JPS6072298A - Method of repairing circuit patten - Google Patents
Method of repairing circuit pattenInfo
- Publication number
- JPS6072298A JPS6072298A JP17971183A JP17971183A JPS6072298A JP S6072298 A JPS6072298 A JP S6072298A JP 17971183 A JP17971183 A JP 17971183A JP 17971183 A JP17971183 A JP 17971183A JP S6072298 A JPS6072298 A JP S6072298A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- repair
- printed
- wiring pattern
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（ａｌ 発明の技術分野
本発明は、スクリーン印刷法によりパターンを形式する
過程において、スクリーンの目づまり等により発生した
パターンの欠り、断線等の修理を容易に行うに有効な修
理方法に関する。DETAILED DESCRIPTION OF THE INVENTION (al) Technical Field of the Invention The present invention provides a method for easily repairing defects in patterns, disconnections, etc. that occur due to clogging of screens, etc., in the process of forming patterns by screen printing. Concerning effective repair methods.
（ｂｌ 従来技術と問題点
従来、基板上に印刷した配線パターンの欠り、断線（以
下、単に断線と称す）を修理するには、パターンと同じ
材料を筆等を用いて、断線箇所に？ｔｌｉ充する方法が
採られていた。しかしながら、修理の対象となるパター
ンが微細なものになると、その修理作業にはかなりの熟
練が必要となり、しかも修正ミス等の事態も往々にして
生じていた。(bl Prior Art and Problems) Conventionally, in order to repair a chipped or broken wire (hereinafter simply referred to as a "broken wire") in a wiring pattern printed on a board, the same material as the pattern is applied to the broken wire using a brush or the like. However, when the patterns to be repaired became minute, considerable skill was required to perform the repair work, and mistakes were often made. .
（Ｃ） 発明の目的
本発明の目的は、上述した従来の欠点を取除くべく、断
線部分を容易に且つ正確に修理できる、配線パターンの
修理方法を提供するにある。(C) Object of the Invention An object of the present invention is to provide a wiring pattern repair method that can easily and accurately repair disconnected portions, in order to eliminate the above-mentioned conventional drawbacks.
（ｄｌ 発明の構成
上記目的を達成するため本発明においては、パターン印
刷を行う基板の有する摩擦係数よりも小さい摩擦係数を
有するシート部材を用い、このシート部材上に、修理を
行うべきパターンと同一幅のパターンを予め印刷してお
き、この印刷したパターンを、修理箇所に貼り付けるこ
とによって、パターンの修理を行うものである。以下実
施例を、用いて本発明を詳述する。(dl Structure of the Invention In order to achieve the above object, in the present invention, a sheet member having a coefficient of friction smaller than that of the substrate on which the pattern is printed is used, and a pattern identical to the pattern to be repaired is printed on the sheet member. The pattern is repaired by printing a width pattern in advance and pasting this printed pattern on the repaired area.The present invention will be described in detail below using examples.
（ｅｌ 発明の実施例
第１図乃至第４図は、スクリーン印刷法により厚膜パタ
ーン基板を生成する工程に、本発明を適用した場合の一
実施例を示す。厚膜パターンは、セラミック基板上にス
クリーンを介して導体ペーストを印刷し、該基板印刷面
を乾燥・焼成処理することによって生成される。(el) Embodiment of the Invention Figures 1 to 4 show an embodiment in which the present invention is applied to a process of producing a thick film pattern substrate by screen printing.The thick film pattern is formed on a ceramic substrate. It is produced by printing a conductive paste on a substrate through a screen, and drying and baking the printed surface of the substrate.
本実施例では、この導体ペーストをセラミック基板上に
印刷した時の、印刷パターンの修理方法を提示するもの
である。第１図は、印刷された導体パターン１に断線箇
所２が生した場合を示す。This example presents a method for repairing a printed pattern when this conductive paste is printed on a ceramic substrate. FIG. 1 shows a case where a disconnection point 2 occurs in a printed conductor pattern 1.
この断線箇所２を修理するため、第２図に示すシート部
材３を用いる。このシート部材３は、表面の摩擦係数（
密着力）が少なくともセラミック基板表面のそれより小
さい素材のものを用いる。実施例ではテフロンシートを
用いるものである。In order to repair this disconnection point 2, a sheet member 3 shown in FIG. 2 is used. This sheet member 3 has a surface friction coefficient (
A material whose adhesion strength (adhesion strength) is at least smaller than that of the ceramic substrate surface is used. In the embodiment, a Teflon sheet is used.
