JP3656607B2 - Boiling cooler - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a boiling cooling device that cools a heating element such as a semiconductor element by latent heat transfer caused by boiling and condensation of a refrigerant.
[0002]
[Prior art]
As a prior art, there is a boiling cooling device shown in FIG. The boiling cooling device 100 includes a refrigerant tank 110 that stores refrigerant therein, and a heat radiating core 120 that is assembled to the refrigerant tank 110, and a heating element on a heat receiving surface 111 that forms one wall surface of the refrigerant tank 110. (Semiconductor element etc.) 10 is attached.
[0003]
The heat radiating core part 120 includes a set of headers 121 assembled substantially upright with respect to the heat radiating surface 112 facing the heat receiving surface 111 of the refrigerant tank 110, a plurality of heat radiating tubes 122 communicating between the headers 121, It is comprised from the radiation fin 123 for increasing a thermal radiation area.
[0004]
The refrigerant stored in the refrigerant tank 110 receives the heat of the heating element 10 to evaporate, rises and flows from the refrigerant tank 110 through the one header 121 into the heat radiating tube 122 and flows through the heat radiating tube 122. At this time, for example, the cooling air supplied from the lower side in the figure is received, dissipates heat to the outside air, condenses, becomes a condensate, and returns to the refrigerant tank 110 from the other header 121. Thereby, the heat generated from the heating element 10 is transmitted to the refrigerant and is dissipated to the outside air by the heat radiating core portion 120, thereby cooling the heating element 10.
[0005]
[Problems to be solved by the invention]
However, when it is desired to cool the separate heating elements 10 and 11 in the boiling cooling device 100, another heating element 11 is attached to the heat radiating surface 112 side as shown in FIG. In this case, since the heating element 11 attached to the heat radiating surface 112 side is directly exposed to the cooling air, there is a risk of a short circuit due to dust or dust contained in the cooling air.
[0006]
On the other hand, as shown in FIG. 8, the present inventor in Japanese Patent Application No. 2001-231299 is provided with two refrigerant tanks 110 in one heat-dissipating core part 120, so that the separate heating elements 10 and 11 can be cooled. Although the cooling device 100 has been proposed, in this boiling cooling device 100, a shape holding jig or the like is used in order to obtain an assembly angle (squareness) of the two refrigerant tanks 110 with respect to the heat radiating core 120 during brazing. And the manufacturing man-hours required.
[0007]
In view of the above problems, an object of the present invention is to provide a boiling cooling device that is easy to manufacture and that can cool separate heating elements.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention employs the following technical means.
[0009]
In the first aspect of the present invention, the heating element (10) is attached to the lower side of the substantially upright surface (111), the refrigerant tank (110) for storing the refrigerant therein, and the one surface (111). And a heat dissipating part (120) which condenses and liquefies the refrigerant evaporated by the heating element (10) and returns it to the refrigerant tank (110). (101) the having two, two boiling cooler (101, 102), each other surface (112) is disposed so as to face each other and each of the heat radiating portion (120), the refrigerant vessel (110) are arranged so as to be lined up in a substantially upright direction.
[0010]
Thus, by combining two boiling coolers (101) composed of the refrigerant tank (110) and the heat radiating section (120), the boiling cooling device (100) that enables cooling of the separate heating elements (10, 11). ) Can be easily formed. At this time, by supplying cooling air between the two refrigerant tanks (110), the cooling air is not directly exposed to the heating elements (10, 11), and there is no fear of causing a wiring short circuit.
[0011]
In the second aspect of the present invention, a partition plate (130) that diagonally connects the end portions (124, 124) of the heat dissipating part (120) is provided between the heat dissipating parts (120). It is characterized in that the cooling air is supplied to each heat radiating section (120) by means (141, 142).
[0012]
As a result, the cooling air passing through one of the heat radiating portions (120) can be prevented from flowing into the other heat radiating portion (120), so that it is affected by the cooling air whose temperature has risen by the counterpart heat radiating portion (120). The cooling performance can be improved.
