JPS60193964U - マグネトロンスパツタ装置のタ−ゲツト - Google Patents

マグネトロンスパツタ装置のタ−ゲツト

Info

Publication number
JPS60193964U
JPS60193964U JP7957784U JP7957784U JPS60193964U JP S60193964 U JPS60193964 U JP S60193964U JP 7957784 U JP7957784 U JP 7957784U JP 7957784 U JP7957784 U JP 7957784U JP S60193964 U JPS60193964 U JP S60193964U
Authority
JP
Japan
Prior art keywords
target
magnetron sputtering
area
sputtering device
magnetic force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7957784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH027870Y2 (enExample
Inventor
坂本　充則
Original Assignee
ホ−ヤ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ホ−ヤ株式会社 filed Critical ホ−ヤ株式会社
Priority to JP7957784U priority Critical patent/JPS60193964U/ja
Publication of JPS60193964U publication Critical patent/JPS60193964U/ja
Application granted granted Critical
Publication of JPH027870Y2 publication Critical patent/JPH027870Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP7957784U 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト Granted JPS60193964U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7957784U JPS60193964U (ja) 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7957784U JPS60193964U (ja) 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト

Publications (2)

Publication Number Publication Date
JPS60193964U true JPS60193964U (ja) 1985-12-24
JPH027870Y2 JPH027870Y2 (enExample) 1990-02-26

Family

ID=30624624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7957784U Granted JPS60193964U (ja) 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト

Country Status (1)

Country Link
JP (1) JPS60193964U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194696A1 (ja) * 2015-05-29 2016-12-08 住友金属鉱山株式会社 スパッタリングターゲット及びこれを用いたスパッタリング成膜方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194696A1 (ja) * 2015-05-29 2016-12-08 住友金属鉱山株式会社 スパッタリングターゲット及びこれを用いたスパッタリング成膜方法
JP2016222975A (ja) * 2015-05-29 2016-12-28 住友金属鉱山株式会社 スパッタリングターゲット及びこれを用いたスパッタリング成膜方法

Also Published As

Publication number Publication date
JPH027870Y2 (enExample) 1990-02-26

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