CN210819020U - 一种抛光液回收装置 - Google Patents
一种抛光液回收装置 Download PDFInfo
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- CN210819020U CN210819020U CN201921459652.6U CN201921459652U CN210819020U CN 210819020 U CN210819020 U CN 210819020U CN 201921459652 U CN201921459652 U CN 201921459652U CN 210819020 U CN210819020 U CN 210819020U
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- rough polishing
- barrel
- polishing solution
- solution
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- 238000005498 polishing Methods 0.000 title claims abstract description 387
- 238000011084 recovery Methods 0.000 title claims abstract description 71
- 239000000243 solution Substances 0.000 claims abstract description 201
- 239000007788 liquid Substances 0.000 claims abstract description 122
- 238000002156 mixing Methods 0.000 claims abstract description 93
- 239000011550 stock solution Substances 0.000 claims abstract description 77
- 238000012546 transfer Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 47
- 238000004064 recycling Methods 0.000 claims description 14
- 239000004094 surface-active agent Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 27
- 229910052710 silicon Inorganic materials 0.000 abstract description 27
- 239000010703 silicon Substances 0.000 abstract description 27
- 238000013461 design Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 19
- 239000002245 particle Substances 0.000 description 18
- 239000002699 waste material Substances 0.000 description 16
- 238000001914 filtration Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000007517 polishing process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- -1 hydroxide ions Chemical class 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910020489 SiO3 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 235000015073 liquid stocks Nutrition 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921459652.6U CN210819020U (zh) | 2019-09-04 | 2019-09-04 | 一种抛光液回收装置 |
Applications Claiming Priority (1)
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CN201921459652.6U CN210819020U (zh) | 2019-09-04 | 2019-09-04 | 一种抛光液回收装置 |
Publications (1)
Publication Number | Publication Date |
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CN210819020U true CN210819020U (zh) | 2020-06-23 |
Family
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Family Applications (1)
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CN201921459652.6U Active CN210819020U (zh) | 2019-09-04 | 2019-09-04 | 一种抛光液回收装置 |
Country Status (1)
Country | Link |
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CN (1) | CN210819020U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110509173A (zh) * | 2019-09-04 | 2019-11-29 | 天津中环领先材料技术有限公司 | 一种抛光液回收装置及其控制方法 |
CN114193329A (zh) * | 2021-12-09 | 2022-03-18 | 中环领先半导体材料有限公司 | 一种磨片在线回收的浆液利用方法 |
CN116276663A (zh) * | 2023-02-03 | 2023-06-23 | 中环领先半导体材料有限公司 | 外接式精抛液交叉回收装置 |
-
2019
- 2019-09-04 CN CN201921459652.6U patent/CN210819020U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110509173A (zh) * | 2019-09-04 | 2019-11-29 | 天津中环领先材料技术有限公司 | 一种抛光液回收装置及其控制方法 |
CN114193329A (zh) * | 2021-12-09 | 2022-03-18 | 中环领先半导体材料有限公司 | 一种磨片在线回收的浆液利用方法 |
CN116276663A (zh) * | 2023-02-03 | 2023-06-23 | 中环领先半导体材料有限公司 | 外接式精抛液交叉回收装置 |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20220512 Address after: 300384 Tianjin Binhai New Area Huayuan Industrial Park (outside the ring) Hai Tai Road 12 Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 300384 Tianjin Binhai New Area Huayuan Industrial Park (outside the ring) Hai Tai Road 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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CP03 | Change of name, title or address |