[0013]
In addition, the code | symbol in the bracket | parenthesis of each said means shows a corresponding relationship with the specific means of embodiment description mentioned later.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
1st Embodiment in the boiling cooling device 100 of this invention is shown in FIG. The boiling cooling device 100 is configured to cool the heating elements 10 and 11 such as semiconductor elements provided separately, and includes two boiling coolers 101 and 102. Each member described below is made of aluminum or an aluminum alloy, and is brazed integrally with a brazing material applied to a portion joined between the members.
[0015]
Both the boiling coolers 101 and 102 include a refrigerant tank 110 and a heat radiating core 120. In addition, since the basic structure of both the boiling coolers 101 and 102 is the same, the following description will be made with the boiling cooler 101 side as a representative.
[0016]
First, the refrigerant tank 110 is a vertically long, flat box-shaped refrigerant container, and the heating element 10 is fixed to the lower side of the heat receiving surface 111, which is a substantially upright surface, by fastening a bolt or the like (not shown). Here, in order to reduce the contact thermal resistance between the heating element 10 and the heat receiving surface 111, thermal conductive grease may be interposed therebetween.
[0017]
A predetermined amount of refrigerant is sealed in the internal space of the refrigerant tank 110. As the refrigerant, water, alcohol, fluorocarbon, chlorofluorocarbon, or the like is used.
[0018]
The heat radiating core portion (heat radiating portion) 120 includes two headers 121, a plurality of heat radiating tubes 122 communicating with the two headers 121, and heat radiating fins 123 interposed between the heat radiating tubes 122. The
[0019]
The two headers 121 are assembled so as to be substantially upright above the heat radiating surface 112 facing the heat receiving surface 111 of the refrigerant tank 110, and are provided in communication with the internal space of the refrigerant tank 110.
[0020]
The heat radiating tube 122 is arranged substantially parallel to the heat radiating surface 112 of the refrigerant tank 110 to which the header 121 is assembled and the longitudinal end of the heat radiating surface 112 (or slightly inclined with respect to the longitudinal end of the heat radiating surface 112). And communicated with the internal space of the refrigerant tank 110 via two headers 121.
[0021]
The heat radiating fins 123 are well-known corrugated fins and are used to increase the heat radiating area.
[0022]
The heat radiating surfaces 112 of the boiling coolers 101 and 102 formed in this way are arranged so as to face each other, and the heat radiating core portions 120 are arranged so as to line up in a substantially upright direction of the refrigerant tank 110. A boiling cooling device 100 is formed.
[0023]
Next, the operation and effect of the boiling cooling device 100 based on the above configuration will be described.
[0024]
The refrigerant stored in the refrigerant tank 110 receives heat from the heating elements 10 and 11 and evaporates, rises in the refrigerant tank 110, flows into one header 121 (broken line in the refrigerant tank 110 in FIG. 1). ), And flows from the header 121 to the heat radiating tubes 122. When the refrigerant vapor that has flowed into the heat radiating tube 122 flows through the heat radiating tube 122, the refrigerant vapor is cooled by receiving cooling air supplied from, for example, the air blowing means 141 disposed in the lower side in FIG. Then, it becomes a condensate and recirculates from the other header 121 to the refrigerant tank 110 (solid line in the refrigerant tank 110 in FIG. 1).
[0025]
As a result, heat generated from the heating elements 10 and 11 is transmitted to the refrigerant and transported to the heat radiating core 120, and is released as condensed latent heat when the refrigerant vapor condenses in the heat radiating core 120, via the heat radiating fins 123. To dissipate heat to the outside air (cooling air).
[0026]
In the present invention, by combining two boiling coolers 101 and 102 composed of the refrigerant tank 110 and the heat radiating core portion 120, the boiling cooling device 100 that can cool the separate heating elements 10 and 11 is easily formed. it can. At this time, by supplying the cooling air between the two refrigerant tanks 110, the cooling air is not directly exposed to the heating elements 10, 11, and there is no fear of causing a wiring short circuit.
