JPS60210449A - アデイテイブめつき用積層板の製造方法 - Google Patents
アデイテイブめつき用積層板の製造方法Info
- Publication number
- JPS60210449A JPS60210449A JP59066676A JP6667684A JPS60210449A JP S60210449 A JPS60210449 A JP S60210449A JP 59066676 A JP59066676 A JP 59066676A JP 6667684 A JP6667684 A JP 6667684A JP S60210449 A JPS60210449 A JP S60210449A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- plating
- laminate
- additive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 41
- 239000000654 additive Substances 0.000 title claims description 24
- 230000000996 additive effect Effects 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 229920000459 Nitrile rubber Polymers 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 150000002484 inorganic compounds Chemical class 0.000 claims description 7
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 239000002313 adhesive film Substances 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- 150000003904 phospholipids Chemical class 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 2
- 229920003987 resole Polymers 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000012790 adhesive layer Substances 0.000 description 10
- 239000005011 phenolic resin Substances 0.000 description 9
- 239000011888 foil Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- -1 methyl ether ketone Chemical class 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 239000011134 resol-type phenolic resin Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229940067606 lecithin Drugs 0.000 description 1
- 235000010445 lecithin Nutrition 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59066676A JPS60210449A (ja) | 1984-04-05 | 1984-04-05 | アデイテイブめつき用積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59066676A JPS60210449A (ja) | 1984-04-05 | 1984-04-05 | アデイテイブめつき用積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60210449A true JPS60210449A (ja) | 1985-10-22 |
| JPH0361588B2 JPH0361588B2 (enrdf_load_stackoverflow) | 1991-09-20 |
Family
ID=13322759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59066676A Granted JPS60210449A (ja) | 1984-04-05 | 1984-04-05 | アデイテイブめつき用積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60210449A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151990A (ja) * | 1984-08-22 | 1986-03-14 | 株式会社日立製作所 | 表面を金属化した絶縁基板の製造方法 |
| JPH01154590A (ja) * | 1987-12-11 | 1989-06-16 | Sumitomo Bakelite Co Ltd | 回路形成法 |
-
1984
- 1984-04-05 JP JP59066676A patent/JPS60210449A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151990A (ja) * | 1984-08-22 | 1986-03-14 | 株式会社日立製作所 | 表面を金属化した絶縁基板の製造方法 |
| JPH01154590A (ja) * | 1987-12-11 | 1989-06-16 | Sumitomo Bakelite Co Ltd | 回路形成法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0361588B2 (enrdf_load_stackoverflow) | 1991-09-20 |
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