JPS6016537U - 半導体ウエハの片面処理装置 - Google Patents

半導体ウエハの片面処理装置

Info

Publication number
JPS6016537U
JPS6016537U JP1983106956U JP10695683U JPS6016537U JP S6016537 U JPS6016537 U JP S6016537U JP 1983106956 U JP1983106956 U JP 1983106956U JP 10695683 U JP10695683 U JP 10695683U JP S6016537 U JPS6016537 U JP S6016537U
Authority
JP
Japan
Prior art keywords
utility
model registration
discs
pair
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983106956U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0140193Y2 (enExample
Inventor
相合　征一郎
Original Assignee
黒谷　巌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 黒谷　巌 filed Critical 黒谷　巌
Priority to JP1983106956U priority Critical patent/JPS6016537U/ja
Publication of JPS6016537U publication Critical patent/JPS6016537U/ja
Application granted granted Critical
Publication of JPH0140193Y2 publication Critical patent/JPH0140193Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP1983106956U 1983-07-09 1983-07-09 半導体ウエハの片面処理装置 Granted JPS6016537U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983106956U JPS6016537U (ja) 1983-07-09 1983-07-09 半導体ウエハの片面処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983106956U JPS6016537U (ja) 1983-07-09 1983-07-09 半導体ウエハの片面処理装置

Publications (2)

Publication Number Publication Date
JPS6016537U true JPS6016537U (ja) 1985-02-04
JPH0140193Y2 JPH0140193Y2 (enExample) 1989-12-01

Family

ID=30250084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983106956U Granted JPS6016537U (ja) 1983-07-09 1983-07-09 半導体ウエハの片面処理装置

Country Status (1)

Country Link
JP (1) JPS6016537U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148825A (ja) * 1989-11-06 1991-06-25 Ebara Corp ジェットスクラバー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148825A (ja) * 1989-11-06 1991-06-25 Ebara Corp ジェットスクラバー

Also Published As

Publication number Publication date
JPH0140193Y2 (enExample) 1989-12-01

Similar Documents

Publication Publication Date Title
JPS6016537U (ja) 半導体ウエハの片面処理装置
JPS6016538U (ja) 半導体ウエハの片面処理装置
JPS5991735U (ja) 半導体ウエ−ハ移し替え装置
JPS585342U (ja) ウェハ−表面処理装置
JPS6039242U (ja) 液処理装置
JPS5984843U (ja) 半導体製造用キヤリアハンガ
JPS6094842U (ja) 半導体基板用研削装置
JPS6133870U (ja) エツチング装置
JPS62136432U (enExample)
JPS622766Y2 (enExample)
JPS6031964U (ja) ウエハ−ポリッシング装置用重り構造
JPS5846988U (ja) ラジエ−タ
JPS5985956U (ja) フロ−型イオン選択性電極
JPS5920629U (ja) 拡散治具
JPS5992239U (ja) 防振装置
JPS6056461U (ja) 研磨治具
JPS60111041U (ja) 半導体ウエ−ハの洗浄装置
JPS6112674U (ja) ポリシング装置
JPS60146658U (ja) 吸着装置
JPS63147895U (enExample)
JPS58168134U (ja) 加圧接触型半導体装置
JPS5939989U (ja) 電気機器の冷却装置
JPS5967949U (ja) 液冷形サイリスタモジユ−ル
JPS60110464U (ja) 基板収容装置
JPS6016542U (ja) 半導体ウエ−ハ用ボ−ト