しかして、このシート部材３に修理用パターン４を印刷
する。このパターン４ば、スクリーン印刷で用いる印刷
機等により、修理を行うべき配線パターン１と同一幅の
パターンを印刷する。このパターン４も、導体ペースト
であることば云うまでもない。次に第３図に示す如く、
シート部利３に印刷した修理用パターン４を、乾燥処理
を行なった配線パターン１の断線部に貼り付ける。そし
て、この状態で、パターン１．４を再度乾燥する。Then, a repair pattern 4 is printed on this sheet member 3. This pattern 4 is printed with the same width as the wiring pattern 1 to be repaired using a printing machine or the like used for screen printing. Needless to say, this pattern 4 is also a conductive paste. Next, as shown in Figure 3,
A repair pattern 4 printed on a sheet part 3 is pasted on the disconnected part of the wiring pattern 1 which has been dried. Then, in this state, pattern 1.4 is dried again.
これにより、セラミック基板上に正しいパターン印刷が
成されたことになる。シート部材３は、パターン乾燥後
に剥す。上述した如く、このシート部材３は低摩擦係数
であるため、修理用パターン４が剥れることはない。第
５図上述した厚膜パターン基板の生成工程を示す図であ
る。This means that a correct pattern has been printed on the ceramic substrate. The sheet member 3 is peeled off after the pattern is dried. As described above, since the sheet member 3 has a low coefficient of friction, the repair pattern 4 will not peel off. FIG. 5 is a diagram showing the production process of the above-mentioned thick film pattern substrate.
以上のように修理を行った配線パターン１ （第４図）
は、通常の焼成処理が行なわれ、セラミック基板上に、
配線パターンが生成されることになる。Wiring pattern 1 repaired as above (Figure 4)
is subjected to a normal firing process, and is deposited on a ceramic substrate.
A wiring pattern will be generated.
（ｆ） 発明の詳細
な説明した通り本発明によれば、配線パターンの修理を
迅速かつ正確に行うことが可１１ヒとなり、実用的効果
大なる修理方法を提供することができ(f) As described in detail, according to the present invention, wiring patterns can be repaired quickly and accurately, and a repair method with great practical effects can be provided.
第１図乃至第４図は本発明の一実施例を示す図。
第５図は本発明を適用した膜厚バクーン生成法を示す図
である。図中１は配線パターン、２ば断線部、３はシー
ト部材、４は修理用パターンをそれぞれ示す。FIG. 1 to FIG. 4 are diagrams showing one embodiment of the present invention. FIG. 5 is a diagram illustrating a method for producing a film thickness barrier to which the present invention is applied. In the figure, 1 indicates a wiring pattern, 2 indicates a broken line, 3 indicates a sheet member, and 4 indicates a repair pattern.
Claims (1)
る工程における該配線パターンの断線箇所を修理する方
法であって、前記配線パターンの印刷される基板表面よ
り密着力の小さいシート部材に、前記断線箇所のあるパ
ターンと同一幅の修理用配線パターンを印刷し、該シー
ト部月上に印刷した修理用パターンを前記断線箇所のあ
るパターン上に貼り伺けて断線箇所の補修を行うように
したことを特徴とする配線パターン修理方法。A method for repairing a broken line in a wiring pattern in the process of forming wiring no-turns on a board by screen printing, wherein the broken line is fixed on a sheet member having a smaller adhesion than the surface of the board on which the wiring pattern is printed. A repair wiring pattern having the same width as a certain pattern is printed, and the repair pattern printed on the sheet part can be pasted onto the pattern where the broken wire is located to repair the broken wire. Characteristic wiring pattern repair method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17971183A JPS6072298A (en) | 1983-09-28 | 1983-09-28 | Method of repairing circuit patten |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17971183A JPS6072298A (en) | 1983-09-28 | 1983-09-28 | Method of repairing circuit patten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6072298A true JPS6072298A (en) | 1985-04-24 |
Family
ID=16070534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17971183A Pending JPS6072298A (en) | 1983-09-28 | 1983-09-28 | Method of repairing circuit patten |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072298A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02301723A (en) * | 1989-05-16 | 1990-12-13 | Matsushita Electric Ind Co Ltd | Defect correcting method for electrode and optical modulating element |
| JP2014232801A (en) * | 2013-05-29 | 2014-12-11 | 富士通株式会社 | Restoration member for circuit board, process of manufacturing circuit board, and process of manufacturing restoration member for circuit board |
-
1983
- 1983-09-28 JP JP17971183A patent/JPS6072298A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02301723A (en) * | 1989-05-16 | 1990-12-13 | Matsushita Electric Ind Co Ltd | Defect correcting method for electrode and optical modulating element |
| JP2014232801A (en) * | 2013-05-29 | 2014-12-11 | 富士通株式会社 | Restoration member for circuit board, process of manufacturing circuit board, and process of manufacturing restoration member for circuit board |
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