JPS60183721A - Thin film evapolating apparatus - Google Patents

Abstract

PURPOSE:To reduce heat affecting the substrate, by providing with heat shielding plates each having an opening formed, near a plane through which an injecting hole of the crucible is formed. CONSTITUTION:Two heat-shielding plates 21 consisting of heat insulating material with thermal stability are arranged a little above a plane through which an injecting hole 3 of the crucible is formed, and each openings 22 are placed, for example, on a conical outer surface which has an apex angle of 30 deg. and which has the larger diameters the further in the opposite direction aggainst the crucible 1. Metal vapor is jetted from the crucible 1 in order to form a thin film on the substrate 13. At this time, owing to the small area of the openings 22, heat radiating from the crucible 1 to the substrate 13 is almost intercepted by the heat shielding plates 21 and therefore a little amount of heat arrives at the substrate. Accordingly, the heat affection is reduced and a particular device such as a substrate cooler is not required.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a heat shield for a thin film deposition apparatus that deposits metal vapor onto a substrate.

[Prior art]

A conventional thin film deposition apparatus is shown in FIG. In the figure, reference numeral 1 denotes a crucible containing metal 2, which is a vapor deposition substance to be deposited on a substrate 13, 3 an injection hole formed on the upper surface of the crucible 1, and 4 a metal 2, which is an evaporation material to be evaporated onto a substrate 13, which is injected from the injection hole 3 of the crucible 1. 5 is a filament that heats the crucible 1; 6 is an AC power source; 7 is a DC power source; 8 is a grid; 9 is an ionizing filament that emits thermoelectrons to ionize the metal vapor 4; 10 is an AC power source; A power source, 11 is a DC power source, 12 is an accelerating electrode for accelerating the ionized metal vapor, 14
15 is a DC power supply; 16 is a heat shield plate for shielding radiant heat from the crucible 1; and 17 is a direct-air container maintained at a predetermined degree of vacuum.

Next, the operation will be explained.

In FIG. 1, a filament 5 is heated by a power source 6, and a voltage applied by a power source 7 irradiates the crucible 1 with electrons, and the crucible 1 is heated by being bombarded by the electrons. As a result, the metal 2 in the crucible j evaporates, and the gold 1.1s Hf and air are irradiated into the noble air from the injection hole 3. The ionized filament 9. Power source 10. Grid 3 (generated by!; C) is ionized by the collision of electrons, and the ionized metal vapor 4 is accelerated by the accelerating electrode 12 and the power source 15 and impinges on the substrate 13. I will make 14 thin films.

By the way, in this thin film deposition apparatus, ζ is -J-, and when the metal vapor 4 is generated, the above-mentioned Ruppo 1 reaches a considerably high temperature, so that radiant heat is released from the surface of the Ruppo 1 to the surroundings. It will be done. Therefore, in this conventional device, the external force on the side and bottom surfaces of the crucible 1 is provided with a rail 1' plate 16 that reflects the radiant heat, and the accelerating electrode 12 is placed on the top surface. It is shared by the shield plate. However, since the accelerating electrode I2 is located quite far away from the crucible 1,
passes through the electrode 12a++, and a large open LJ portion is formed in the acceleration electrode 12 for this purpose. Therefore, the radiant heat from the surface of the crucible on the injection hole 3 side passes through the open LI section, reaches the substrate 13, and heats the substrate 13. ;It becomes every 1t. Therefore, in the conventional thin film type mounting VC, it is necessary to cool the substrate 13 in order to prevent the substrate from heating up to 617L degrees.

[Summary of the invention]

The present invention has been made in order to eliminate the drawbacks of the conventional products as described above, and an opening "1" is formed in the vicinity of the surface of the crucible where the injection hole is formed and in a portion corresponding to the injection hole.
By installing the shield plate, the radiant heat from the crucible does not reach the substrate.
The purpose of the present invention is to provide a thin film evaporation device that can reduce the effects of ib.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 shows an embodiment of the invention. In 1, the first
The same numerals as 1 indicate the same or equivalent parts, and 21 indicates the heat resistance. ; These are two heat shield plates made of material, which are disposed slightly above the surface of the crucible 1 on which the injection holes 3 are formed, and are at the same potential as the crucible 1. An opening 22 is formed in a portion of each heat shield plate 2 that corresponds to the injection hole 3 of the crucible 1.
Between the crucibles 1 and 22, the crucible 22 is located on the outer surface of a conical shape with an apex angle of 30°, the diameter of which increases toward the opposite side from the crucible 1.

Next, the effects will be explained.

In order to form a thin film on the substrate 13 using this embodiment, metal vapor is ejected from the crucible 1 in the same manner as in the conventional method.
Since the surface position of 2 is small, the gold 1jjS %% and air ejected from the injection hole 3 of crucible 1 pass through the opening 22, but
Most of the radiant heat to the substrate 13 is blocked by the heat shield plate 21 of the iron, and the amount of heat reaching the substrate 13 is significantly less compared to conventional ones, so the influence of heat is small, and the substrate cooling device No special equipment is required.

〔Effect of the invention〕

According to the thin film deposition apparatus according to the present invention as described below,
Since a heat shield plate having an opening in a portion corresponding to the injection hole is disposed near the surface of the crucible where the injection hole is formed,
The amount of radiant heat from the crucible reaching the substrate can be greatly reduced, the adverse effects of the radiant heat on the substrate can be prevented, and a substrate cooling device can be made unnecessary.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a conventional thin film deposition apparatus, and FIG. 2 is a schematic diagram of a conventional thin film deposition apparatus. 1. Crucible, 2. Vapor deposition. Substance, 3... injection hole,
4... Steam, 13... Substrate, 14...'AV film,
21... Heat shield plate, 22... Open 1]. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Masu Oiwa 1. j(: Figure 1 Figure 2

Claims (1)

[Scope of Claims] (11) A thin film deposition apparatus comprising a crucible for spouting vapor of a deposition material to be deposited onto a substrate, and for depositing a thin film by colliding the vapor from the crucible with the substrate, wherein the injection hole of the crucible is A thin film deposition apparatus characterized in that a heat shield plate having an opening in a portion corresponding to the injection hole of the crucible is disposed near the formed surface. (2) The heat shield plate has a plurality of layers. There is "ζ",
Claim 1, wherein the opening of each heat shield plate is located on the outer surface of a cone with an apex angle of 30°, the diameter of which increases toward the side opposite to the crucible. Thin film deposition equipment.