JPS60173851A - ペレツトボンデイング装置におけるウエハリング保持装置 - Google Patents

ペレツトボンデイング装置におけるウエハリング保持装置

Info

Publication number
JPS60173851A
JPS60173851A JP2843784A JP2843784A JPS60173851A JP S60173851 A JPS60173851 A JP S60173851A JP 2843784 A JP2843784 A JP 2843784A JP 2843784 A JP2843784 A JP 2843784A JP S60173851 A JPS60173851 A JP S60173851A
Authority
JP
Japan
Prior art keywords
ring
wafer
holding
wafer ring
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2843784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224379B2 (enrdf_load_html_response
Inventor
Hisaya Suzuki
鈴木　久彌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP2843784A priority Critical patent/JPS60173851A/ja
Publication of JPS60173851A publication Critical patent/JPS60173851A/ja
Publication of JPH0224379B2 publication Critical patent/JPH0224379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP2843784A 1984-02-20 1984-02-20 ペレツトボンデイング装置におけるウエハリング保持装置 Granted JPS60173851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2843784A JPS60173851A (ja) 1984-02-20 1984-02-20 ペレツトボンデイング装置におけるウエハリング保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2843784A JPS60173851A (ja) 1984-02-20 1984-02-20 ペレツトボンデイング装置におけるウエハリング保持装置

Publications (2)

Publication Number Publication Date
JPS60173851A true JPS60173851A (ja) 1985-09-07
JPH0224379B2 JPH0224379B2 (enrdf_load_html_response) 1990-05-29

Family

ID=12248640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2843784A Granted JPS60173851A (ja) 1984-02-20 1984-02-20 ペレツトボンデイング装置におけるウエハリング保持装置

Country Status (1)

Country Link
JP (1) JPS60173851A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008025979A (ja) * 2006-07-25 2008-02-07 Noritz Corp 熱源機
JP2009030973A (ja) * 2004-08-09 2009-02-12 Rinnai Corp １缶式複合熱源機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639375A (ja) * 1986-06-30 1988-01-16 Shoichi Tanaka 磁気記録再生装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639375A (ja) * 1986-06-30 1988-01-16 Shoichi Tanaka 磁気記録再生装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009030973A (ja) * 2004-08-09 2009-02-12 Rinnai Corp １缶式複合熱源機
JP2008025979A (ja) * 2006-07-25 2008-02-07 Noritz Corp 熱源機

Also Published As

Publication number Publication date
JPH0224379B2 (enrdf_load_html_response) 1990-05-29

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