JPS60154575A - 半導体圧力検出素子の製造方法 - Google Patents
半導体圧力検出素子の製造方法Info
- Publication number
- JPS60154575A JPS60154575A JP59009961A JP996184A JPS60154575A JP S60154575 A JPS60154575 A JP S60154575A JP 59009961 A JP59009961 A JP 59009961A JP 996184 A JP996184 A JP 996184A JP S60154575 A JPS60154575 A JP S60154575A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- semiconductor substrate
- sensing element
- semiconductor
- pressure sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59009961A JPS60154575A (ja) | 1984-01-25 | 1984-01-25 | 半導体圧力検出素子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59009961A JPS60154575A (ja) | 1984-01-25 | 1984-01-25 | 半導体圧力検出素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60154575A true JPS60154575A (ja) | 1985-08-14 |
| JPH0337749B2 JPH0337749B2 (enExample) | 1991-06-06 |
Family
ID=11734533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59009961A Granted JPS60154575A (ja) | 1984-01-25 | 1984-01-25 | 半導体圧力検出素子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60154575A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02203570A (ja) * | 1989-02-01 | 1990-08-13 | Fujikura Ltd | 単結晶薄膜部材の製造方法 |
| JPH02128934U (enExample) * | 1989-03-31 | 1990-10-24 | ||
| JPH02281760A (ja) * | 1989-04-24 | 1990-11-19 | Fujikura Ltd | 単結晶薄模部材の製造方法 |
| US5223086A (en) * | 1991-03-11 | 1993-06-29 | Nippondenso Co., Ltd. | Method of producing an acceleration sensor of a semiconductor |
-
1984
- 1984-01-25 JP JP59009961A patent/JPS60154575A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02203570A (ja) * | 1989-02-01 | 1990-08-13 | Fujikura Ltd | 単結晶薄膜部材の製造方法 |
| JPH02128934U (enExample) * | 1989-03-31 | 1990-10-24 | ||
| JPH02281760A (ja) * | 1989-04-24 | 1990-11-19 | Fujikura Ltd | 単結晶薄模部材の製造方法 |
| US5223086A (en) * | 1991-03-11 | 1993-06-29 | Nippondenso Co., Ltd. | Method of producing an acceleration sensor of a semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337749B2 (enExample) | 1991-06-06 |
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