JPS601850A - Mounting device of heat sink member - Google Patents

Abstract

PURPOSE:To enable to dispose in a high density state and to improve the assembling mass productivity by forming a structure that a heat generating member disposed on a printed substrate is contacted with a heat sink member having thermal conductivity disposed on a chassis substrate. CONSTITUTION:An IC 1 of heat generating member is disposed on a flexible printed substrate 2. An elastic heat sink member 8 having thermal conductivity (e.g., aluminum plate) is disposed on the part opposed to the heat sink unit 1a of the IC 1 at the chassis 7 side. When the substrate 2 is mounted at the prescribed position on the chassis substrate 7, the unit 1a of the IC is contacted with the member 8 via the prescribed contacting pressure by the elastic deformation of the member 8. Thus, the heat generation amount of the IC 1 can be thermally conducted to the substrate 7 through the member 8, thereby obtaining efficient heat sink efficiency by the minimum heat sink member area.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat dissipation member mounting device suitable for use in various electronic devices, particularly small electronic devices.

Conventional configurations and their problems In recent years, there has been a strong demand for smaller and thinner electronic devices, especially magnetic recording and reproducing devices. However, in order to make devices smaller and thinner, it is necessary to reduce the effective area and volume that can be used as mechanical parts and electric circuit parts. For this purpose, mechanical parts and electrical circuit parts must be arranged in a highly dense manner. However, when electrical circuit components are arranged in a high density on a printed circuit board, it is necessary to pay attention to the heat dissipation method of ICs, transistor components, etc.

In particular, in magnetic recording and reproducing devices, there is a trend toward direct drive for various rotation drive units, and since drive ICs operate at high power supply voltages, it is difficult to use them alone without a heat sink in many cases. For this reason, as shown in FIG. 1, a heat radiating section 1a is attached to an IC that requires heat radiation. However, ICs that operate at high power supply voltages
For this, a heat radiation area several times larger than that of the heat radiation part is required. For this reason, as shown in FIG. 2, the heat sink 3 is attached with screws or the like so as to come into contact with the heat sink 1a of the IC 1.

However, in this case, since the surface area occupied by the heat sink 3 is large, it becomes an obstacle to arranging electronic circuits on the printed circuit board 2 in a high-density state. In addition, if the heat dissipation plate 3 is installed so that the heat dissipation surface is arranged in the height direction as shown in Figure 3, the space available in the height direction is limited and the overall thickness of the device is reduced. It becomes an obstacle to the development of In addition, since the heat dissipation member is attached to the electric circuit component which is a surface heat generating member, mass productivity of the assembly is poor9, and it becomes an obstacle when automatically inserting the electric circuit heat generating component into the printed circuit board. In addition, in order to make the model thinner, as shown in FIG.
The mechanical drive member 1 is arranged at a constant interval on the part facing the
If the printed circuit board is bent as indicated by 2' when o is placed, the gap h between the mechanical component 10 and the heat sink 3 will become smaller, causing problems such as damage to the mechanical component or electrical circuit component due to contact between the two. happens. For this reason, it is necessary to provide a sufficient distance hl, which is an obstacle to making the device thinner.

Purpose of the Invention The present invention solves the above-mentioned conventional problems, enables mechanical components and electrical circuit components to be arranged in high density, which is necessary for downsizing and thinning electronic devices, and also facilitates assembly and mass production. A heat dissipating member device of the present invention includes a heat dissipating member disposed on a printed circuit board, a heat dissipating member having thermal conductivity disposed on a chassis board, The heat generating member and the heat radiating member are configured to be in contact with each other, and the heat generation amount of the heat generating member is thermally conducted onto the shear 7 board through the heat radiating member, thereby increasing efficiency by minimizing the area of the heat radiating member. A device that provides good heat dissipation effects and enables high-density placement of electrical circuit components on printed circuit boards and high-density placement of electrical circuit components and mechanical components, which is necessary for downsizing and thinning devices. It is.

DESCRIPTION OF EMBODIMENTS Below, the embodiments of the present invention will be described with reference to the drawings. I will explain while referring to it.

