JPS60202166A - 導電性塗料 - Google Patents
導電性塗料Info
- Publication number
- JPS60202166A JPS60202166A JP5625384A JP5625384A JPS60202166A JP S60202166 A JPS60202166 A JP S60202166A JP 5625384 A JP5625384 A JP 5625384A JP 5625384 A JP5625384 A JP 5625384A JP S60202166 A JPS60202166 A JP S60202166A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- copper
- conductive paint
- parts
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003973 paint Substances 0.000 title claims abstract description 34
- 239000000843 powder Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 10
- 239000011230 binding agent Substances 0.000 claims abstract description 8
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 7
- -1 alkylamine salt Chemical class 0.000 claims abstract description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 238000004062 sedimentation Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001556 precipitation Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 229920001225 polyester resin Polymers 0.000 abstract description 2
- 239000004645 polyester resin Substances 0.000 abstract description 2
- 239000000375 suspending agent Substances 0.000 abstract 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5625384A JPS60202166A (ja) | 1984-03-26 | 1984-03-26 | 導電性塗料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5625384A JPS60202166A (ja) | 1984-03-26 | 1984-03-26 | 導電性塗料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60202166A true JPS60202166A (ja) | 1985-10-12 |
| JPH0465872B2 JPH0465872B2 (enrdf_load_stackoverflow) | 1992-10-21 |
Family
ID=13021915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5625384A Granted JPS60202166A (ja) | 1984-03-26 | 1984-03-26 | 導電性塗料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60202166A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01118580A (ja) * | 1987-10-30 | 1989-05-11 | Ibiden Co Ltd | 樹脂系導電ペースト |
| CN103871678A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种屏蔽性能优良的极细同轴电缆 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7557032B2 (en) | 2005-09-01 | 2009-07-07 | Micron Technology, Inc. | Silicided recessed silicon |
-
1984
- 1984-03-26 JP JP5625384A patent/JPS60202166A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01118580A (ja) * | 1987-10-30 | 1989-05-11 | Ibiden Co Ltd | 樹脂系導電ペースト |
| CN103871678A (zh) * | 2014-03-13 | 2014-06-18 | 苏州科茂电子材料科技有限公司 | 一种屏蔽性能优良的极细同轴电缆 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465872B2 (enrdf_load_stackoverflow) | 1992-10-21 |
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