JPS60154485A - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPS60154485A
JPS60154485A JP59018501A JP1850184A JPS60154485A JP S60154485 A JPS60154485 A JP S60154485A JP 59018501 A JP59018501 A JP 59018501A JP 1850184 A JP1850184 A JP 1850184A JP S60154485 A JPS60154485 A JP S60154485A
Authority
JP
Japan
Prior art keywords
joining machine
support surface
machine according
elastic
clamp bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59018501A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416016B2 (en:Method
Inventor
ペーター・ウルバン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOIBUTSUERU ERUTETSUKU GmbH
Original Assignee
DOIBUTSUERU ERUTETSUKU GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DOIBUTSUERU ERUTETSUKU GmbH filed Critical DOIBUTSUERU ERUTETSUKU GmbH
Publication of JPS60154485A publication Critical patent/JPS60154485A/ja
Publication of JPH0416016B2 publication Critical patent/JPH0416016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59018501A 1984-01-16 1984-02-06 ボンディング装置 Granted JPS60154485A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8401090U DE8401090U1 (de) 1984-01-16 1984-01-16 Bondgerät
DE8401090.8 1984-01-16

Publications (2)

Publication Number Publication Date
JPS60154485A true JPS60154485A (ja) 1985-08-14
JPH0416016B2 JPH0416016B2 (en:Method) 1992-03-19

Family

ID=6762448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59018501A Granted JPS60154485A (ja) 1984-01-16 1984-02-06 ボンディング装置

Country Status (3)

Country Link
US (1) US4635838A (en:Method)
JP (1) JPS60154485A (en:Method)
DE (1) DE8401090U1 (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5862588A (en) * 1995-08-14 1999-01-26 International Business Machines Corporation Method for restraining circuit board warp during area array rework
CN100427262C (zh) * 2007-05-29 2008-10-22 东华大学 一种柔性可重构的汽车焊装夹具
US8720767B2 (en) * 2008-11-13 2014-05-13 Orthodyne Electronics Corporation Semiconductor device support for bonding

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2373300A (en) * 1943-03-20 1945-04-10 Adel Prec Products Corp Conduit clip
US3052461A (en) * 1959-04-09 1962-09-04 Bateman William Henry Work-piece clamping means
US3487524A (en) * 1967-11-16 1970-01-06 Sargent & Co Locator and holder in a crimping tool for an electrical connector
GB1253708A (en) * 1968-05-28 1971-11-17 Motorola Inc Semiconductor device fabrication
US3595453A (en) * 1969-10-31 1971-07-27 Branson Instr Method of separating parts using high frequency energy
US3854712A (en) * 1973-12-03 1974-12-17 W Mcgee Ski vise
US3938797A (en) * 1974-01-09 1976-02-17 The Pandjiris Weldment Co. Clamping device for welding seamer
JPS5596648A (en) * 1979-01-18 1980-07-23 Toshiba Corp Wire bonding apparatus
US4527727A (en) * 1983-04-12 1985-07-09 Fairchild Industries, Inc. Stabilized ultrasonic welding apparatus

Also Published As

Publication number Publication date
US4635838A (en) 1987-01-13
JPH0416016B2 (en:Method) 1992-03-19
DE8401090U1 (de) 1984-05-10

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