JPS6014469A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6014469A
JPS6014469A JP58122655A JP12265583A JPS6014469A JP S6014469 A JPS6014469 A JP S6014469A JP 58122655 A JP58122655 A JP 58122655A JP 12265583 A JP12265583 A JP 12265583A JP S6014469 A JPS6014469 A JP S6014469A
Authority
JP
Japan
Prior art keywords
resin
organic resin
electrode
semiconductor device
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58122655A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0312468B2 (mo
Inventor
Michio Ogami
大上　三千男
Takayuki Wakui
和久井　陽行
Komei Yatsuno
八野　耕明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58122655A priority Critical patent/JPS6014469A/ja
Publication of JPS6014469A publication Critical patent/JPS6014469A/ja
Publication of JPH0312468B2 publication Critical patent/JPH0312468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
JP58122655A 1983-07-06 1983-07-06 半導体装置 Granted JPS6014469A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58122655A JPS6014469A (ja) 1983-07-06 1983-07-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58122655A JPS6014469A (ja) 1983-07-06 1983-07-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS6014469A true JPS6014469A (ja) 1985-01-25
JPH0312468B2 JPH0312468B2 (mo) 1991-02-20

Family

ID=14841346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58122655A Granted JPS6014469A (ja) 1983-07-06 1983-07-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS6014469A (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161347A (ja) * 1982-03-19 1983-09-24 Hitachi Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161347A (ja) * 1982-03-19 1983-09-24 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPH0312468B2 (mo) 1991-02-20

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