JPS60218898A - Method of printing on raised board - Google Patents
Method of printing on raised boardInfo
- Publication number
- JPS60218898A JPS60218898A JP7454484A JP7454484A JPS60218898A JP S60218898 A JPS60218898 A JP S60218898A JP 7454484 A JP7454484 A JP 7454484A JP 7454484 A JP7454484 A JP 7454484A JP S60218898 A JPS60218898 A JP S60218898A
- Authority
- JP
- Japan
- Prior art keywords
- printing
- solder paste
- printing plate
- convex
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔技術分野〕 本発明は凸面回路基板への印刷方法に関する。[Detailed description of the invention] 〔Technical field〕 The present invention relates to a method of printing on convex circuit boards.
詳しくはＩＣ等電子素子かがンディングあるいは前工程
で半田付によって搭載された凸面部分を有する電気回路
基板へ半田ペーストのパターンを印刷する印刷方法に関
する。More specifically, the present invention relates to a printing method for printing a pattern of solder paste onto an electric circuit board having a convex surface on which electronic elements such as ICs are mounted by bending or soldering in a previous process.
従来のメタル・スクリーンでの印刷方法では０．１５〜
０．２■程度の板厚の印刷版を使用し、電気回路基板に
密着させて印刷しておシ、そのため印刷される面は、平
坦でなけれとならず、基板上に凸面部分がある時には、
版を損傷し、なおかつ凸面部分のものが電子素子である
場合には１．印刷時の抑圧で内部破壊を起こさせるとい
う欠点があシ、凸面電気回路基板に、半田ペーストを供
給するということは不可能であった。Conventional metal screen printing method: 0.15~
A printing plate with a thickness of about 0.2 mm is used to print in close contact with the electric circuit board, so the printed surface must be flat, and if there is a convex part on the board, ,
If the plate is damaged and the convex portion is an electronic device, 1. It was impossible to supply solder paste to convex electrical circuit boards, which had the disadvantage of causing internal destruction due to pressure during printing.
本発明の目的は、上記欠点を除去するとともに簡単な構
成の印刷版を用いて、半田ペーストの印刷Ａ？ターンを
、電子素子が搭載された凸面部分の有る電気回路基板へ
印刷する方法を提供するととである。The object of the present invention is to eliminate the above-mentioned drawbacks and to print solder paste A? using a printing plate with a simple configuration. The present invention provides a method for printing a turn onto an electrical circuit board having a convex portion on which electronic elements are mounted.
本発明のかかる目的は、電気回路基板上の凸面部分を回
避するために、電気回路基板の凸面部分にあたる箇所を
除去した複数枚の重畳された多層構成のメタルスクリー
ン版を用いて電子素子が搭載された凸面部分を有する電
気回路基板へ半田ペーストのパターンを印刷するという
凸面基板への印刷方法によって達成される。The object of the present invention is to avoid the convex portion of the electric circuit board by using a plurality of overlapping multi-layered metal screen plates from which the convex portion of the electric circuit board is removed, on which electronic elements are mounted. This is accomplished by a method of printing on convex substrates in which a pattern of solder paste is printed onto an electrical circuit board having a convex portion.
本発明の実施例を図面を参照して説明する。 Embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す印刷方法の説明図で、
第２図は第１図の部分断面図である。１はスキージ、２
は半田ペースト、３は枠、４はメタルスクリーンで枠３
に張られている。５は第１層印刷版、６は第２層印刷版
、７は第３層印刷版、で第１層印刷版５、第２層印刷版
６、第３層印刷版７にはそれぞれ所望の印刷パターンが
エツチングされ、各Ｉリーンの位置が調整されて、メタ
ルスクリーレ４上に多層構成で重畳されて形成されてい
る。８はキャリア治具、９は基準ピンでキャリア治具８
に設置されておル、基板１０を位置決めし、固定してい
る。基板１００表面には、電子素子１１が搭載されてお
ル、電子素子１１等電気回路の連絡される素子ランド１
２が有って、半田ペースト２が印刷される。１３は半田
ペースト２の量を調整するためのメッシェ部である。FIG. 1 is an explanatory diagram of a printing method showing an embodiment of the present invention.
FIG. 2 is a partial sectional view of FIG. 1. 1 is a squeegee, 2
is solder paste, 3 is frame, 4 is metal screen and frame 3
It is attached to. 5 is a first layer printing plate, 6 is a second layer printing plate, and 7 is a third layer printing plate, and the first layer printing plate 5, the second layer printing plate 6, and the third layer printing plate 7 are each coated with a desired coating. The printed pattern is etched, the position of each I-lean is adjusted, and the printed pattern is superimposed on the metal screen 4 in a multilayer configuration. 8 is a carrier jig, 9 is a reference pin and carrier jig 8
The board 10 is positioned and fixed in place. On the surface of the substrate 100, an electronic element 11 is mounted, and an element land 1 to which an electric circuit such as the electronic element 11 is connected.
