JPS60135173A - 薄膜磁気ヘツドの加工方法 - Google Patents

薄膜磁気ヘツドの加工方法

Info

Publication number
JPS60135173A
JPS60135173A JP58239934A JP23993483A JPS60135173A JP S60135173 A JPS60135173 A JP S60135173A JP 58239934 A JP58239934 A JP 58239934A JP 23993483 A JP23993483 A JP 23993483A JP S60135173 A JPS60135173 A JP S60135173A
Authority
JP
Japan
Prior art keywords
surface plate
thin film
resin
magnetic head
head block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58239934A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322949B2 (enrdf_load_stackoverflow
Inventor
Junji Watanabe
純二 渡辺
Toshiro Karaki
俊郎 唐木
Mitsuo Kajita
梶田　三夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58239934A priority Critical patent/JPS60135173A/ja
Publication of JPS60135173A publication Critical patent/JPS60135173A/ja
Publication of JPS6322949B2 publication Critical patent/JPS6322949B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Magnetic Heads (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
JP58239934A 1983-12-21 1983-12-21 薄膜磁気ヘツドの加工方法 Granted JPS60135173A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58239934A JPS60135173A (ja) 1983-12-21 1983-12-21 薄膜磁気ヘツドの加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58239934A JPS60135173A (ja) 1983-12-21 1983-12-21 薄膜磁気ヘツドの加工方法

Publications (2)

Publication Number Publication Date
JPS60135173A true JPS60135173A (ja) 1985-07-18
JPS6322949B2 JPS6322949B2 (enrdf_load_stackoverflow) 1988-05-13

Family

ID=17052000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58239934A Granted JPS60135173A (ja) 1983-12-21 1983-12-21 薄膜磁気ヘツドの加工方法

Country Status (1)

Country Link
JP (1) JPS60135173A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224572A (ja) * 1986-03-26 1987-10-02 Toshiba Corp セラミツク製品の加工方法
US5456736A (en) * 1992-04-06 1995-10-10 Hitachi, Ltd. Lap and lapping liquor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149692A (en) * 1976-06-07 1977-12-12 Kuraray Co Ltd Pad for lapping and polishing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149692A (en) * 1976-06-07 1977-12-12 Kuraray Co Ltd Pad for lapping and polishing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224572A (ja) * 1986-03-26 1987-10-02 Toshiba Corp セラミツク製品の加工方法
US5456736A (en) * 1992-04-06 1995-10-10 Hitachi, Ltd. Lap and lapping liquor

Also Published As

Publication number Publication date
JPS6322949B2 (enrdf_load_stackoverflow) 1988-05-13

Similar Documents

Publication Publication Date Title
JP2003506814A (ja) ガラス基板から構成される磁気ディスクの製造方法
US20060182504A1 (en) Method for manufacturing a doughnut-shaped glass substrate
JPH05208363A (ja) 改善型サンプル保持テーブル付き研磨装置
CN107363693B (zh) 玻璃基板和玻璃基板的制造方法
CN1103511A (zh) 精磨半导体晶片的边沿的方法
Gatzen et al. Precision machining of rigid disk head sliders
US3287862A (en) Abrasive articles and method of making abrasive articles
JPS60135173A (ja) 薄膜磁気ヘツドの加工方法
JP3499461B2 (ja) スライダの加工方法
JP5994022B2 (ja) 研削砥石、磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
JP2001191247A (ja) ディスク状基板の両面研削方法、情報記録媒体用基板の製造方法、及び情報記録媒体の製造方法
JP6645935B2 (ja) 基板の製造方法、基板端面の加工装置、基板端面の加工方法、及び研削用砥石
US3287861A (en) Abrasive articles and method of making abrasive articles
JP2016126808A (ja) 磁気ディスク用基板の製造方法、及び端面研磨処理装置
JPH10134316A (ja) 磁気ヘッドの加工方法
JP2003094318A (ja) 水晶複合板の薄板化方法
Kuriyagawa et al. Improvement of machined surface quality in ultra-precision plane honing
JPH0520826A (ja) 磁気ヘツドおよび磁気ヘツドの製造方法
WO2000039801A1 (fr) Tete et unite disque magnetiques, et procede de fonctionnement associe
JPS591163A (ja) 基板の加工法
JPH1190813A (ja) 磁気記録媒体用ガラス基板の加工装置
JPS6076957A (ja) 磁気デイスク基盤の製造方法
JPS59196160A (ja) 薄膜ヘツドの研摩方法
JP3126164B2 (ja) 磁気ヘッドスライダの加工方法
JPS62203748A (ja) 磁気デイスク基板の加工方法