JPS60136140U

JPS60136140U - Semiconductor substrate backside processing equipment

Info

Publication number: JPS60136140U
Application number: JP15742183U
Authority: JP
Inventors: 中邨　明男
Original assignee: 日本電気株式会社
Priority date: 1983-10-12
Filing date: 1983-10-12
Publication date: 1985-09-10

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案が対象とする設備の搬送方式の平面図、
第２図イは従来の搬送方式の一部平面図、第２図口〜ホ
は側面図、第３図イは本考案の搬送方式の平面図、第３
図口〜りは側面図である。１・・・供給側搬送アーム、１ａ・・・真空孔、１′・
・・収納側搬送アーム、２・・・供給側搬送ベルト、２
′・・・収納側搬送ベルト、３・・・ガイド、４・・・
基板処理台、５・・・供給側治具支持台、５′・・・収
納側治具支持台、６・・・基板、６ａ・・・基板の素子
面、６ｂ・・・基板の裏面。Figure 1 is a plan view of the transportation system for the equipment targeted by this invention;
Figure 2A is a partial plan view of the conventional conveyance system, Figure 2A is a side view, Figure 3A is a plan view of the conveyance system of the present invention,
The figures are side views. 1... Supply side transfer arm, 1a... Vacuum hole, 1'.
... Storage side transport arm, 2 ... Supply side transport belt, 2
'... Storage side conveyor belt, 3... Guide, 4...
Substrate processing table, 5: supply side jig support, 5': storage side jig support, 6: substrate, 6a: element surface of substrate, 6b: back surface of substrate.

Claims

[Scope of utility model registration request]

, in an apparatus for supporting the peripheral edge of a semiconductor substrate 9 with a transfer arm, feeding the transfer arm to transfer the semiconductor substrate, processing the back side of the semiconductor substrate, and carrying out the processed semiconductor substrate, the substrate is placed on the transfer arm. What is claimed is: 1. A semiconductor substrate backside processing apparatus comprising: a vacuum suction mechanism that suctions and holds a semiconductor substrate; and an inversion mechanism that rotates the transfer arm to reverse the semiconductor substrate.