JPS60149782A - 選択的メツキ方法 - Google Patents

選択的メツキ方法

Info

Publication number
JPS60149782A
JPS60149782A JP611684A JP611684A JPS60149782A JP S60149782 A JPS60149782 A JP S60149782A JP 611684 A JP611684 A JP 611684A JP 611684 A JP611684 A JP 611684A JP S60149782 A JPS60149782 A JP S60149782A
Authority
JP
Japan
Prior art keywords
substrate
selective
fluid
plating
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP611684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0577748B2 (enExample
Inventor
Kiyoshi Inoue
潔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Kinoko Research Center Foundation
Original Assignee
Japan Kinoko Research Center Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Kinoko Research Center Foundation filed Critical Japan Kinoko Research Center Foundation
Priority to JP611684A priority Critical patent/JPS60149782A/ja
Priority to US06/691,877 priority patent/US4639378A/en
Priority to EP85100466A priority patent/EP0151413A3/en
Publication of JPS60149782A publication Critical patent/JPS60149782A/ja
Priority to US06/882,498 priority patent/US4822633A/en
Publication of JPH0577748B2 publication Critical patent/JPH0577748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
JP611684A 1984-01-17 1984-01-17 選択的メツキ方法 Granted JPS60149782A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP611684A JPS60149782A (ja) 1984-01-17 1984-01-17 選択的メツキ方法
US06/691,877 US4639378A (en) 1984-01-17 1985-01-16 Auto-selective metal deposition on dielectric surfaces
EP85100466A EP0151413A3 (en) 1984-01-17 1985-01-17 Auto-selective metal deposition on dielectric surfaces
US06/882,498 US4822633A (en) 1984-01-17 1986-07-07 Auto-selective metal deposition on dielectric surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP611684A JPS60149782A (ja) 1984-01-17 1984-01-17 選択的メツキ方法

Publications (2)

Publication Number Publication Date
JPS60149782A true JPS60149782A (ja) 1985-08-07
JPH0577748B2 JPH0577748B2 (enExample) 1993-10-27

Family

ID=11629529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP611684A Granted JPS60149782A (ja) 1984-01-17 1984-01-17 選択的メツキ方法

Country Status (1)

Country Link
JP (1) JPS60149782A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143580A (ja) * 1984-12-14 1986-07-01 Furukawa Electric Co Ltd:The 非金属部材の部分化学メツキ法
JP2010525554A (ja) * 2007-03-06 2010-07-22 フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ 基板を精密加工するための方法およびその使用
WO2016152938A1 (ja) * 2015-03-24 2016-09-29 オーエム産業株式会社 めっき品の製造方法
JP2018101798A (ja) * 2018-02-13 2018-06-28 株式会社ニコン 湿式処理方法
CN109844178A (zh) * 2016-09-13 2019-06-04 国家科学研究所物理和技术科学中心 一种在聚合物制品表面上形成导电迹线的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4920030A (enExample) * 1972-06-15 1974-02-22
JPS515626A (en) * 1974-07-04 1976-01-17 Matsushita Electric Industrial Co Ltd Ryuryoseigyoki
JPS5362176A (en) * 1976-11-15 1978-06-03 Nippon Telegraph & Telephone Method of forming printed circuit
JPS5562156A (en) * 1978-10-27 1980-05-10 Schering Ag Manufacture of metal pattern on electric insulating supporter by photochemical method
JPS55148797A (en) * 1979-05-08 1980-11-19 Ibm Selective electroplating method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4920030A (enExample) * 1972-06-15 1974-02-22
JPS515626A (en) * 1974-07-04 1976-01-17 Matsushita Electric Industrial Co Ltd Ryuryoseigyoki
JPS5362176A (en) * 1976-11-15 1978-06-03 Nippon Telegraph & Telephone Method of forming printed circuit
JPS5562156A (en) * 1978-10-27 1980-05-10 Schering Ag Manufacture of metal pattern on electric insulating supporter by photochemical method
JPS55148797A (en) * 1979-05-08 1980-11-19 Ibm Selective electroplating method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143580A (ja) * 1984-12-14 1986-07-01 Furukawa Electric Co Ltd:The 非金属部材の部分化学メツキ法
JP2010525554A (ja) * 2007-03-06 2010-07-22 フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ 基板を精密加工するための方法およびその使用
WO2016152938A1 (ja) * 2015-03-24 2016-09-29 オーエム産業株式会社 めっき品の製造方法
JPWO2016152938A1 (ja) * 2015-03-24 2017-10-12 オーエム産業株式会社 めっき品の製造方法
CN109844178A (zh) * 2016-09-13 2019-06-04 国家科学研究所物理和技术科学中心 一种在聚合物制品表面上形成导电迹线的方法
CN109844178B (zh) * 2016-09-13 2021-05-07 国家科学研究所物理和技术科学中心 一种在聚合物制品表面上形成导电迹线的方法
JP2018101798A (ja) * 2018-02-13 2018-06-28 株式会社ニコン 湿式処理方法

Also Published As

Publication number Publication date
JPH0577748B2 (enExample) 1993-10-27

Similar Documents

Publication Publication Date Title
US4822633A (en) Auto-selective metal deposition on dielectric surfaces
US3772056A (en) Sensitized substrates for chemical metallization
CN109844178B (zh) 一种在聚合物制品表面上形成导电迹线的方法
US8529738B2 (en) In situ plating and etching of materials covered with a surface film
EP0109920B1 (de) Verfahren zum Reinigen von Löchern in gedruckten Schaltungsplatten mit permanganathaltigen und basischen Lösungen
US20110042201A1 (en) In situ Plating And Soldering Of Materials Covered With A Surface Film
US4632857A (en) Electrolessly plated product having a polymetallic catalytic film underlayer
JP3153682B2 (ja) 回路板の製造方法
US4232060A (en) Method of preparing substrate surface for electroless plating and products produced thereby
JP5703214B2 (ja) 前表面処理として、基材へ噴霧することによって無電解にインライン金属被覆を行なう方法、及びその方法を実現する装置
US4981715A (en) Method of patterning electroless plated metal on a polymer substrate
GB1577398A (en) Method of treating a substrate surface made of plastics material prior to its subsequent metallization
JP2005022956A (ja) セラミックの金属化
JPH07506770A (ja) 多孔フォイルの製造方法
JPH07180089A (ja) 電気鍍金方法及び構成
JPH0326816B2 (enExample)
JPS61250191A (ja) コネクタ端子のブラシメツキ方法
JPH0577748B2 (enExample)
JPS6220277B2 (enExample)
JPH0534428B2 (enExample)
US20040206629A1 (en) Method for the selectively electroplating a strip-shaped, metal support material
JPH02305969A (ja) 無電解めつきの前処理方法
JP3925724B2 (ja) 非導体材料への表面処理方法
JPS6187891A (ja) 金属箔条体の片面部分メツキ方法及び装置
WO2006086407A2 (en) In situ plating and etching of materials covered with a surface film