JPS60195956A - Semiconductor cooler - Google Patents

Abstract

PURPOSE:To enhance the productivity and the economy rigidly against an external force by providing heat sink fines on the upper peripheral surfaces of both cylinders, containing coolant, and providing an insulating material for electrically insulating the top of the cylinder and the electrode terminal between the both fins. CONSTITUTION:A cylinder 11 which forms an internal boiling fin 12 is formed of two large and small cylinders 13, 14 of different diameters communicating with each other, integrally coupled with both sides of a semiconductor element 15, and an electrode terminal 16 connected with a semiconductor element 15 is bonded. A heat sink fin 17 is provided on a small cylinder 14, a steam condenser 18 for forming space therein is formed, a coolant boiling unit 19 is provided in the large cylinder 13, and coolant 20 is contained. An insulating material 21 such as ceramic forms part of the cylinder 11, formed between the fins 17, thereby electrically insulating between the top of the cylinder 11 and hence the cylinder 14 and the terminal 16.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor cooling device suitable for implementation in a semiconductor element in an electronic device.

[Prior art]

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Semiconductor elements such as stars not only tend to change their characteristics depending on temperature, but also have the risk of being destroyed by local heat generation if they are located in a place with poor heat dissipation environment.

Therefore, various devices have been proposed to cool the semiconductor elements. Among them, a heat dissipation plate made of a heat conductor is attached to the semiconductor element and the energy is dissipated into the air.1.
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In recent years, devices have been put into practical use in which a refrigerant such as Freon is sealed in a closed container and semiconductor elements are cooled by utilizing the transfer of latent heat due to boiling and condensation of the refrigerant. This type of device is constructed as shown in FIG. Internal boiling fins 4 having internal boiling fins 3 are incorporated therein, and the vapor condensing section 5 is air-cooled to condense the refrigerant vapor generated by the heat generation of the semiconductor element 2.

Further, an electrode terminal 1 connected to the semiconductor element 2 is provided in the refrigerant boiling part.

In the semiconductor cooling device configured in this manner, the interval between the internal boiling fins 4 that sandwich the semiconductor element 2 must be set to a predetermined dimension as a measure to prevent the accumulation of dust generated during wind cooling. As a safety measure against the high voltage applied to the internal boiling fins 4, it is necessary to set the spacing to a size with a high degree of safety.

However, if this interval is increased, the steam condensing section 5 becomes smaller and the condensing heat resistance becomes significantly higher.

Therefore, it is necessary to electrically insulate the vapor condensing section 5 at the upper part of the internal boiling fin 4 and the refrigerant boiling section 6 at the lower part.
As shown in FIG. 2, a cooling device has also been proposed in which an insulating tube 8 made of ceramic or the like is joined by brazing between a vapor condensing section 5 and a refrigerant boiling section 6.

However, in this case, there are problems with strength, such as damage to the insulating tube due to external forces such as vibrations, and moreover, there are disadvantages in that productivity is poor and costs are high.

[Summary of the invention]

The present invention was developed in view of the above circumstances, and has an extremely simple structure in which an insulating material is provided between the fins provided on the cylinder on both sides of the semiconductor element to electrically insulate the upper part of the cylinder and the electrode terminal. The object of the present invention is to provide a semiconductor cooling device that is strong, highly productive, and economically manufacturable.

Hereinafter, the configuration and the like will be explained in detail with reference to embodiments shown in the drawings.

[Embodiments of the invention]

FIG. 3 is a sectional view showing an embodiment of the semiconductor cooling device according to the present invention. In the same figure, 11 is the internal boiling fin 1
The cylindrical body constituting the semiconductor element 15 is composed of two large and small cylinders 13 and 14, each of which communicates with one another and has different cylinder diameters, and is integrally connected to both sides of the semiconductor element 15 (only one is shown).

An electrode terminal 16 connected to the semiconductor element 15 is bonded to this cylinder 11 by brazing or an epoxy adhesive. A radiation fin 11 is provided on the upper surface of the small cylinder 14, that is, the cylinder body 11 of the cylinders 13 and 14, and a steam condensing section 18 forming a space is provided inside. A refrigerant boiling section 19 is provided inside the large cylinder 13, and a refrigerant 20 that boils at a temperature lower than the allowable upper limit temperature of the semiconductor element 15 is contained therein.

Reference numeral 21 denotes an insulating material such as ceramic, which constitutes a part of the cylinder 11 and is provided between the heat fins 17 (only one of which is shown).
4 and the electrode terminal 16 can be electrically insulated.

In the semiconductor cooling device configured in this manner, since the small tubes 14 and the electrode terminals 16 are electrically insulated, there is no need to maintain a large distance between the two adjacent small tubes 14.

In addition, since the insulating material 20 constitutes a part of the cylindrical body 11 and is provided between the two heat fins 17, the structure is not designed to support the upper part of the cylindrical body as in the past, but can withstand external forces exerted by vibration. have sex.

〔Effect of the invention〕

As explained above, according to the present invention, heat dissipation fins are provided on the upper circumferential surfaces of both cylindrical bodies, a refrigerant is contained therein, and an insulating material is provided between both fins to electrically insulate the upper part of the cylindrical body and the electrode terminal. Therefore, it is possible to obtain a cooling device that is strong against external forces such as those caused by vibrations, has excellent productivity, and can be manufactured economically.

[Brief explanation of drawings]

Figures 1 (a) and (b) are a cutaway front view and a cutaway side view of a conventional semiconductor cooling device, and Figures 2 (, ) and (b) are
8 is a cutaway side view 1 and a cutaway front view showing a semiconductor cooling device, and FIG. 3 is a partially cutaway side view showing an embodiment of the semiconductor cooling device according to the present invention. 11... Cylindrical body, 15... Semiconductor element, 16...
... Electrode terminal, 17... Heat dissipation fin/, 20...
Refrigerant, 21...Insulating material. Agent Masuo Oiwa Procedural Amendment (Voluntary) 1. Indication of the case: Japanese Patent Application No. 59-51815 2, title of the invention: Semiconductor cooling device 3, person making the amendment Relationship to the case Patent applicant address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name:
(601) Mitsubishi Electric Corporation Representative: Hitoshi Katayama 4, Agent address: 2-2-3-6, Marunouchi 2-chome, Chiyoda-ku, Tokyo Contents of amendment (1) The scope of claims in the specification is amended as shown in the attached sheet. do. (2) "Insulating material 20" on page 5, line 9 of the same book was replaced with "insulating material 2".
1”. Attachment ``A cylindrical body having electrode terminals that are integrally bonded to both sides of a semiconductor element and connected to the semiconductor element is provided, and radiation fins are provided on the upper peripheral surface of both cylindrical bodies, and the permissible upper limit temperature of the semiconductor element is Built-in refrigerant that boils at a lower temperature,
A semiconductor cooling device characterized in that an insulating material is provided between the two fins to electrically insulate the upper part of the cylinder and the electrode terminal. ”
that's all

Claims (1)

[Claims] This semiconductor element is integrally connected to the call side of the semiconductor element and has six electrode terminals! A cylindrical body is provided with a heat dissipating fin on the upper part of the cylindrical body, and a heat dissipation fin is provided on the upper part of the cylindrical body. It has a built-in refrigerant that boils at a temperature lower than the upper limit temperature, and has an electrode terminal on the top of the cylinder between the two fins! A semiconductor cooling device characterized by being provided with an electrically insulating material.