JPS60180189A - 電気素子の接続構造 - Google Patents
電気素子の接続構造Info
- Publication number
- JPS60180189A JPS60180189A JP22750884A JP22750884A JPS60180189A JP S60180189 A JPS60180189 A JP S60180189A JP 22750884 A JP22750884 A JP 22750884A JP 22750884 A JP22750884 A JP 22750884A JP S60180189 A JPS60180189 A JP S60180189A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive
- present
- electrical
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 49
- 230000001070 adhesive effect Effects 0.000 claims description 49
- 238000009413 insulation Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 9
- 238000003825 pressing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22750884A JPS60180189A (ja) | 1984-10-29 | 1984-10-29 | 電気素子の接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22750884A JPS60180189A (ja) | 1984-10-29 | 1984-10-29 | 電気素子の接続構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60180189A true JPS60180189A (ja) | 1985-09-13 |
| JPS6127902B2 JPS6127902B2 (enrdf_load_stackoverflow) | 1986-06-27 |
Family
ID=16861995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22750884A Granted JPS60180189A (ja) | 1984-10-29 | 1984-10-29 | 電気素子の接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60180189A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62254455A (ja) * | 1986-04-28 | 1987-11-06 | Osaka Soda Co Ltd | ピンレスパッケージの実装方法 |
| US6281450B1 (en) | 1997-06-26 | 2001-08-28 | Hitachi Chemical Company, Ltd. | Substrate for mounting semiconductor chips |
| CN109076706A (zh) * | 2016-02-29 | 2018-12-21 | 薄膜电子有限公司 | 使用表面安装技术和该方法中有用的各向异性导电胶的电子装置及其制造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4830362U (enrdf_load_stackoverflow) * | 1971-08-16 | 1973-04-13 | ||
| JPS49133049A (enrdf_load_stackoverflow) * | 1973-04-24 | 1974-12-20 | ||
| JPS5120941A (ja) * | 1974-08-14 | 1976-02-19 | Seikosha Kk | Dodenseisetsuchakuzai |
| JPS5421548A (en) * | 1977-07-19 | 1979-02-17 | Toshiba Corp | Phase comparison relay system |
| JPS592179A (ja) * | 1982-06-29 | 1984-01-07 | Shindengen Electric Mfg Co Ltd | 公営競技場における投票処理装置 |
-
1984
- 1984-10-29 JP JP22750884A patent/JPS60180189A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4830362U (enrdf_load_stackoverflow) * | 1971-08-16 | 1973-04-13 | ||
| JPS49133049A (enrdf_load_stackoverflow) * | 1973-04-24 | 1974-12-20 | ||
| JPS5120941A (ja) * | 1974-08-14 | 1976-02-19 | Seikosha Kk | Dodenseisetsuchakuzai |
| JPS5421548A (en) * | 1977-07-19 | 1979-02-17 | Toshiba Corp | Phase comparison relay system |
| JPS592179A (ja) * | 1982-06-29 | 1984-01-07 | Shindengen Electric Mfg Co Ltd | 公営競技場における投票処理装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62254455A (ja) * | 1986-04-28 | 1987-11-06 | Osaka Soda Co Ltd | ピンレスパッケージの実装方法 |
| US6281450B1 (en) | 1997-06-26 | 2001-08-28 | Hitachi Chemical Company, Ltd. | Substrate for mounting semiconductor chips |
| CN109076706A (zh) * | 2016-02-29 | 2018-12-21 | 薄膜电子有限公司 | 使用表面安装技术和该方法中有用的各向异性导电胶的电子装置及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6127902B2 (enrdf_load_stackoverflow) | 1986-06-27 |
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