JPS60120525A - 反応性イオンエツチング方法 - Google Patents
反応性イオンエツチング方法Info
- Publication number
- JPS60120525A JPS60120525A JP22864583A JP22864583A JPS60120525A JP S60120525 A JPS60120525 A JP S60120525A JP 22864583 A JP22864583 A JP 22864583A JP 22864583 A JP22864583 A JP 22864583A JP S60120525 A JPS60120525 A JP S60120525A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- gas
- sample
- reactive
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22864583A JPS60120525A (ja) | 1983-12-02 | 1983-12-02 | 反応性イオンエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22864583A JPS60120525A (ja) | 1983-12-02 | 1983-12-02 | 反応性イオンエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60120525A true JPS60120525A (ja) | 1985-06-28 |
| JPH0458176B2 JPH0458176B2 (OSRAM) | 1992-09-16 |
Family
ID=16879581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22864583A Granted JPS60120525A (ja) | 1983-12-02 | 1983-12-02 | 反応性イオンエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60120525A (OSRAM) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4734158A (en) * | 1987-03-16 | 1988-03-29 | Hughes Aircraft Company | Molecular beam etching system and method |
| JPH0328365A (ja) * | 1989-03-20 | 1991-02-06 | Hitachi Ltd | 金属/有機高分子合成樹脂複合体及びその製造方法 |
| US5003152A (en) * | 1987-04-27 | 1991-03-26 | Nippon Telegraph And Telephone Corporation | Microwave transforming method and plasma processing |
| US5024716A (en) * | 1988-01-20 | 1991-06-18 | Canon Kabushiki Kaisha | Plasma processing apparatus for etching, ashing and film-formation |
| JPH077003A (ja) * | 1994-01-31 | 1995-01-10 | Semiconductor Energy Lab Co Ltd | 処理方法 |
| US5468341A (en) * | 1993-12-28 | 1995-11-21 | Nec Corporation | Plasma-etching method and apparatus therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5193280A (OSRAM) * | 1975-02-14 | 1976-08-16 | ||
| JPS56155535A (en) * | 1980-05-02 | 1981-12-01 | Nippon Telegr & Teleph Corp <Ntt> | Film forming device utilizing plasma |
-
1983
- 1983-12-02 JP JP22864583A patent/JPS60120525A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5193280A (OSRAM) * | 1975-02-14 | 1976-08-16 | ||
| JPS56155535A (en) * | 1980-05-02 | 1981-12-01 | Nippon Telegr & Teleph Corp <Ntt> | Film forming device utilizing plasma |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4734158A (en) * | 1987-03-16 | 1988-03-29 | Hughes Aircraft Company | Molecular beam etching system and method |
| US5003152A (en) * | 1987-04-27 | 1991-03-26 | Nippon Telegraph And Telephone Corporation | Microwave transforming method and plasma processing |
| US5024716A (en) * | 1988-01-20 | 1991-06-18 | Canon Kabushiki Kaisha | Plasma processing apparatus for etching, ashing and film-formation |
| US5034086A (en) * | 1988-01-20 | 1991-07-23 | Canon Kabushiki Kaisha | Plasma processing apparatus for etching, ashing and film-formation |
| JPH0328365A (ja) * | 1989-03-20 | 1991-02-06 | Hitachi Ltd | 金属/有機高分子合成樹脂複合体及びその製造方法 |
| US5468341A (en) * | 1993-12-28 | 1995-11-21 | Nec Corporation | Plasma-etching method and apparatus therefor |
| JPH077003A (ja) * | 1994-01-31 | 1995-01-10 | Semiconductor Energy Lab Co Ltd | 処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0458176B2 (OSRAM) | 1992-09-16 |
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