JPS60124825A - 薄膜デバイスの平担化方法 - Google Patents

薄膜デバイスの平担化方法

Info

Publication number
JPS60124825A
JPS60124825A JP23149783A JP23149783A JPS60124825A JP S60124825 A JPS60124825 A JP S60124825A JP 23149783 A JP23149783 A JP 23149783A JP 23149783 A JP23149783 A JP 23149783A JP S60124825 A JPS60124825 A JP S60124825A
Authority
JP
Japan
Prior art keywords
thin film
film device
particles
planarization
flattening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23149783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0562459B2 (cg-RX-API-DMAC7.html
Inventor
Yasuhiro Nagai
靖浩 永井
Keiichi Yanagisawa
佳一 柳沢
Tomoyuki Toshima
戸島　知之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP23149783A priority Critical patent/JPS60124825A/ja
Publication of JPS60124825A publication Critical patent/JPS60124825A/ja
Publication of JPH0562459B2 publication Critical patent/JPH0562459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP23149783A 1983-12-09 1983-12-09 薄膜デバイスの平担化方法 Granted JPS60124825A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23149783A JPS60124825A (ja) 1983-12-09 1983-12-09 薄膜デバイスの平担化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23149783A JPS60124825A (ja) 1983-12-09 1983-12-09 薄膜デバイスの平担化方法

Publications (2)

Publication Number Publication Date
JPS60124825A true JPS60124825A (ja) 1985-07-03
JPH0562459B2 JPH0562459B2 (cg-RX-API-DMAC7.html) 1993-09-08

Family

ID=16924413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23149783A Granted JPS60124825A (ja) 1983-12-09 1983-12-09 薄膜デバイスの平担化方法

Country Status (1)

Country Link
JP (1) JPS60124825A (cg-RX-API-DMAC7.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5882536A (ja) * 1981-11-10 1983-05-18 Fujitsu Ltd 半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5882536A (ja) * 1981-11-10 1983-05-18 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0562459B2 (cg-RX-API-DMAC7.html) 1993-09-08

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