JPS6011646Y2 - フラツトパツケ−ジ - Google Patents

フラツトパツケ−ジ

Info

Publication number
JPS6011646Y2
JPS6011646Y2 JP1926879U JP1926879U JPS6011646Y2 JP S6011646 Y2 JPS6011646 Y2 JP S6011646Y2 JP 1926879 U JP1926879 U JP 1926879U JP 1926879 U JP1926879 U JP 1926879U JP S6011646 Y2 JPS6011646 Y2 JP S6011646Y2
Authority
JP
Japan
Prior art keywords
flat package
housing
electrodes
package
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1926879U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55120159U (enExample
Inventor
亨 真庭
啓介 真島
Original Assignee
日本電子機器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電子機器株式会社 filed Critical 日本電子機器株式会社
Priority to JP1926879U priority Critical patent/JPS6011646Y2/ja
Publication of JPS55120159U publication Critical patent/JPS55120159U/ja
Application granted granted Critical
Publication of JPS6011646Y2 publication Critical patent/JPS6011646Y2/ja
Expired legal-status Critical Current

Links

JP1926879U 1979-02-17 1979-02-17 フラツトパツケ−ジ Expired JPS6011646Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1926879U JPS6011646Y2 (ja) 1979-02-17 1979-02-17 フラツトパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1926879U JPS6011646Y2 (ja) 1979-02-17 1979-02-17 フラツトパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS55120159U JPS55120159U (enExample) 1980-08-26
JPS6011646Y2 true JPS6011646Y2 (ja) 1985-04-17

Family

ID=28848059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1926879U Expired JPS6011646Y2 (ja) 1979-02-17 1979-02-17 フラツトパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6011646Y2 (enExample)

Also Published As

Publication number Publication date
JPS55120159U (enExample) 1980-08-26

Similar Documents

Publication Publication Date Title
US3885304A (en) Electric circuit arrangement and method of making the same
JPH05109975A (ja) 樹脂封止型半導体装置
US3919602A (en) Electric circuit arrangement and method of making the same
US9508677B2 (en) Chip package assembly and manufacturing method thereof
JPH0319703B2 (enExample)
KR100226335B1 (ko) 플라스틱 성형회로 패키지
JP3138539B2 (ja) 半導体装置及びcob基板
JPS6011646Y2 (ja) フラツトパツケ−ジ
JPS6227544B2 (enExample)
JPS59107551A (ja) 半導体装置
JPH0219635B2 (enExample)
JP2524482B2 (ja) Qfp構造半導体装置
JPS5914894B2 (ja) セラミツクパツケ−ジ
JP2553665B2 (ja) 半導体装置
JPH04269841A (ja) 半導体装置
JP2947468B2 (ja) 複合電子回路装置
JP2725719B2 (ja) 電子部品及びその製造方法
JPH0458189B2 (enExample)
JPH01318259A (ja) 混成集積回路装置
JPH0519974Y2 (enExample)
JPS6339732Y2 (enExample)
JPH0463543B2 (enExample)
JPH0119395Y2 (enExample)
KR100743319B1 (ko) 표면 실장형 반도체 장치 및 그 제조 방법
JPS6245159A (ja) 半導体装置