JPS60211067A - Film forming apparatus - Google Patents

Abstract

PURPOSE:To prevent a base plate from being overheated with radiation heat from a crucible by putting a heat insulator provided with holes for passing metallic vapor on the crucible as a vapor depositing source in case of forming a vapor deposited film of metal on the surface of base plate by means of vapor deposition. CONSTITUTION:A base plate 13 to be vapor deposited with metal is put in vacuum vessel 17 and a crucible 1 incorporated with a melt 2 of metal to be vapor deposited as a vapor depositing source is arranged thereunder. The metallic vapor discharged from many small holes 3 of upper surface of the crucible 1 is ionized with grids 8 and a heating electrode 12 and accelerated to form a metallic film 14 on the surface of base plate 13. In this case, cooling is necessary because the base plate 13 is overheated with the radiation heat from the upper face of crucible 1. The radiation heat to the base plate 13 is decreased without interrupting the passage of the metallic vapor and the base plate 13 can be prevented from overheating without cooling it by providing a heat insulator 21 having a rectangular opening parts 22 to the upper face of crucible 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to thermal shutoff of a vapor deposition apparatus for vapor depositing emitted metal vapor onto a substrate.

[Prior art]

FIG. 1 shows a crucible used in a conventional vapor deposition apparatus. In the figure, (1) crucible, (2) metal, 13)
is a plurality of small holes, (4) is a metal vapor, (61 filaments, (6) is a power source, (7) is a power source, (8) is a grid,
(9) is a filament), 1101 is a power supply, (III is a power supply%, f12' is an accelerating electrode, (+31 is a substrate, a4 is a deposited film, Q51 is a power supply, Q61 is a shield plate, 0711
/i It is a vacuum container.

Next, the operation will be explained. In Figure 1, filament N5
1#: is heated by the power source (6) and is bombarded by electrons due to the voltage applied by the power source (7).
1) is heated. The metal (2) in the crucible evaporates and is injected into the vacuum through the small hole (3).The injected metal vapor (4) is collided with electrons by the filament (9), the power source 1101, and the grid (8). The metal vapor (4) is accelerated by the accelerating electrode and power source Q61rc, and impinges on the substrate t13 to form a vapor deposited film 04. At this time,
The crucible +11 becomes hot and radiant heat is released to the surroundings.

For this reason, heat shield plates 1161 t m that reflect radiant heat are placed on the outer periphery of the crucible +11 and on the bottom, and the L part is shared with the heat shield plate of the accelerating electrode +121 i. However, since the accelerating electrode 1121 is located away from the crucible (1), a large opening is provided for the metal vapor (4) to spread through. Therefore, the radiant heat from the injection surface of the crucible (1) passes through the opening and reaches the substrate 0Arc, heating it, so it is necessary to cool the substrate 0Arc.

[Embodiments of the invention]

In order to eliminate the above-mentioned drawbacks, the present invention
An insulating material with a long rectangular hole as shown in Figure 3 is cut on the top surface so that the metal vapor 14 ejected from the small hole (3) is not obstructed near the surface where the radiant heat is ejected directly to the substrate. This minimizes the thermal effect on the board by keeping it out of reach.

In FIG. 2, ＠ is a heat insulating material, and ＠ is a long rectangular hole provided with heat insulating material allVC. Others are the same as before.

The metal vapor ejected from the small hole 13) of the crucible flll passes through the small hole @, but the area of this hole is small and most of the radiant heat from the crucible 11+ is shielded.

FIG. 4 shows another embodiment, in which the openings of the heat insulating material ribs are formed by a plurality of conical holes (c) arranged in a staggered pattern and expanding toward the L plane. As a result, the distance 1w& between the small holes of the crucible can be increased, making drilling easier. Furthermore, cracks due to thermal stress during vapor deposition are also reduced. On the right, the hole @ may be a cylindrical hole instead of a conical one.

〔Effect of the invention〕

According to this invention, since most of the radiant heat from the crucible is absorbed by the heat insulating material, very little heat reaches the substrate, so that the influence of heat on the substrate can be reduced.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing a conventional thin film forming apparatus, FIG. 2 is a block diagram showing an embodiment of the present invention, and FIG. 3 is a perspective view showing the main parts of FIG. In the figure, (l) crucible, 021 is an accelerating electrode, (1
3 is the substrate, (c) is the heat insulating material, and @hole. Note that the same reference numerals in the valley diagram indicate the same or equivalent parts. Agent Large increase rate Figure 1 2! Figure 2 Figure 3 Procedural amendment (method) 2. Name of the invention Thin film forming device 3. Name of the person making the amendment (601) Hitoshi Katayama, Representative of Mitsubishi Electric Corporation 8 Department Mitsubishi Electric Corporation 6. Amendment Target (1) Contents of amendment to the “Brief Description of Drawings” section of the specification (1) Change “This is a perspective view” on page 4, line 18 of the specification.
FIG. 4 is a perspective view showing another embodiment of the present invention. ” he corrected. that's all

Claims (1)

[Claims] 11+ Melting metal in a crucible at high temperature in a vacuum, injecting the vapor of the molten metal in the crucible into the vacuum through a plurality of small holes to ionize the ionized metal vapor. Further, in the case where a thin film is formed on the substrate by colliding with the substrate with further acceleration, the upper surface of the crucible is covered with a heat insulating material having an opening, and the upper surface of the small hole is communicated with the opening of the heat insulating material. A thin film forming apparatus characterized in that the thin film forming apparatus is arranged in the following manner. (2) Claim 1, characterized in that the opening of the heat insulating material is rectangular and has a plurality of crucible small holes arranged in a spiral manner.
Thin film forming apparatus as described in . 131. Claim 1, characterized in that the openings of the heat insulating material are arranged in a staggered manner. ! The thin film forming apparatus described in J.