FIG. 5 is a side view of the first embodiment of the present invention, in which a heat generating member C1 is arranged on a flexible printed circuit board 2. FIG. In a portion of the IC 1 facing the heat dissipating portion 1a, an elastic heat dissipating member 8 (for example, a heat dissipating plate) having thermal conductivity is arranged on the chassis 7 side. When the printed circuit board 2 is attached to the chassis board 7 at a predetermined position, the elastic deformation of the flexible heat dissipating portion 8 causes a predetermined contact pressure to be applied between the heat dissipating portion 1a of the IC and the heat dissipating member 8. The structure is such that they come into contact with each other. For that purpose, the calorific value of engineering C10 is 8? By conducting heat to the chassis substrate 7 through the heat dissipation member, an efficient heat dissipation effect can be obtained with a minimum area of the heat dissipation member. FIG. 6 is a diagram showing a mechanical drive component 10 arranged on the chassis board 7 at a portion facing the electrical circuit components arranged on the flexible printed circuit board 2, particularly the circuit C1 that requires heat radiation.

Conventionally, because the printed circuit board is flexible, if it is moved along the chassis side as shown in Figure 4, the mechanical drive part and the electric circuit component or the mechanical drive component and the heat sink come into contact and the mechanical parts are damaged. There are also problems such as damage to electrical parts. However, the sixth
As shown in the figure, since the heat dissipation member 9 is composed of a rigid member 9b and an elastically deformable member 9a, the member 9a is an IC.
1 to dissipate heat. The rigid member 9b (C is made of a member with a higher rigidity than the printed circuit board) and serves as a stopper to prevent the IC 1 from coming into contact with the mechanical drive unit 10 due to the warpage of the printed circuit board 2 as described above. The embodiment shown in FIG. 6 provides a heat dissipation effect and an effect of enabling high-density arrangement of electrical circuit components and mechanical components.

FIG. 7 shows yet another embodiment. A plurality of ICs 1i arranged on the printed circuit board 2 that require all heat dissipation,
By making contact with one heat radiating member 11 disposed on the chassis T side, effects such as a reduction in the area of the heat radiating member, a reduction in the number of parts of the heat radiating member, and an improvement in the productivity of attaching the heat radiating member can be obtained.

Effects of the Invention As is clear from the above explanation, the present invention has a heat generating member disposed on a printed circuit board and a heat conductive member disposed on a chassis board. The heat dissipating member has a structure in which the heat dissipating member and the heat dissipating member are in contact with each other.
By thermally conducting the amount of heat to the shear 7 board via the heat radiating member, (1) the area and volume of the heat radiating member required for heat radiation are minimized and the heat radiation efficiency is increased;

■ Improving the efficiency and mass productivity of heat sink mounting equipment.

■ Enables high-density arrangement of electronic circuit components and mechanical components.

These effects can be obtained, and this will greatly contribute to the miniaturization and thinning of electronic devices.

Furthermore, multiple heat generating members arranged on the printed circuit board,
By configuring the heat dissipation member to be in contact with one heat dissipation member disposed on the chassis board, the effects of reducing the heat dissipation plate area, reducing the number of heat dissipation member parts, and improving the productivity of attaching the heat dissipation member can be obtained.

[Brief explanation of drawings]

Figure 1 is a perspective view of an IC that requires all heat dissipation, Figures 2 and 3
4 and 4 are respectively sectional views of conventional examples of a heat sink mounting device, and FIGS. 6, 6, and 7 are side views showing embodiments of the heat sink mounting device of the present invention, respectively.゛1...IC, 2...Printed circuit board, 3
, 6... Heat dissipation member, 8.9% 1... Heat dissipation member, 7. / Palm board, 1Q... Mechanical drive member. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 1α Figure 3

Claims (2)

[Claims] (1) A heat radiating member mounting device comprising a heat generating member disposed on a printed circuit board and a heat radiating member having thermal conductivity disposed on a chassis board, the heat radiating member and the heat radiating member being in contact with each other. . (2) a plurality of heat generating members arranged on a printed circuit board;
The mounting wave # of the heat dissipation member according to claim 1, which has a structure in which it comes into contact with one heat dissipation member arranged on the chassis board.