[0027]
In addition, although the refrigerant tank 110 was demonstrated as a flat box-shaped container, you may make it form as a laminated structure which laminated | stacked the several flat plate member. Specifically, by interposing a plurality of intermediate plates having openings between the heat receiving plate and the heat radiating plate that respectively form the heat receiving surface 111 and the heat radiating surface 112, it can be formed as a refrigerant container having an internal space and is inexpensive. It can be easily handled.
[0028]
(Second Embodiment)
A second embodiment of the present invention is shown in FIGS. 2nd Embodiment provides the partition plate 130 between the two thermal radiation core parts 120 with respect to the said 1st Embodiment.
[0029]
The partition plate 130 is provided so as to obliquely connect the end portions 124 on the side of the anti-refrigerant tank of each heat radiating core portion 120. For example, air blowing means 141 and 142 (141 is a push-in type, 142 is a suction type) are provided at two locations on the upper side and the lower side of each heat-radiating core part 120, and cooling air is supplied to each heat-radiating core part 120. I am doing so.
[0030]
That is, as shown by the solid lines in FIGS. 2 and 3, the cooling air passes through the lower heat radiating core 120 and is passed along the partition plate 130 to the upper left in the drawing by the blowing unit 141. Further, as indicated by the broken line in FIG. 3, the cooling air is sucked from the space between the partition plate 130 and the upper heat radiating core 120 by the air blowing means 142, and passes upward through the upper heat radiating core 120. I'll go through.
[0031]
As a result, the cooling air passing through one of the heat radiating cores 120 can be prevented from flowing into the other heat radiating core 120, so that it is not affected by the cooling air whose temperature has been raised by the other heat radiating core 120, Cooling performance can be improved.
[0032]
Note that the partition plate 130 is not limited to the above embodiment, and as illustrated in FIG. 4, the end portions on the refrigerant tank side of the respective heat radiating core portions 120 may be obliquely connected. Moreover, as shown in FIG. 5, you may make it connect the edge part by the side of the header 121 of each thermal radiation core part 120 diagonally (the broken line or two-dot chain line in FIG.5 (b)). Furthermore, you may arrange | position the ventilation means 141 and 142 as shown with the broken line in FIG.5 (b).
[Brief description of the drawings]
FIG. 1 is a front view showing an entire boiling cooling device according to a first embodiment of the present invention.
FIG. 2 is a front view showing a boiling cooling device in a second embodiment.
FIG. 3 is a perspective view showing a state in which cooling air is supplied to the heat radiating core by the blowing means.
FIG. 4 is a front view showing a first modification of the partition plate.
5A is a front view and FIG. 5B is a view as viewed from the direction A in FIG.
FIG. 6 is a perspective view showing a boil cooling device in the prior art.
FIG. 7 is a front view in the case of cooling different heating elements using a boiling cooling device of the prior art.
FIG. 8 is a front view showing a boiling cooling device in application.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Heat generating body 100 Boiling cooler 101,102 Boiling cooler 110 Refrigerant tank 111 Heat receiving surface (one surface)
112 Heat dissipation surface (the other surface)
120 Heat dissipation core (heat dissipation)
124 End portion 130 Partition plates 141 and 142 Blowing means

Claims (2)

A heating element (10) is attached to the lower side of one surface (111) that is substantially upright, and a refrigerant tank (110) that stores refrigerant therein,
A heat dissipating part which is provided above the other surface (112) opposite to the one surface (111), condenses and liquefies the refrigerant boiled and vaporized by the heating element (10) and returns it to the refrigerant tank (110). Two boiling coolers (101) consisting of (120)
The two boiling cooler (101, 102), each said other surface (112) is disposed so as to face each other,
And each said thermal radiation part (120) is arrange | positioned so that it may be located in a line with the substantially upright direction of the said refrigerant | coolant tank (110), The boiling cooling device characterized by the above-mentioned. Between each said heat radiating part (120), the partition plate (130) which connects the edge parts (124, 124) of the said heat radiating part (120) diagonally is provided, and by two ventilation means (141, 142) The boiling cooling device according to claim 1, wherein cooling air is supplied to each of the heat radiating portions.

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