2, and solder paste 2 is printed. 13 is a mesh portion for adjusting the amount of solder paste 2.
本発明の凸面基板への印刷方法は、印刷版の枠３を基板
１０へ上部から重ねて、キャリア治具８上の基板ｌＯへ
半田ペースト２を印刷することである。即ち、スキージ
１で半田ペースト２をかき、素子ランド１２へ半田ペー
スト２を供給する・。メツシュ部１３はその設置位置、
第何層目の印刷版に設けるか、または面積の大きさ、形
状で半田（−スト２の供給量を調整している。また、基
準ピン９、電子素子１１と多層構成の第１層、第２層。The method of printing on a convex substrate according to the present invention is to overlap the printing plate frame 3 onto the substrate 10 from above and print the solder paste 2 onto the substrate 10 on the carrier jig 8. That is, the solder paste 2 is scraped with a squeegee 1 and the solder paste 2 is supplied to the element land 12. The mesh part 13 has its installation position,
The supply amount of solder (-solder 2) is adjusted depending on which layer of the printing plate it is provided on, or the size and shape of the area. Second layer.
第３層の印刷版５，６．７における印刷パターンとは成
る程度のクリアランスを有しているので、印刷時のスキ
ージｌが基板１０へ接触するとき、押し付は圧力による
電子素子１１への破壊は起きない・スキージ１をメタル
スクリーン４上で摺動させるととで、充分な供給量の半
田ペースト２が素子ランド１２へ印刷される。Since the printing pattern on the third layer printing plates 5, 6.7 has a sufficient clearance, when the squeegee l contacts the substrate 10 during printing, the pressure is applied to the electronic element 11. No destruction occurs - By sliding the squeegee 1 on the metal screen 4, a sufficient amount of solder paste 2 is printed onto the element land 12.
本発明によれば、複数枚が重畳された多層構成のメタル
スクリーン印刷版を用いて、半田イーストを印刷するこ
とができ基板上の電子素子を保全したままで品質良好な
電子回路基板を大量に作製することができるなど、凸面
基板への印刷方法が提供される。According to the present invention, solder yeast can be printed using a metal screen printing plate with a multilayer structure in which multiple sheets are overlapped, and high quality electronic circuit boards can be produced in large quantities while preserving the electronic elements on the board. A method of printing onto a convex substrate, such as one that can be fabricated, is provided.
第１図は本発明の一実施例を示す印刷方法の説明図であ
る。第２図は第１図の部分断面図であるＯｌ・・・スキ
ージ、２・・・半田ペースト、３・・・枠、４・・・メ
タルスクリーン、５，６．７・・・印刷版、８・・・キ
ャリア治具、９・・・基準ピン、１０・・・基板、１１
・・・電子素子、１２・・・素子ランド、１３・・・メ
ツシュ部Ｏ
箪 １ 閉
箪２図FIG. 1 is an explanatory diagram of a printing method showing an embodiment of the present invention. Fig. 2 is a partial sectional view of Fig. 1. Ol... Squeegee, 2... Solder paste, 3... Frame, 4... Metal screen, 5, 6.7... Printing plate, 8... Carrier jig, 9... Reference pin, 10... Board, 11
...Electronic element, 12...Element land, 13...Mesh part O Cabinet 1 Closed cabinet 2 diagram
Claims (1)
数枚の重畳された印刷版を用いて行うことを特徴とする
凸面基板への印刷方法。A method of printing on a convex substrate, characterized by using a printing plate from which the shape of the convex portion on the substrate has been removed, that is, a plurality of superimposed printing plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59074544A JPH0785514B2 (en) | 1984-04-13 | 1984-04-13 | Printing method on convex substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59074544A JPH0785514B2 (en) | 1984-04-13 | 1984-04-13 | Printing method on convex substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60218898A true JPS60218898A (en) | 1985-11-01 |
| JPH0785514B2 JPH0785514B2 (en) | 1995-09-13 |
Family
ID=13550304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59074544A Expired - Fee Related JPH0785514B2 (en) | 1984-04-13 | 1984-04-13 | Printing method on convex substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0785514B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243402A (en) * | 1975-10-02 | 1977-04-05 | Matsushita Electric Ind Co Ltd | Automatic record player |
-
1984
- 1984-04-13 JP JP59074544A patent/JPH0785514B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243402A (en) * | 1975-10-02 | 1977-04-05 | Matsushita Electric Ind Co Ltd | Automatic record player |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0785514B2 (en) | 1995-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |