JPS61111154U - - Google Patents
Info
- Publication number
- JPS61111154U JPS61111154U JP20091584U JP20091584U JPS61111154U JP S61111154 U JPS61111154 U JP S61111154U JP 20091584 U JP20091584 U JP 20091584U JP 20091584 U JP20091584 U JP 20091584U JP S61111154 U JPS61111154 U JP S61111154U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- resin layer
- electrode pattern
- sectional area
- extraction electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000004382 potting Methods 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は、本考案IC装置の一実施例の要部で
ある電極パターンの例を示す線図、第2図は第1
図に示す例の断面図、第3図及び第4図は本考案
の他の実施例の要部の例を示す線図、第5図は従
来のIC装置の例を示す線図、第6図及び第7図
は第5図に示す例を示す断面図である。
1〜8は電極パターン、29はオーバーコート
樹脂層、30はポツテイング樹脂層である。
FIG. 1 is a diagram showing an example of an electrode pattern which is a main part of an embodiment of the IC device of the present invention, and FIG.
3 and 4 are diagrams showing main parts of other embodiments of the present invention. FIG. 5 is a diagram showing an example of a conventional IC device. The figure and FIG. 7 are cross-sectional views showing the example shown in FIG. 1 to 8 are electrode patterns, 29 is an overcoat resin layer, and 30 is a potting resin layer.
Claims (1)
上に配された引き出し電極パターンと、該引き出
し電極パターンの途中に設けた小断面積部と、該
小断面積部を端部とするようにコーテイングされ
たオーバーコート樹脂層と、該オーバーコート樹
脂の端部まで広がり上記集積回路を被覆するポツ
テツング樹脂層とを有することを特徴とする集積
回路装置。 An extraction electrode pattern arranged on a substrate for direct bonding of an integrated circuit, a small cross-sectional area part provided in the middle of the extraction electrode pattern, and an overcoat coated so that the small cross-sectional area part is the end part. An integrated circuit device comprising: a resin layer; and a potting resin layer extending to an end of the overcoat resin and covering the integrated circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20091584U JPS61111154U (en) | 1984-12-25 | 1984-12-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20091584U JPS61111154U (en) | 1984-12-25 | 1984-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61111154U true JPS61111154U (en) | 1986-07-14 |
Family
ID=30762211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20091584U Pending JPS61111154U (en) | 1984-12-25 | 1984-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61111154U (en) |
-
1984
- 1984-12-25 JP JP20091584U patent/JPS61111154U/ja active Pending