resist.
There is a drawback that 5 tends to separate from the adhesive and form a layer on the fujist. In this case, even if it is a small piece, it is inevitable that it will be plated or precipitated due to the presence of catalyst τ in the warping. Recently, as the spacing between circuits has become narrower to less than a2 inch, and the S@ degree has been increased to 1 Gl circuit, this has become a serious drawback. (Structure of the invention) An adhesive layer τ containing a chemical plating catalyst τ is formed on the surface of the rrIe3 edge substrate of the present invention, the surface of the adhesive layer τ is roughened, water is washed τ, and a circuit τ is formed by chemical plating. In the manufacturing method of printed circuit boards, a dry kneading step τ is performed before chemical processing. After τ, leave it as is.

It is clear that when plating @τ is performed, the plating solution can diffuse to a considerable depth, and as a result of plating (a), the surface layer becomes plasticized and the cohesive force decreases. It is a state in which countless small pieces are removed by applying a Z or zero finger to the plating process, and the particles agglomerate in places where it is expected that they will easily be detached by the enemy flow during plating in a stiff state. In order to strengthen the force, chemistry@Ryotoshi Menkaji, by setting up a drying process for the adhesive layer prior to chemical plating, the cohesive force of the adhesive was strengthened to 0, and even if the plating was stirred, it would not cohere. It is possible that small pieces of the skin contactant may come off without decreasing the force (as evidenced by the 0-shaving machine that was able to complete the process) due to the roughening of the surface. The polar group A is in contact with water, but it is dry VC, and it is lost in the opponent, and the polar group is turned into a meeting of comrades, and the vertical beam cuff Ds high (l glares even if it is immersed in the enemy! +aCL) It seems that a structural change has occurred.The drying process is carried out to a certain extent in a soil dry state.The conditions may vary depending on the substrate, or if the standard is to leave it as is. If it is heated to 50℃ for more than a day, it will be for more than 60 minutes, and if it is heated to 100℃, it will be for more than 5 minutes.At this time.

Water molecules layered on the roughened 'I'c adhesion agent2. 80% or more of the water that can be removed by drying, preferably 9%
It is removed by 0% or more, preferably 695% or more.

The insulating substrate is a plate material made of ordinary 2 enol-based or epoxy-based laminated 8j1 inorganic yarn or organic asia series.The adhesive is mainly composed of rubber τ, which is commonly used in chemical plating methods. A material reinforced with #I curable resin is used.

As a plating resist for the mask c/), an epoxy system τ, which is resistant to roughening, is used. Plating resist as a stage prior to chemical plating For example, before skin contact roughening treatment, at the stage of drying and so on. ◎ As for the chemical plating method, - Formed as a chromium copper τ plating film, Q) τ is also used. Rubber (acrylonitrile 41%), 658B, t-fk
111.35 parts of 2X/-ru ag, silyl.

20, zero stiffness soothing agent τsoo using pP-curing type soothing agent τ containing a plating catalyst consisting of 0.1 part of palladium chloride
Dip coating on both sides of a mm square piece of phenol laminate & (Hitachi Katori Koto ■#Koku product name LP-141) at 160℃ for 60 minutes.
vl] Heat cure for 30 minutes, then 12m [holes in M of 1 part - Light are most part of circuit M width and line spacing or 0.2ffll]
Print 150 epoxy resists such as 150
0 then chromium isolated island a (Cr0m
55 g-11HFft'M 21g+slτ Dilute with water to make total t11. 0120°C - 5 minutes, ■ 50°C - 60 minutes, ■
■For 48 hours with cloth ■About 4m of cloth that does not dry at all.

Chemical plating τ Conducted at 67°C for 60 hours ◎ Used in group g, which is not suitable for chemical plating. The thickness of the samurai print is 5
5 μm, and the shape of the copper deposit on the resist J! 1 lrI or less 〇■・・・・・・Analysis tB, 21゜■・・・・・・No precipitation■・・・・・・・・・No precipitation■・・・・・・・・・・0.2ffllll11gl roadma τ
〇Example 2 71RjlJ was mixed with acrylonitrile butadiene rubber (acrylonitrile 41%), 60s% - phthylphenol street fat% 30tl bisphenol type epoxy resin 8s, imidazole compound occL) Skin contact agent τsoo using heat-biting type skin contact agent τ containing Meliki 7!1m consisting of 2 parts of titanium white, 18 parts of titanium white, and 0.8 parts of palladium chloride.
ma square paper epoxy laminate (Hitachi Chemical Co., Ltd. Product name: L
E-144) was coated on both sides, dried in the same manner as in Example 1, resist printed on the light side, and chemically roughened with τ.
20℃ - 5 minutes ■ 50℃ - 45 minutes ■ 30 hours ω total (
For those that do not dry, the thickness of the copper of the printed 叡 that was served by the English M example 1 and 1lffJ-like chemical cutting τ going 7eo 03
5 μm, and the shape of copper precipitation on the resist M4 was as follows: 0■・・・・・・No precipitation■・・・・・・No precipitation■・・・・・・・・・No precipitation ■・・・・・・・・・0.2m1IIC/) Machida for τ bridging between circuits was 5M◎ (Efficacy of invention) As explained above, the method of misfire 8A In.

There is no plating or particles on the plating resist.

Continuation of page 1 @Inventor Chuso Akira Ichihisa Shimodate Inside the office

Claims (1)

[Claims] 1, 1 [On the surface of the Q# base, a layer of a chemical plated catalyst containing a layer τ is formed, the surface of the layer τ is roughened, washed with water τ, and then chemically plated. In the manufacturing method of circuit τ type &D type printed circuit board by plating. Printed circuit board with 7 drying steps before chemical cleaning V) Manufacturing method