JPS6012550A - 露光転写装置用マスク供給装置 - Google Patents

露光転写装置用マスク供給装置

Info

Publication number
JPS6012550A
JPS6012550A JP58120409A JP12040983A JPS6012550A JP S6012550 A JPS6012550 A JP S6012550A JP 58120409 A JP58120409 A JP 58120409A JP 12040983 A JP12040983 A JP 12040983A JP S6012550 A JPS6012550 A JP S6012550A
Authority
JP
Japan
Prior art keywords
mask
station
holder
stage
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58120409A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0311539B2 (enrdf_load_stackoverflow
Inventor
Yutaka Hayashi
豊 林
Hisao Izawa
伊沢　久男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to JP58120409A priority Critical patent/JPS6012550A/ja
Priority to US06/627,449 priority patent/US4598242A/en
Publication of JPS6012550A publication Critical patent/JPS6012550A/ja
Publication of JPH0311539B2 publication Critical patent/JPH0311539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Library & Information Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58120409A 1983-07-04 1983-07-04 露光転写装置用マスク供給装置 Granted JPS6012550A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58120409A JPS6012550A (ja) 1983-07-04 1983-07-04 露光転写装置用マスク供給装置
US06/627,449 US4598242A (en) 1983-07-04 1984-07-03 Mask feed method and apparatus for exposure replicate systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58120409A JPS6012550A (ja) 1983-07-04 1983-07-04 露光転写装置用マスク供給装置

Publications (2)

Publication Number Publication Date
JPS6012550A true JPS6012550A (ja) 1985-01-22
JPH0311539B2 JPH0311539B2 (enrdf_load_stackoverflow) 1991-02-18

Family

ID=14785502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58120409A Granted JPS6012550A (ja) 1983-07-04 1983-07-04 露光転写装置用マスク供給装置

Country Status (2)

Country Link
US (1) US4598242A (enrdf_load_stackoverflow)
JP (1) JPS6012550A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185653A (ja) * 1984-10-02 1986-05-01 Sharp Corp 光磁気メモリ素子
JP2007504683A (ja) * 2003-05-14 2007-03-01 モレキュラー・インプリンツ・インコーポレーテッド インプリント・リソグラフィ・プロセス中にテンプレートを移動させるための方法、システム、ホルダ、アセンブリ
JP2007140187A (ja) * 2005-11-18 2007-06-07 Nsk Ltd 露光装置のマスク搬送、取付方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140242A (en) * 1990-04-30 1992-08-18 International Business Machines Corporation Servo guided stage system
US7365513B1 (en) * 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5883703A (en) * 1996-02-08 1999-03-16 Megapanel Corporation Methods and apparatus for detecting and compensating for focus errors in a photolithography tool
US6211942B1 (en) * 2000-03-10 2001-04-03 Howa Machinery Ltd. Double-sided exposure system
US6814096B2 (en) * 2000-12-15 2004-11-09 Nor-Cal Products, Inc. Pressure controller and method
KR100461024B1 (ko) * 2002-04-15 2004-12-13 주식회사 이오테크닉스 칩 스케일 마커 및 마킹 방법
US7286735B1 (en) * 2003-01-09 2007-10-23 Finisar Corporation Multi-axis optical device alignment apparatus
EP1500980A1 (en) * 2003-07-22 2005-01-26 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
TWI245170B (en) 2003-07-22 2005-12-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
US4203064A (en) * 1977-04-05 1980-05-13 Tokyo Shibaura Electric Co., Ltd. Method for automatically controlling the position of small objects
US4191916A (en) * 1977-11-23 1980-03-04 Fujitsu Limited Table positioning system including optical reference position measuring transducer
US4425537A (en) * 1978-06-26 1984-01-10 Optimetrix Corporation X-Y Addressable workpiece positioner and mask aligner using same
DE2905636C2 (de) * 1979-02-14 1985-06-20 Censor Patent- Und Versuchs-Anstalt, Vaduz Verfahren zum Kopieren von Masken auf ein Werkstück
US4442388A (en) * 1980-04-02 1984-04-10 Optimetrix Corporation X-Y Addressable workpiece positioner having an improved X-Y address indicia sensor
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
US4466073A (en) * 1982-04-26 1984-08-14 The Perkin Elmer Corporation Wafer prealigner using pulsed vacuum spinners

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185653A (ja) * 1984-10-02 1986-05-01 Sharp Corp 光磁気メモリ素子
JP2007504683A (ja) * 2003-05-14 2007-03-01 モレキュラー・インプリンツ・インコーポレーテッド インプリント・リソグラフィ・プロセス中にテンプレートを移動させるための方法、システム、ホルダ、アセンブリ
JP2007140187A (ja) * 2005-11-18 2007-06-07 Nsk Ltd 露光装置のマスク搬送、取付方法

Also Published As

Publication number Publication date
US4598242A (en) 1986-07-01
JPH0311539B2 (enrdf_load_stackoverflow) 1991-02-18

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