JPS6021386A - ポリシング用研摩剤供給装置 - Google Patents
ポリシング用研摩剤供給装置Info
- Publication number
- JPS6021386A JPS6021386A JP12724283A JP12724283A JPS6021386A JP S6021386 A JPS6021386 A JP S6021386A JP 12724283 A JP12724283 A JP 12724283A JP 12724283 A JP12724283 A JP 12724283A JP S6021386 A JPS6021386 A JP S6021386A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- caustic soda
- supplying
- supply
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- ing And Chemical Polishing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12724283A JPS6021386A (ja) | 1983-07-13 | 1983-07-13 | ポリシング用研摩剤供給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12724283A JPS6021386A (ja) | 1983-07-13 | 1983-07-13 | ポリシング用研摩剤供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021386A true JPS6021386A (ja) | 1985-02-02 |
| JPH057466B2 JPH057466B2 (enExample) | 1993-01-28 |
Family
ID=14955223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12724283A Granted JPS6021386A (ja) | 1983-07-13 | 1983-07-13 | ポリシング用研摩剤供給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021386A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100475015B1 (ko) * | 1997-11-10 | 2005-04-14 | 삼성전자주식회사 | 슬러리공급장치를포함하는반도체장치제조용화학적기계적연마설비 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539902A (en) * | 1978-08-09 | 1980-03-21 | Hitachi Denshi Ltd | Integrating system of digital differential analyzer |
| JPS5654390A (en) * | 1979-10-11 | 1981-05-14 | Tokyo Shibaura Electric Co | Feedwater nozzle |
-
1983
- 1983-07-13 JP JP12724283A patent/JPS6021386A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539902A (en) * | 1978-08-09 | 1980-03-21 | Hitachi Denshi Ltd | Integrating system of digital differential analyzer |
| JPS5654390A (en) * | 1979-10-11 | 1981-05-14 | Tokyo Shibaura Electric Co | Feedwater nozzle |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100475015B1 (ko) * | 1997-11-10 | 2005-04-14 | 삼성전자주식회사 | 슬러리공급장치를포함하는반도체장치제조용화학적기계적연마설비 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH057466B2 (enExample) | 1993-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6358125B2 (en) | Polishing liquid supply apparatus | |
| KR100837673B1 (ko) | 약액 공급 장치 및 슬러리의 조합 방법 | |
| TW512071B (en) | Method and apparatus for blending process materials | |
| US6338671B1 (en) | Apparatus for supplying polishing liquid | |
| JP4698784B2 (ja) | 液体混合物を製造する方法及び装置 | |
| JP2005533639A (ja) | プロセス材料を配合するための方法および装置 | |
| JP2002513178A (ja) | スラリー調合における伝導度フィードバック制御システム | |
| US20060045816A1 (en) | Apparatus and method for mixing and supplying chemicals | |
| WO1999029505A1 (en) | Polishing solution feeder | |
| KR20020027279A (ko) | 폴리싱 장치로 슬러리를 공급하는 방법 | |
| KR20030061312A (ko) | 씨엠피 연마장치에 있어서의 연마제 조합장치 및 조합방법 | |
| JPS6021386A (ja) | ポリシング用研摩剤供給装置 | |
| CN210819020U (zh) | 一种抛光液回收装置 | |
| JP4004795B2 (ja) | 研磨用流体の供給装置 | |
| JP2002178261A (ja) | 砥液供給装置及び砥液供給装置への添加剤補充方法及び研磨装置 | |
| JPH02257627A (ja) | 半導体ウエーハの研磨方法及び装置 | |
| KR200261175Y1 (ko) | 반도체웨이퍼세정용약액공급장치 | |
| JPH0957609A (ja) | 化学的機械研磨のための研磨材液供給装置 | |
| WO2004113023A1 (ja) | 薬液供給装置 | |
| KR100723586B1 (ko) | 약액 공급 장치 | |
| CN117381670A (zh) | 研磨液供给组件、装置、方法及化学机械抛光系统 | |
| JP3801325B2 (ja) | 研磨装置及び半導体ウエハの研磨方法 | |
| KR20030061311A (ko) | 씨엠피 연마장치에 있어서의 연마제 조합장치 및 조합방법 | |
| KR20040061106A (ko) | 슬러리 유량 제어 장치 및 방법 | |
| JP2007234969A (ja) | Cmp研磨装置における研磨剤調合装置及び調合方法。 |