JPS60176557U - integrated circuit chip - Google Patents

integrated circuit chip

Info

Publication number
JPS60176557U
JPS60176557U JP6344384U JP6344384U JPS60176557U JP S60176557 U JPS60176557 U JP S60176557U JP 6344384 U JP6344384 U JP 6344384U JP 6344384 U JP6344384 U JP 6344384U JP S60176557 U JPS60176557 U JP S60176557U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit chip
power supply
metal layer
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6344384U
Other languages
Japanese (ja)
Inventor
幸太郎 田中
康 川上
秋山 正博
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP6344384U priority Critical patent/JPS60176557U/en
Publication of JPS60176557U publication Critical patent/JPS60176557U/en
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図A及びBはこの考案の実施例を説明するための略
図的平面図及び断面図である。 1・・・集積回路チップ、2・・・集積回路領域、3・
・・パッド、4・・・未使用領域、5・・・半絶縁性基
板、6・・・第一金属、7・・・絶縁膜、8・・・第二
金属、9・・・容量、10…パツシベーシヨン膜。
FIGS. 1A and 1B are a schematic plan view and a sectional view for explaining an embodiment of this invention. 1... integrated circuit chip, 2... integrated circuit area, 3...
... Pad, 4... Unused area, 5... Semi-insulating substrate, 6... First metal, 7... Insulating film, 8... Second metal, 9... Capacitor, 10...Passivation film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部に集積回路を有する集積回路チップにおいて、該集
積回路チップの未使用領域中に、電源及び接地間に個別
的に接続される第−及び第二金属層と、該集積回路チッ
プの内部に作り込まれていて該第−及び第二金属層との
間に介在させた絶縁膜とから成る、電源電圧安定化のた
めの容量を具えることを特徴とする集積回路チップ。
In an integrated circuit chip having an integrated circuit therein, in an unused area of the integrated circuit chip, first and second metal layers individually connected between a power supply and a ground are formed inside the integrated circuit chip. an insulating film interposed between the first metal layer and the second metal layer, the integrated circuit chip comprising a capacitor for stabilizing a power supply voltage.
JP6344384U 1984-04-28 1984-04-28 integrated circuit chip Pending JPS60176557U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6344384U JPS60176557U (en) 1984-04-28 1984-04-28 integrated circuit chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6344384U JPS60176557U (en) 1984-04-28 1984-04-28 integrated circuit chip

Publications (1)

Publication Number Publication Date
JPS60176557U true JPS60176557U (en) 1985-11-22

Family

ID=30593592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6344384U Pending JPS60176557U (en) 1984-04-28 1984-04-28 integrated circuit chip

Country Status (1)

Country Link
JP (1) JPS60176557U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58206150A (en) * 1982-05-07 1983-12-01 アイテイ−テイ−・インダストリ−ズ・インコ−ポレ−テツド Monolithic integrated circuit with integrated capacitor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58206150A (en) * 1982-05-07 1983-12-01 アイテイ−テイ−・インダストリ−ズ・インコ−ポレ−テツド Monolithic integrated circuit with integrated capacitor

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