JPS60149679A - 接着用樹脂組成物 - Google Patents

接着用樹脂組成物

Info

Publication number
JPS60149679A
JPS60149679A JP536684A JP536684A JPS60149679A JP S60149679 A JPS60149679 A JP S60149679A JP 536684 A JP536684 A JP 536684A JP 536684 A JP536684 A JP 536684A JP S60149679 A JPS60149679 A JP S60149679A
Authority
JP
Japan
Prior art keywords
acid
resin composition
resin
present
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP536684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129394B2 (enrdf_load_stackoverflow
Inventor
Tomohiko Nakao
中尾 知彦
Keiichi Uno
敬一 宇野
Riyouzou Ishinami
石浪 諒三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP536684A priority Critical patent/JPS60149679A/ja
Publication of JPS60149679A publication Critical patent/JPS60149679A/ja
Publication of JPH0129394B2 publication Critical patent/JPH0129394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
JP536684A 1984-01-14 1984-01-14 接着用樹脂組成物 Granted JPS60149679A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP536684A JPS60149679A (ja) 1984-01-14 1984-01-14 接着用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP536684A JPS60149679A (ja) 1984-01-14 1984-01-14 接着用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS60149679A true JPS60149679A (ja) 1985-08-07
JPH0129394B2 JPH0129394B2 (enrdf_load_stackoverflow) 1989-06-09

Family

ID=11609164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP536684A Granted JPS60149679A (ja) 1984-01-14 1984-01-14 接着用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS60149679A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135647A (zh) * 2018-09-05 2019-01-04 广东生益科技股份有限公司 一种无卤树脂组合物、由其制备的覆盖膜、覆铜板以及印制线路板
JP2022508986A (ja) * 2019-09-05 2022-01-20 深▲セン▼市柳▲キン▼実業股▲フン▼有限公司 絶縁接着フィルム及びその製造方法、多層プリント配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547441A (en) * 1977-06-17 1979-01-20 Nitto Electric Ind Co Ltd Adhesive composition
JPS5483985A (en) * 1977-12-19 1979-07-04 Dainippon Ink & Chem Inc Photo-setting resin composition having excellent adhesive property

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547441A (en) * 1977-06-17 1979-01-20 Nitto Electric Ind Co Ltd Adhesive composition
JPS5483985A (en) * 1977-12-19 1979-07-04 Dainippon Ink & Chem Inc Photo-setting resin composition having excellent adhesive property

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135647A (zh) * 2018-09-05 2019-01-04 广东生益科技股份有限公司 一种无卤树脂组合物、由其制备的覆盖膜、覆铜板以及印制线路板
JP2022508986A (ja) * 2019-09-05 2022-01-20 深▲セン▼市柳▲キン▼実業股▲フン▼有限公司 絶縁接着フィルム及びその製造方法、多層プリント配線板

Also Published As

Publication number Publication date
JPH0129394B2 (enrdf_load_stackoverflow) 1989-06-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term