JPH0129394B2 - - Google Patents

Info

Publication number
JPH0129394B2
JPH0129394B2 JP59005366A JP536684A JPH0129394B2 JP H0129394 B2 JPH0129394 B2 JP H0129394B2 JP 59005366 A JP59005366 A JP 59005366A JP 536684 A JP536684 A JP 536684A JP H0129394 B2 JPH0129394 B2 JP H0129394B2
Authority
JP
Japan
Prior art keywords
acid
present
weight
adhesive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59005366A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60149679A (ja
Inventor
Tomohiko Nakao
Keiichi Uno
Ryozo Ishinami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP536684A priority Critical patent/JPS60149679A/ja
Publication of JPS60149679A publication Critical patent/JPS60149679A/ja
Publication of JPH0129394B2 publication Critical patent/JPH0129394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
JP536684A 1984-01-14 1984-01-14 接着用樹脂組成物 Granted JPS60149679A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP536684A JPS60149679A (ja) 1984-01-14 1984-01-14 接着用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP536684A JPS60149679A (ja) 1984-01-14 1984-01-14 接着用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS60149679A JPS60149679A (ja) 1985-08-07
JPH0129394B2 true JPH0129394B2 (enrdf_load_stackoverflow) 1989-06-09

Family

ID=11609164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP536684A Granted JPS60149679A (ja) 1984-01-14 1984-01-14 接着用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS60149679A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135647A (zh) * 2018-09-05 2019-01-04 广东生益科技股份有限公司 一种无卤树脂组合物、由其制备的覆盖膜、覆铜板以及印制线路板
CN110591591B (zh) * 2019-09-05 2020-12-01 深圳市柳鑫实业股份有限公司 一种绝缘介质胶膜及其制备方法、多层印刷线路板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547441A (en) * 1977-06-17 1979-01-20 Nitto Electric Ind Co Ltd Adhesive composition
JPS5483985A (en) * 1977-12-19 1979-07-04 Dainippon Ink & Chem Inc Photo-setting resin composition having excellent adhesive property

Also Published As

Publication number Publication date
JPS60149679A (ja) 1985-08-07

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term