JPS60113985A - プリント基板の製造方法 - Google Patents
プリント基板の製造方法Info
- Publication number
- JPS60113985A JPS60113985A JP22237983A JP22237983A JPS60113985A JP S60113985 A JPS60113985 A JP S60113985A JP 22237983 A JP22237983 A JP 22237983A JP 22237983 A JP22237983 A JP 22237983A JP S60113985 A JPS60113985 A JP S60113985A
- Authority
- JP
- Japan
- Prior art keywords
- carbon
- diamond
- substrate
- graphite plate
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 29
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 229910002804 graphite Inorganic materials 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Landscapes
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Carbon And Carbon Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22237983A JPS60113985A (ja) | 1983-11-25 | 1983-11-25 | プリント基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22237983A JPS60113985A (ja) | 1983-11-25 | 1983-11-25 | プリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113985A true JPS60113985A (ja) | 1985-06-20 |
| JPH0312788B2 JPH0312788B2 (cg-RX-API-DMAC7.html) | 1991-02-21 |
Family
ID=16781430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22237983A Granted JPS60113985A (ja) | 1983-11-25 | 1983-11-25 | プリント基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113985A (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS638284A (ja) * | 1986-06-25 | 1988-01-14 | 松下電工株式会社 | 高熱伝導性基板 |
| EP0520243A3 (en) * | 1991-06-24 | 1993-03-10 | Siemens Aktiengesellschaft | Metal core circuit board |
| EP0619282A3 (en) * | 1993-04-07 | 1995-02-15 | Applied Sciences Inc | Diamond / carbon / carbon composite usable as an integral dielectric heat sink and process for its manufacture. |
-
1983
- 1983-11-25 JP JP22237983A patent/JPS60113985A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS638284A (ja) * | 1986-06-25 | 1988-01-14 | 松下電工株式会社 | 高熱伝導性基板 |
| EP0520243A3 (en) * | 1991-06-24 | 1993-03-10 | Siemens Aktiengesellschaft | Metal core circuit board |
| EP0619282A3 (en) * | 1993-04-07 | 1995-02-15 | Applied Sciences Inc | Diamond / carbon / carbon composite usable as an integral dielectric heat sink and process for its manufacture. |
| US5604037A (en) * | 1993-04-07 | 1997-02-18 | Applied Sciences, Inc. | Diamond/carbon/carbon composite useful as an integral dielectric heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312788B2 (cg-RX-API-DMAC7.html) | 1991-02-21 |
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