JPS60174255U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS60174255U
JPS60174255U JP1984062036U JP6203684U JPS60174255U JP S60174255 U JPS60174255 U JP S60174255U JP 1984062036 U JP1984062036 U JP 1984062036U JP 6203684 U JP6203684 U JP 6203684U JP S60174255 U JPS60174255 U JP S60174255U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
mounting land
printed
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984062036U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442943Y2 (enrdf_load_stackoverflow
Inventor
今井　勢津雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1984062036U priority Critical patent/JPS60174255U/ja
Publication of JPS60174255U publication Critical patent/JPS60174255U/ja
Application granted granted Critical
Publication of JPH0442943Y2 publication Critical patent/JPH0442943Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1984062036U 1984-04-25 1984-04-25 混成集積回路 Granted JPS60174255U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984062036U JPS60174255U (ja) 1984-04-25 1984-04-25 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984062036U JPS60174255U (ja) 1984-04-25 1984-04-25 混成集積回路

Publications (2)

Publication Number Publication Date
JPS60174255U true JPS60174255U (ja) 1985-11-19
JPH0442943Y2 JPH0442943Y2 (enrdf_load_stackoverflow) 1992-10-12

Family

ID=30590864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984062036U Granted JPS60174255U (ja) 1984-04-25 1984-04-25 混成集積回路

Country Status (1)

Country Link
JP (1) JPS60174255U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526638A (en) * 1978-08-16 1980-02-26 Hitachi Ltd Water cooled type cooling device for transformer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526638A (en) * 1978-08-16 1980-02-26 Hitachi Ltd Water cooled type cooling device for transformer

Also Published As

Publication number Publication date
JPH0442943Y2 (enrdf_load_stackoverflow) 1992-10-12

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