JPS60147125A - 半導体組立装置 - Google Patents

半導体組立装置

Info

Publication number
JPS60147125A
JPS60147125A JP205084A JP205084A JPS60147125A JP S60147125 A JPS60147125 A JP S60147125A JP 205084 A JP205084 A JP 205084A JP 205084 A JP205084 A JP 205084A JP S60147125 A JPS60147125 A JP S60147125A
Authority
JP
Japan
Prior art keywords
die collet
semiconductor
die
section
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP205084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570932B2 (enrdf_load_stackoverflow
Inventor
Kazuo Inoue
和夫 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP205084A priority Critical patent/JPS60147125A/ja
Publication of JPS60147125A publication Critical patent/JPS60147125A/ja
Publication of JPH0570932B2 publication Critical patent/JPH0570932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP205084A 1984-01-11 1984-01-11 半導体組立装置 Granted JPS60147125A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP205084A JPS60147125A (ja) 1984-01-11 1984-01-11 半導体組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP205084A JPS60147125A (ja) 1984-01-11 1984-01-11 半導体組立装置

Publications (2)

Publication Number Publication Date
JPS60147125A true JPS60147125A (ja) 1985-08-03
JPH0570932B2 JPH0570932B2 (enrdf_load_stackoverflow) 1993-10-06

Family

ID=11518503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP205084A Granted JPS60147125A (ja) 1984-01-11 1984-01-11 半導体組立装置

Country Status (1)

Country Link
JP (1) JPS60147125A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01291431A (ja) * 1988-05-19 1989-11-24 Sanyo Electric Co Ltd ペレットボディング装置
JPH02500151A (ja) * 1987-07-20 1990-01-18 ヒューズ・エアクラフト・カンパニー ダイ接続装置用の回転可能な採取および配置真空感知ヘッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02500151A (ja) * 1987-07-20 1990-01-18 ヒューズ・エアクラフト・カンパニー ダイ接続装置用の回転可能な採取および配置真空感知ヘッド
JPH01291431A (ja) * 1988-05-19 1989-11-24 Sanyo Electric Co Ltd ペレットボディング装置

Also Published As

Publication number Publication date
JPH0570932B2 (enrdf_load_stackoverflow) 1993-10-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term